Details, datasheet, quote on part number: NCP3230MNTXG
PartNCP3230MNTXG
Category
TitleIC REG BUCK ADJ 30A 40QFN
Description

ON Semiconductor's NCP3230 is a 500 kHz, high efficiency, high current, PWM, synchronous buck converter. It operates with a single supply voltage from 4.5 V to 18 V and can provide output current as high as 30 A. NCP3230 utilizes voltage mode with voltage feed-forward control to respond instantly to VIN changes and provide for easier compensation over the supply range of the converter. The device also includes pre-bias startup capability to allow monotonic startup in the event of a pre-biased output condition. Protection features include overcurrent protection (OCP), output overvoltage protection (OVP), undervoltage protection (UVP), and power good. The enable function is highly programmable to allow for adjustable startup voltages at higher input voltages. There is also an adjustable soft-start, an over-temperature comparator, and internal thermal shutdown.



CompanyON Semiconductor
DatasheetDownload NCP3230MNTXG datasheet
  
NCP3230MNTXG photo

 

Features, Applications

The is a high current, high efficiency, voltage-feed- forward voltage-mode synchronous buck converter which operates from 18 V input and generates output voltages down 30 A load.

Wide Input Voltage Range from 0.6 V Internal Reference Voltage 500 kHz Switching Frequency External Programmable Soft-start Lossless Low-side FET Current Sensing Output Over-voltage Protection and Under-voltage Protection System Over-temperature Protection using a Thermistor or Sensor Hiccup Mode Operation for All Faults Pre-bias Start-up Adjustable Output Voltage Power Good Output Internal Over-temperature Protection This is a Pb-Free Device

= Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package
Typical Applications

Cellular Base Stations ASIC, FPGA, DSP and CPU Core and I/O Supplies Telecom and Network Equipment Server and Storage System

Device NCP3230MNTXG Package QFN-40 (Pb-Free) Shipping 2500 / Tape & Reel

For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.

UVLO OVP, UVP Power Good OCP, TSD Protection

Pin No. 29-34, EP43 Symbol SS FB COMP ISET AGND OTS PG VIN VSWH PGND VSW BST VB VCC EN Description A capacitor from this pin to GND allows the user to adjust the soft-start ramp time. Output voltage feedback. Output of the error amplifier. A resistor from this pin to ground sets the over-current protection (OCP) threshold. Analog ground. Negative input of internal thermal comparator. Tie this pin to ground if not in use. Power good indicator of the output voltage. Open-drain output. Connect PG to VDD with an external resistor. The VIN pin is connected to the internal power NMOS switch. The VIN pin has high di/dt edges and must be decoupled to ground close to the pin of the device. The VSWH pin is the connection of the drain and source of the internal NMOS switches. At switch off, the inductor will drive this pin below ground as the body diode and the NMOS conducts with a high dv/dt. Ground reference and high-current return path for the bottom gate driver and low- side NMOS. IC connection to the switch node between the top MOSFET and bottom MOSFET. Return path of the high- side gate driver. Top gate driver input supply, a bootstrap capacitor connection between the switch node and this pin. The internal LDO output and input supply for the NCP3230. Connect a minimum 4.7 mF ceramic capacitor from this pin to ground. Input Supply for IC. This pin must be connected to VIN. Decouple the VCC pin close to ground near the pin of the device. Logic control for enabling the switcher. An internal pull-up enables the device automatically. The EN pin can also be driven high to turn on the device, or low to turn off the device. A comparator and precision reference allow the user to implement this pin as an adjustable UVLO circuit. Exposed Pad. Connect GND to a large copper plane at ground potential to improve thermal dissipation.


 

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