Details, datasheet, quote on part number: AAT8303
CategoryDiscrete => Transistors => FETs (Field Effect Transistors) => MOSFETs => Power MOSFETs
Description20V P-channel Power MOSFET
CompanyAnadigics, Inc.
DatasheetDownload AAT8303 datasheet
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Features, Applications

The is a low threshold P Channel MOSFET designed for the battery, cell phone, and PDA markets. Using AnalogicTechTM's proprietary ultrahigh density Trench technology, and space saving small outline J-lead package, performance superior to that normally found in a larger footprint has been squeezed into the area a TSOP6 package.

Battery Packs Cellular & Cordless Telephones Battery-powered portable equipment Load Switches
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current @ TJ=150C
Pulsed Drain Current 2 Continuous Source Current (Source-Drain Diode) Maximum Power Dissipation
Junction-to-Ambient steady state Junction-to-Ambient t<5 seconds Junction-to-Foot 1
Symbol Description (TJ=25C unless otherwise noted) Conditions Min

DC Characteristics BVDSS Drain-Source Breakdown Voltage VGS=-4.5V, ID=-10A RDS(ON) Drain-Source ON-Resistance VGS=-2.5V, ID=-7.6A ID(ON) On-State Drain Current VGS=-4.5V, VDS=-5V (Pulsed) VGS(th) Gate Threshold Voltage VGS=VDS, ID=-250A IGSS Gate-Body Leakage Current VGS=0V, VDS=-20V IDSS Drain Source Leakage Current TJ=70C 3 gfs Forward Transconductance VDS=-5V, ID=-10A Dynamic Characteristics 3 QG Total Gate Charge RD=1.0, VGS=-4.5V QGS Gate-Source Charge RD=1.0, VGS=-4.5V QGD Gate-Drain Charge RD=1.0, VGS=-4.5V tD(ON) Turn-ON Delay RD=1.0, tR Turn-ON Rise Time VGS=-4.5V, RD=1.0, tD(OFF) Turn-OFF Delay RD=1.0, tF Turn-OFF Fall Time VGS=-4.5V, RD=1.0, Source-Drain Diode Characteristics VSD Source-Drain Forward Voltage IS=-10A IS Continuous Diode Current 1

Note 1: Based on thermal dissipation from junction to ambient while mounted x 1" PCB with optimized layout. A 5 second pulse x 1" PCB approximates testing a device mounted on a large multi-layer PCB as in most applications. RJF + RFA = RJA where the foot thermal reference is defined as the normal solder mounting surface of the device's leads. RJF is guaranteed by design, however RCA is determined by the PCB design. Actual maximum continuous current is limited by the application's design. Note 2: Pulse test: Pulse Width 300 s Note 3: Guaranteed by design. Not subject to production testing.


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