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Details, datasheet, quote on part number: PMEG3015EV
 
 
Part numberPMEG3015EV
CategoryDiscrete => Diodes & Rectifiers => Schottky Barrier Rectifiers
Description30 V, 1.5 A ultra low Vf MEGA Schottky barrier rectifier in SOT666 package

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in an ultra small SMD SOT666 plastic package.



Features
Forward current: 1.5 A
Reverse voltage: 30 V
Ultra low forward voltage
Ultra small SMD packages



Applications
Low voltage rectification
High efficiency DC-to-DC conversion
Voltage clamping
Inverse polarity protection
Low power consumption applications
CompanyPhilips Semiconductors (Acquired by NXP)
DatasheetDownload PMEG3015EV datasheet
Request For QuoteFind where to buy PMEG3015EV
 


 
Specifications, Features, Applications
1.5 A ultra low VF MEGA Schottky barrier rectifier in SOT666 package

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in an ultra small SMD SOT666 plastic package.

Forward current: 1.5 A Reverse voltage: 30 V Ultra low forward voltage Ultra small SMD packages

Low voltage rectification High efficiency DC-to-DC conversion Voltage clamping Inverse polarity protection Low power consumption applications

Quick reference data Parameter forward current reverse voltage forward voltage 1.5 A
Table 2: Pin Pinning Description cathode anode cathode

Table 3: Ordering information Package Name PMEG3015EV Description plastic surface mounted package; 6 leads Version SOT666 Type number

Table 4: Marking codes Marking code 1A Type number PMEG3015EV
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VR IF IFRM IFSM Ptot Tj Tamb Tstg

reverse voltage forward current repetitive peak forward current non-repetitive peak forward current total power dissipation junction temperature ambient temperature storage temperature

Device mounted an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Device mounted an FR4 PCB, single-sided copper, tin-plated and mounting pad for cathode 1 cm2.

Table 6: Symbol Rth(j-a) Thermal characteristics Parameter Conditions
thermal resistance from junction in free air to ambient
thermal resistance from junction to solder point

For Schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. Nomograms for determining the reverse power losses PR and IF(AV) rating will be available on request. Reflow soldering is the only recommended soldering method. Device mounted an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted an FR4 PCB, single-sided copper, tin-plated and mounting pad for cathode 1 cm2.




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