|Title||TVS DIODE 160A 28VC UDFN6|
|Datasheet||Download SP1255-01UTG datasheet
|Others parts numbering|
|SP1555-01UTG: TVS DIODE 120A UDFN6|
Surge Protection -ESD SP1255 Low Capacitance and Series Surge Protection - SP1255P Series
The SP1255 integrates a 13.5V TVS diode to provide lightning surge protection for the USB VBUS pin 160A (tP=8/20s) per the IEC 61000- 4-5 standard. The SP1255 provides superior protection for current intensive applications such as fast charging peripherals. The SP1255 comes in a space saving 2.0x1.8mm DFN package with a typical height of 0.55mm making it an ideal solution for smart phones, tablets, and other portable electronics.
Features ESD, IEC 61000-4-2, ±30kV contact, ±30kV air EFT, IEC 80A (tP=5/50ns) Surge, IEC 61000-4-5 2nd edition, 160A (tP=8/20s) Benchmark setting protection High current handling capability for fast charging applications Halogen free, Lead free and RoHS compliantApplications Protection for the VBUS circuit on USB2.0 Fast Charging
Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 07/27/16 SP1255P SeriesSurge Protection - ESD SP1255 Low Capacitance and Series Surge Protection - SP1255P Series
Symbol IPP (Pin 1) TOP TSTOR Parameter Peak Current (tp=8/20s) Operating Temperature Storage Temperature Value to 150 Units A °C
Parameter USB VBUS (Pin 1) Reverse Standoff Voltage Reverse Breakdown Voltage Reverse Leakage Current Forward Voltage VRWM VBR ILEAK VF Pin 1 to GND IT=1mA, Pin 1 to GND VR=13.5V, Pin 1 to GND IF=10mA, GND to Pin IPP=30A, tp=8/20µs, Fwd Clamp IPP=100A, tp=8/20µs, Fwd IPP=135A, tp=8/20µs, Fwd IPP=160A, tp=8/20µs, Fwd ESD Withstand Voltage1 Diode CapacitanceNote: 1 Parameter is guaranteed by design and/or device characterization.
Clamping Voltage vs. Peak Pulse Current (Pin1 to GND)
Non-Repetitive Peak Pulse Power vs. Pulse Duration (Pin1 to GND)
©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 07/27/16 SP1255P Series
CAUTION: Stresses at or above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Also due to variations in test equipment stresses shown above are averages.Surge Protection SP1255 SeriesProtection - SP1255P Series Low Capacitance ESD and Surge
Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) Pb Free assembly
Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceedLead Plating Pre-Plated Frame Copper Alloy 0.004 inches(0.102mm) Silicon Molded Epoxy 94 V-0
TVS Diode Arrays (SPA® Diodes) Series Number of Channels
Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13.Product Series = SP1255 Number of Channels Assembly Site
Part Number Package Marking Min. Order Qty.
©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 07/27/16
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