Details, datasheet, quote on part number: F2970NCGK
PartF2970NCGK
Category
TitleRF Switch ICs F2970, 75 ohm, SPDTA RF Switch
Description

IDT RF Switch ICs are offered in SPST, SP2T/SPDT, SP4T, and SP5T designs featuring Kz constant impedance technology, very low insertion loss, and high input IP3 performance. These high-isolation RF Switches deliver a wide frequency bandwidth and an extended operating temperature range for high-reliability applications. IDT RF Switches utilize advanced RF silicon semiconductor technology which offers advantages over other technologies such as GaAs. These devices offer high electrostatic discharge (ESD) immunity and MSL1 moisture sensitivity level performance. Features Kz Constant Impedance TechnologyKz provides near-constant impedance when switching RF ports Very low insertion loss: <0.5dB at 2GHz typical High input IP3 performance: 65dB up to 2GHz Wide frequency bandwidth Extended temperature range Compact QFN package Support for both 50 and 75 Applications Base Station 2G, 3G, 4G Portable Wireless Repeaters and E911 systems Digital Pre-Distortion Public Safety Infrastructure WIMAX Receivers and Transmitters Military Systems, JTRS radios RFID handheld and portable readers Cable Infrastructure Wireless LAN Test / ATE Equipment CATV/Broadband Applications CATV Test Equipment



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F2914NBGK8
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Features, Applications

Description

The is a high reliability, low insertion loss, 75 absorptive SP2T RF switch designed for a multitude of cable systems and other RF applications. This device covers a broad frequency range from 5 MHz to 3000 MHz. In addition to providing low insertion loss, the F2970 also delivers excellent linearity and isolation performance while providing a 75 termination for the unselected port. The F2970 uses a single positive supply voltage and supports 3.3 V logic.

Features

Low Insertion Loss: @ 1200 MHz High Isolation: @ 1200 MHz (RF1/RF2 to RFC) Excellent Linearity: of 63 dBm Selectable Logic Control Operating Temperature: mm 20-pin LQFN package

The F2970 provides broadband RF performance to support the CATV market along with high power handling, and high isolation. Low Insertion Loss High Isolation Excellent Linearity Extended Temperature: +105 °C

Typical Applications

CATV/Broadband Applications Headend Fiber/HFC Distribution Nodes Distribution Amplifiers Switch Matrix DTV Tuner Input Select DVR/PVR/Set-top box CATV Test Equipment

Description Ground these pins as close to the device as possible. RF1 Port. Matched to 75 ohms. If this pin is not 0V DC, then an external coupling capacitor must be used. RFC Port. Matched to 75 ohms. If this pin is not 0V DC, then an external coupling capacitor must be used. RF2 Port. Matched to 75 ohms. If this pin is not 0V DC, then an external coupling capacitor must be used. Control pin to set switch state. See Table 8. Control pin to set switch state. See Table 8. Power Supply. Bypass to GND with capacitors shown in the Typical Application Circuit as close as possible to pin. Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple ground vias are also required to achieve the specified RF performance.

Stresses beyond those listed below may cause permanent damage to the device. Functional operation of the device at these or any other conditions beyond those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Parameter VDD to GND C2 to GND RF1, RF2, RFC to GND as an input (Connected to RFC) RFC as an input (Connected as an input (Terminated states)

Maximum Junction Temperature Storage Temperature Range Lead Temperature (soldering, 10s) ElectroStatic Discharge ­ HBM (JEDEC/ESDA JS-001-2012) ElectroStatic Discharge ­ CDM (JEDEC 22-C101F) a. Levels based on: VDD V, 5 MHz


 

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