Details, datasheet, quote on part number: MAX14775EASA+
TitleIC TXRX RS485/422 20MBPS 8SOIC
CompanyMaxim Integrated Products
DatasheetDownload MAX14775EASA+ datasheet
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Features, Applications

The MAX14775E/MAX14776E fault-protected RS-485/ RS-422 transceivers feature 65V protection for overvoltage signal faults on communication bus lines, ensuring communication in harsh industrial environments. Each device contains one driver and one receiver and operates over the to 5.5V supply range. The MAX14775E is optimized for high-speed data rates to 20Mbps. The MAX14776E features slew-rate limited outputs for data rates to 500kbps. These transceivers are optimized for robust communication in noisy environments. A large 200mV (typ) hysteresis on receiver inputs ensure for high noise rejection and a failsafe feature guarantees a logic-high on the receiver output when the inputs are open or shorted. Driver outputs are protected against short-circuit conditions. The MAX14775E/MAX14776E receivers feature a 1/3unit load input impedance, allowing to 100 transceivers on a bus. The MAX14775E/MAX14776E are available in 8-pin SOIC and 8-pin TDFN-EP packages and operate over the to +125C temperature range.

Integrated Protection Ensures for Robust Communication 65V Fault Protection Range on Driver Outputs/ Receiver Inputs 25V Common Mode Range on the Receiver Inputs Large Receiver Hysteresis Increases Noise Tolerance Hot-Swap Protection Thermal Shutdown High-Performance Transceiver Enables Flexible Designs Compliant with RS-485 EIA/TIA-485 Standard (MAX14775E)/500kbps (MAX14776E) Maximum Data Rate to 5.5V Supply Range to 100 Devices on the Bus Industrial Field Bus Networks Motion Controllers HVAC



(All voltages referenced to GND) RO.............................................................-0.3V to (VCC + 0.3V) DE, DI, A, B (IMAX to +70V Short-Circuit Duration (RO, A, B)...............................Continuous Continuous Power Dissipation (TA +70C) 8-pin SOIC (derate 7.60mW/C above +70C).........606.1mW 8-pin TDFN (derate 24.4mW/C above +70C).......1951.2mW Operating Temperature Range.......................... to +125C Junction Temperature.......................................................+150C Storage Temperature Range............................. to +150C Lead Temperature (soldering, 10s).................................. +300C Soldering Temperature (reflow)........................................ +260C

Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

SOIC Junction-to-Ambient Thermal Resistance (JA)........132C/W Junction-to-Case Thermal Resistance (JC)..............38C/W TDFN Junction-to-Ambient Thermal Resistance (JA)..........41C/W Junction-to-Case Thermal Resistance (JC)................8C/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to

(VCC TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and = +25C.) (Note 2) PARAMETER POWER Supply Voltage Supply Current Shutdown Supply Current Shutdown Short-Circuit Supply Current DRIVER Differential Driver Output Change in Magnitude of Differential Driver Output Voltage Driver Common-Mode Output Voltage Change in Magnitude of Common-Mode Voltage Single-Ended Driver Output Voltage High Single-Ended Driver Output Voltage Low Driver Short-Circuit Output Current VCC ICC ISH ISHDN_SHRT DE = high, RE = low, no load, no switching DE = high, RE = low or B shorted DE = high, RE = low = 54, Figure = 100, Figure or 54, Figure 1a (Note or 54, Figure or 54, Figure 1a (Note 3) A and B outputs, output is high, ISOURCE 3mA A and B outputs, output is low, ISINK 0V or VCC VB +65V (Note -0.2 VCC-0.2 VCC/ mA A SYMBOL CONDITIONS MIN TYP MAX UNITS

(VCC TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and = +25C.) (Note 2) PARAMETER Average Driver Short-Circuit Output Current RECEIVER Input Current (A, B) Receiver Input Resistance Common Mode Voltage Range Receiver Differential Threshold Voltage Rising Receiver Differential Threshold Voltage Falling Receiver Input Hysteresis Differential Input Fail-safe Threshold Differential Input Capacitance LOGIC OUTPUTS (RO) RO Output Logic High Voltage RO Output Logic Low Voltage RO Leakage Current RO Short-Circuit Current LOGIC INPUTS (DE, DI, RE) Input Logic High Voltage Input Logic Low Voltage Input Hysteresis Input Leakage Current Input Impedance on First Transition PROTECTION Thermal-Shutdown Threshold Thermal-Shutdown Hysteresis ESD Protection (A, B Pins to GND) ESD Protection (All Other Pins) Fault Protection Range (A, B Pins to GND) TSHDN THYST Human Body Model IEC 61000-4-2- Contact Discharge Human Body Model -65 Temperature rising kV V VOH VOL IOZR IOSR VIH VIL VHYS IIN RIN_FT DE, RE ISOURCE = 3mA, (VA - VB) +200mV VCC-0.4 ISINK = 3mA, (VA - VB) RE = high, 0V VRO VCC 0V VRO VCC 0.67 x VCC A mA IA, IB RIN VCM VTHH VTHL VTH VTH_FSH CA,B DE = low, 0V VCC 5.5V -7V VCM +12V -25V VCM +25V -25V VCM +25V VCM = 0V, time from last transition < tD_FS 25V VCM +25V, time from last transition > tD_FS Measured between A and -40 50 VCM = +12V VCM mV pF SYMBOL IOSD2 CONDITIONS or VB VCC MIN TYP MAX 250 UNITS mA


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