Details, datasheet, quote on part number: 82535IVCQSPL04N
Part82535IVCQSPL04N
Category
TitleVideo IC Development Tools Intel RealSense Development Kit Featuring the SR300
Description
CompanyIntel Corporation
DatasheetDownload 82535IVCQSPL04N datasheet
  
82535IVCQSPL04N photo

Others parts numbering
82535IVCHVM: Video Modules Intel RealSense Camera SR300

 

Features, Applications
Embedded Coded Light 3D Imaging System with Full High Definition Color Camera
Product Datasheet Intel Production Part Numbers: MM#943228, H89061-XXX
(X) Numeric characters representing configuration or programmed firmware at manufacturing

No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade. This document contains information on products, services and/or processes in development. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest forecast, schedule, specifications and roadmaps. The products and services described may contain defects or errors known as errata which may cause deviations from published specifications. Current characterized errata are available on request. Copies of documents which have an order number and are referenced in this document may be obtained by calling or by visiting www.intel.com/design/literature.htm. Intel, the Intel logo, Intel RealSense are trademarks of Intel Corporation in the U.S. and/or other countries. *Other names and brands may be claimed as the property of others Copyright © 2016, Intel Corporation. All rights reserved.

1 2 Description and Features....................................................................................9 Overview....................................................................................................... Components........................................................................................ 10 Storage and Operating Conditions........................................................... 11 Handling Conditions.............................................................................. 11

Component Specification.................................................................................. 12 Functional Specification................................................................................... 13 4.1 Embedded 3D Imaging System.............................................................. 13 4.1.1 Depth Video Data Capture Flow................................................. 14 4.1.2 Infrared Video Data Capture Flow.............................................. 14 Camera Video Stream Formats............................................................... 15 Camera Video Stream Modes................................................................. 16 Update............................................................................................... 17 5.1.1 Update Limits......................................................................... 17 Recovery............................................................................................. 17 Depth Camera Functions....................................................................... 18 6.1.1 Projector Power Settings.......................................................... 19 6.1.2 Filter Option Settings............................................................... 19 6.1.3 Preset Settings....................................................................... 19 6.1.4 Auto Range (AR)..................................................................... 20 Color Camera Functions........................................................................ 21 6.2.1 Standard Functions.................................................................. 21 6.2.2 Extended Functions................................................................. 21 Control Persistence............................................................................... 22 Privacy............................................................................................... 22 USB Composite Device.......................................................................... 24 7.1.1 Device Endpoints..................................................................... 24 7.1.2 System Endpoints................................................................... 24 7.1.3 Typical Power Consumption...................................................... 25 Infrared Projector Interference............................................................... 25 Placement........................................................................................... 26 Grounding........................................................................................... 27 8.2.1 Motherboard Receptacle........................................................... 27 Attachment and Alignment.................................................................... 28 System Through-Holes.......................................................................... 28 8.4.1 Cover Material Transmission..................................................... 29 Thermals............................................................................................. 29


 

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