Details, datasheet, quote on part number: CSD95490Q5MC
PartCSD95490Q5MC
CategorySemiconductors => Power Management => Power MOSFET => Power MOSFET Module
Part familyCSD95490Q5MC 75A Synchronous Buck NexFET™ Smart Power Stage with DualCool Package
TitleSwitching Controllers 75A SynchEvalMod Buck NexFET
Description75A Synchronous Buck NexFET™ Smart Power Stage with DualCool Package 12-VSON-CLIP -55 to 150
CompanyTexas Instruments Inc.
StatusACTIVE
ROHSY
SampleYes
DatasheetDownload CSD95490Q5MC datasheet
Specifications 
TopologyBuck
Number of Outputs1 Output
Switching Frequency1.25 MHz
Duty Cycle - Max85 %
Input Voltage
Output Voltage5.5 V
Output Current75 A
Minimum Operating Temperature- 55 C
Maximum Operating Temperature+ 150 C
Mounting StyleSMD/SMT
Package/CaseVSON-CLIP-12
PackagingCut Tape, eel, Reel
  Mecanical Data
Pin nbPackage typeInd stdJEDEC codePackage qtyCarrierDevice markWidth (mm)Length (mm)Thick (mm)Pitch (mm)
12DMC2500LARGE T&R95490MC 56.98
Spice Model
CSD95490Q5MC PSpice Transient Model - ZIP (09/08/2017)

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Features, Applications

CSD95490Q5MC Synchronous Buck NexFETTM Smart Power Stage

Multiphase Synchronous Buck Converters High-Frequency Applications High-Current, Low-Duty Cycle Applications POL DC-DC Converters Memory and Graphic Cards Desktop and Server / VR13.x V-Core Synchronous Buck Converters High-Current POL for Network Communications

75-A Continuous Operating Current Capability Over 95% System Efficiency 30 A High-Frequency Operation (up to 1.25 MHz) Diode Emulation Function Temperature Compensated Bi-Directional Current Sense Analog Temperature Output Fault Monitoring 3.3-V and 5-V PWM Signal Compatible Tri-State PWM Input Integrated Bootstrap Switch Optimized Dead Time for Shoot-Through Protection High-Density QFN 6-mm Footprint Ultra-Low-Inductance Package System Optimized PCB Footprint Thermally Enhanced Topside Cooling RoHS Compliant Lead-Free Terminal Plating Halogen Free

The CSD95490Q5MC NexFETTM power stage is a highly optimized design for use in a high-power, highdensity synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design. Device Information(1)

DEVICE MEDIA 13-Inch Reel 7-Inch Reel QTY 2500 250 PACKAGE QFN 6.00-mm Package SHIP Tape and Reel CSD95490Q5MC

(1) For all available packages, see the orderable addendum at the end of the data sheet.
Typical Power Stage Efficiency and Power Loss
P12V VIN BOOT BOOT_R VOS VSW TAO LSET PGND IOUT REFIN
BVSN BVSP P12V VIN BPWM1 BSKIP# P5V PWM BOOT BOOT_R VOS VSW TAO PGND IOUT REFIN

SCLK SDIO SALERT# PIN_ALT# VR_HOT# SMB_CLK SMB_ALERT# SMB_DIO AVR_RDY BVR_RDY AVR_EN VR_FAULT# RESET#

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

Features.................................................................. Applications........................................................... Description............................................................. Revision History..................................................... Pin Configuration and Functions......................... Specifications......................................................... Device and Documentation Support.................... 6

Receiving Notification of Documentation Updates.... Community Resources.............................................. Trademarks............................................................... Electrostatic Discharge Caution................................ Glossary....................................................................

6.1 Absolute Maximum Ratings...................................... 4 6.2 ESD Ratings.............................................................. 4 6.3 Recommended Operating Conditions....................... 4

9.1 Mechanical Drawing.................................................. 7 9.2 Recommended PCB Land Pattern............................ 8 9.3 Recommended Stencil Opening............................... 9

DATE March 2017 REVISION * NOTES Initial release.
Submit Documentation Feedback Product Folder Links: CSD95490Q5MC

PIN NAME REFIN IOUT LSET VDD VOS SW VIN BOOTR BOOT PWM NUMBER DESCRIPTION External reference voltage input for current sensing amplifier. Output of current sensing amplifier. V(IOUT) V(REFIN) is proportional to the phase current. A resistor from this pin to PGND pin sets the inductor value for the internal current sensing circuitry. Supply voltage for gate drivers and internal circuitry. Output voltage sensing pin for the internal current sensing circuitry. Phase node connecting the HS MOSFET source and LS MOSFET drain pin connection to the output inductor. Input voltage pin. Connect input capacitors close to this pin. Return path for HS gate driver. It is connected to VSW internally. Bootstrap capacitor connection. Connect a minimum 16-V, X5R ceramic cap from BOOT to BOOTR pins. The bootstrap capacitor provides the charge to turn on the control FET. The bootstrap diode is integrated. Tri-state input from external controller. Logic low sets control FET gate low and sync FET gate high. Logic high sets control FET gate high and sync FET gate low. Both MOSFET gates are set low if PWM stays in Hi-Z for greater than the tri-state shutdown hold-off time (t3HT). This dual function pin either enables the diode emulation function or can be used as a simple enable for the device. When this pin is driven into the tri-state window and held there for more than the tri-state holdoff time, Diode Emulation Mode (DEM) is enabled for sync FET. When the pin is high, device operates in Forced Continuous Conduction Mode (FCCM). When the pin is low, both FETs are held off. An internal resistor pulls this pin low if left floating. Temperature Amplifier Output. Reports a voltage proportional to the IC temperature. An ORing diode is integrated in the IC. When used in multiphase application, a single wire can be used to connect the TAO pins of all the ICs. Only the highest temperature will be reported. TAO will be pulled V if thermal shutdown, LSOC, or HSS detection circuit is tripped. Power ground.


 

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