Details, datasheet, quote on part number: OM13090
CategoryEmbedded Solutions => Engineering Tools => Embedded Development Tools => Embedded Processor Development Kits => Development Boards & Kits - ARM => 8830900
TitleDevelopment Boards & Kits - ARM LPC54114 Audio Voice Recognition Kit
CompanyNXP Semiconductors
DatasheetDownload OM13090 datasheet
Product CategoryDevelopment Boards & Kits - ARM
ProductDevelopment Boards
Tool Is For Evaluation OfLPC54114
CoreARM Cortex M0+, ARM Cortex M4
BrandNXP Semiconductors
Data Bus Width32 bit
Description/FunctionLPC54114 audio and voice recognition kit
For Use WithIAR EWARM, Keil uVision, LPCXpresso IDE
Interface TypeI2C, SPI, UART, USB
Operating Supply Voltage1.8 V/3.3 V
Factory Pack Quantity1
OM13090 photo


Features, Applications

Document information Info Content Keywords Abstract LPC54110, LPC5411x, Voice LPC54114 audio and voice recognition kit User Manual

Description Applied the updated user manual template. Initial version.

UM10974 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.

The LPC54114 audio and voice recognition kit ("The Kit") combines the LPC54114 MCU with an OLED display, digital microphone and audio CODEC in a two board set, complemented by a software framework optimized for always-on sensing applications. The hardware consists an LPCXpresso54114 board and Shield Board (Mic/Audio/OLED or MAO Shield), developed by NXP for flexibility and ease of use. The Kit can be used with a wide range of development tools, including the LPCXpresso IDE, Keil uVision, and IAR EWARM of NXP.

This document describes the LPC54114 Kit hardware. The following aspects of using the Kit are covered by this guide: Main board features. Setup for use with development tools. Downloading examples using the mass storage boot feature. Board jumper settings. Detailed description of the LPCXpresso54114 board is not provided in this document, but can be found in the User Manual for that board (UM10973).

All information provided in this document is subject to legal disclaimers.


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