Details, datasheet, quote on part number: MAX14828ATG+
PartMAX14828ATG+
Category
TitleSensor Interface IO-Link Device Transciever
Description
CompanyIntegra Technologies
DatasheetDownload MAX14828ATG+ datasheet
  
MAX14828ATG+ photo

Others parts numbering
MAX14828EVKIT#: Interface Development Tools MAX14828 EVKIT

 

Features, Applications

Low Power Dissipation for Small Sensors 1.2 (typ) Driver On-Resistance 50mW (typ) Power Dissipation When Driving 100mA Load High Configurability and Integration Reduce SKUs Auxiliary 24V Digital Input Selectable Driver Current: to 250mA SPI or Pin-Control Interface for Configuration and Monitoring Multiplexed SPI/UART Interface Option 5V and 3.3V Linear Regulators Optional External Transistor Supports Higher Regulator Loads Integrated LED Drivers Pin and Software Compatible to MAX14827A Robust Communication 65V Absolute Maximum Ratings on Interface and Supply Pins Allows for Flexible TVS Protection Glitch Filters for Improved Burst Resilience and Noise Thermal Shutdown Hot-Plug Supply Protection Reverse Polarity Protection of All Sensor Interface Inputs/Outputs to +125C Operating Temperature Range

The MAX14828 integrates the high-voltage functions commonly found in industrial sensors. The MAX14828 features one ultra low-power driver (C/Q) with active reverse-polarity protection. An auxiliary digital input is provided to allow firmware updates through a UART interface. Transient protection is simplified due to high voltage tolerance allowing the use of micro TVS. The device features a flexible control interface. Pin-control logic inputs allow for operation with switching sensors that do not use a microcontroller. For sensors that use a microcontroller, an SPI interface is available with extensive diagnostics. For IO-Link operation, a UART interface is provided, allowing interfacing to the microcontroller UART. Finally, a multiplexed UART/SPI option allows using one serial microcontroller interface for shared SPI and UART interfaces. The device includes on-board 3.3V and 5V linear regulators for low-noise analog/logic supply rails. The MAX14828 is available 4mm) 24-pin TQFN package and x 2.5mm) wafer-level package (WLP) and is specified over the extended to +125C temperature range.

Applications
Industrial sensors IO-Link sensors and actuators Safety applications

IO-Link is a registered trademark of Profibus User Organization (PNO). SPI is a trademark of Motorola, Inc.

LED1IN SPI/PIN IRQ/OC CS/PP SDI/TX/NPN CLK/TXEN/200MA SDO/RX/THSH RX TX TXEN UARTSEL WU LI

(All voltages referenced to GND, unless otherwise noted.) to +65V REG............................................................... 16V) V5, VL....................................................................... + 0.3V) C/Q, DI.......................... MIN: Larger of -70V and 70V) to MAX: the lower of +70V and + 70V) Logic Inputs: CS/PP, TXEN, TX, LED1IN, UARTSEL, CLK/TXEN/200MA, SPI/PIN, SDI/TX/NPN............................................... -0.3V to (VL + 0.3V) Logic Outputs: RX, LI, WU, SDO/RX/THSH...................... -0.3V to (VL + 0.3V) IRQ/OC................................................................... to (V5+0.3V) Continuous Current Into GND and V24.................................1A Continuous Current Into C/Q........................................... 500mA Continuous Current Into V5 and REG............................. 100mA Continuous Current Into Any Other Pin............................. 50mA Continuous Power Dissipation TQFN (derate 27.8mW/C above +70C).................. 2222mW WLP (derate 22.7mW/C above +70C)..................... 1816mW Operating Temperature Range.......................... to +125C Maximum Junction Temperature....................... Internally Limited Storage Temperature Range............................. to +150C Soldering Temperature (reflow, TQFN and WLP)............ +260C

Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

TQFN Junction-to-Ambient Thermal Resistance (JA)...........36C/W Junction-to-Case Thermal Resistance (JC)..................3C/W WLP Junction-to-Ambient Thermal Resistance (JA)...........44C/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

PARAMETER V24 Supply Voltage V24 Undervoltage Lockout Threshold V24 Undervoltage Lockout Threshold Hysteresis

to 5.5V, VGND = 0V; REG unconnected, all logic inputs VL or GND; to +125C, unless otherwise noted. Typical values are = 3.3V, and = +25C, unless otherwise noted.) (Note 2) SYMBOL V24UVLO V24UVLO_HYST C/Q disabled (CQ_Dis = 1) C/Q in push-pull configuration, = 11, C/Q is high, no load on C/Q in push-pull configuration, = 11, C/Q is low, no load on C/Q V24 rising V24 falling CONDITIONS MIN TYP MAX 36 9 UNITS V mV


 

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