Details, datasheet, quote on part number: nanoSMD400LR-C-2
PartnanoSMD400LR-C-2
CategoryCircuit Protection => Thermistors => 8832413
TitleResettable Fuses - PPTC PPTC-LOWRHO SMD-PSW
Description

Littelfuse POLYSWITCH® LoRho SMD PTC for Charging Cables provide protection from the harmful effects of heat generated due to faults within a charging port such as USB-C and microUSB, as well as many others. The POLYSWITCH LoRho series are SMD compatible with reflow soldering process and are available in 1206 and 1210 sizes. These resettable PTCs feature ultra low internal resistance and up to 12VDc and 4.5A lhold.

CompanyLittelfuse
DatasheetDownload nanoSMD400LR-C-2 datasheet
Specifications 
SeriesLow Rho SMD
Mounting StyleSMD/SMT
Termination StyleSMD/SMT
Hold Current4 A
Maximum Voltage12 V
Trip Current
Current Rating - Max-
Resistance0.01 Ohms
Package/Case1206 (3216 metric)
PackagingReel

Others parts numbering
nanoSMD350LR-C-2
microSMD450LR-C-2

 

Features, Applications

Description The Littelfuse LoRho SMD PTC for Charging Cables provides protection from heat generated due to faults within the connector such as USB-C, microUSB, and many others. As connectors get smaller, their pin-to-pin spacings are shrinking which increases the opportunity for debris such as dust, dirt, or water to collect causing a fault. These faults can generate a tremendous amount of heat which will damage charging cables, the devices they charge, or people using them.

Features SMD compatible with reflow soldering process Available in small 1206 and 1210 sizes to 12Vdc and 4.5A Ihold Ultra low internal resistance Reset automatically

Applications Over temperature (OT) protection for USB connectors and cables including: ­ USB Type-C ­ USB Micro-B ­ USB-A Fast charging standards and protocols including: ­ USB Power Delivery (PD) ­ Qualcomm Quick Charge (QC) ­ Mediatek Pump Express (PE) ­ Samsung Adaptive Fast Charging (AFC) ­ Huawei/HiSilicon Fast Charging Protocol (FCP)

These charging protocols are the property of their respective owners.

Notes: 1. Ihold = Hold current: maximum current device will pass without tripping in 20°C still air 2. Vmax = Maximum voltage device can withstand without damage at rated current (Imax) Pd = Power dissipated from device when in the tripped state at 20°C still air 4. Rmin = Minimum resistance of device in initial (un-soldered) state R1max = Maximum resistance of device at 20°C measured one hour after tripping or reflow Soldering of 260°C for 20 seconds (Values specified were determined using PCBs with x 1.0in ounce copper traces) Caution: Operation beyond the specified rating may result in damage and possible arcing and flame

TCO and Pd Testing Method: Thermal Cut-Off Test­ 1. Put the device into the thermostatic chamber controlled at room temperature 25°C. 2. Apply the specified current to the device, and increase the chamber temperature at the rate of 2°C per minute. 3. Measure the device ambient temperature when the applied current has reduced to less than 20% of initial value. Power Dissipation­ 1. Conduct thermal cut-off test at rated current/voltage. 2. After device trip, decrease the chamber temperature with keeping trip state. 3. Measure the tripped-state power dissipation when the device ambient temperature has reduced 30°C or less.

© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/10/17

Note: The temperature rerating data is for reference only. Please contact Littelfuse technical support for detail temperature rerating information

Operating Temperature Maximum Device Surface Temperature in Tripped State +85°C, 1000 hours -/+10% typical resistance change 85% R.H.,100 hours -/+15% typical resistance change MIL­STD­202, Method 215 No change

Terminal Materials Lead Solderability Solder-Plated Copper (Solder Material: Matte Tin (Sn)) Meets EIA Specification RS186-9E, ANSI/JSTD-002, Category 3

Profile Feature - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus Temp (TL) to peak TS(max) TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL)

Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP)

All temperature refer to topside of the package, measured on the package body surface. If reflow temperature exceeds the recommended profile, devices may not meet the performance requirements. Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead. Recommended maximum paste thickness mm (0.010 inch). Devices can be cleaned using standard industry methods and solvents. Devices can be reworked using the standard industry practices.

Marking code varies by device. See Electrical Characteristics table.

 

Some Part number from the same manufacture Littelfuse
nanoSMD350LR-C-2

Littelfuse POLYSWITCH® LoRho SMD PTC for Charging Cables provide protection from the harmful effects of heat generated due to faults within a charging port such as USB-C and microUSB, as well as many

microSMD450LR-C-2
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