Details, datasheet, quote on part number: MAX14866UTM+
CategorySemiconductors => Switch ICs => 8851573
TitleAnalogue Switch ICs 16 channel high volt
CompanyIntegra Technologies
DatasheetDownload MAX14866UTM+ datasheet
ManufacturerMaxim Integrated
Product CategoryAnalogue Switch ICs
Number of Switches2 Switch
Configuration2 x SPDT
On Resistance - Max13 Ohms
Switch Voltage - Max5.5 V
On Time - Max4 us
Off Time - Max4 us
Operating Supply Voltage5 V
Maximum Operating Temperature+ 85 C
Mounting StyleSMD/SMT
Supply TypeSingle Supply
BrandMaxim Integrated
Supply Current - Max8.5 mA
Minimum Operating Temperature0 C
Pd - Power Dissipation3200 mW
Supply Voltage - Max5.5 V
Supply Voltage - Min4.75 V
MAX14866UTM+ photo


Features, Applications

16-Channel, High-Voltage Analog Switch without High-Voltage Supply Requirement

The a 16-channel, high-voltage (HV), analog SPST switch primarily intended for HV multiplexing in ultrasound applications. The MAX14866 operates from one only low-voltage supply (+5V) and does not require dedicated HV supplies, resulting in cost-saving and system simplification. Moreover, for in-probe applications, HV supplies do not need to be associated with the MAX14866 in the probe/ transducer head, resulting in greater safety and easier compliance with safety regulations. The MAX14866 features best-in-class performance in terms of bandwidth (up to 50MHz), charge injection (<100pC), and linear transmit input range (up to 210VPKPK). The low-signal switch RDSON is typically about 7 around 0V and remains flat in the entire input range ensuring extremely good linearity. The latchup-free SOI (Silicon-on-Insulator) technology and the wide analog range results in extremely high robustness during undershoots and overshoots that occur in ultrasound systems due to the resonant nature of the load. The status of the switches can be individually controlled through a high-speed SPI interface (up to 30MHz). Daisychain architecture is supported. Alternatively, switches can also be controlled with global control signal (SET and CLR) for bank selections or relay replacement applications. The MAX14866 is offered in two different packages: wafer-level packages (WLPs) and TQFNs. The 110bump WLP size is only x 5.47mm, resulting in less than 1.9mm2/channel footprint and allowing for very high levels of integration, which is especially beneficial for in-probe applications. The size of the TQFN package is an industry standard x 7mm package.

Flexibility and Ease-of-Design HV Switches Operate From +5V Supply Only­Eliminating Dedicated High-Voltage Supplies Eases Probe Compliance To Industry Safety Standards SOI Technology­Latchup Free Large Analog Input range (up 210VPKPK) 16 Independent SPST Ensure Flexibility Supporting All Possible MUX Combinations Switches Can Be Controlled Either Individually or Globally (Bank Selection) 30MHz SPI Interface for Individually Programming the Status of the Switches SET and CLR CMOS for global control of the switches (Bank Selection or Relay Replacements Applications) Extended Digital Logic Input Range From to 5V High Level Of Integration and Density for Space-Saving Applications 16 Channels Linear SPST switches < 1.9mm2/channel footprint (WLP) High Performance: Low RON (7 typ) Ensures Low Insertion Loss RON Flatness in the Entire Input Range Ensures Excellent Performances In Harmonic Imaging Low Charge Injection <100pC. Wide Bandwidth of Operation (Up to 50MHz) Low On Input Capacitance (33pF) Low Off Input Capacitance (7.7pF) Excellent Off Isolation at 5MHz) Excellent Crosstalk Performances at 5MHz)

Medical Ultrasound Imaging Relays replacements NDT Printers

VCC to 5.6V VDD to 5.6V COMx to GND, to +110V NOx to GND, to +110V COMx to NOx, to +110V SDIN to 5.6V SDOUT GND...........................................-0.3V to VDD to 5.6V CLK to 5.6V CLR to 5.6V SET to 5.6V TQFN Continuous Power Dissipation (Single Layer Board, = +70°C, derate 27.8mW/°C above to 2222mW TQFN Continuous Power Dissipation (Multilayer Board, = +70°C, derate 40 mW/°C above to 3200mW WLP Continuous Power Dissipation (Multilayer Board, = +70°C, derate 37mW/°C above to 2960mW Operating Temperature to 85°C Junction Temperature.................................................... +150°C Storage Temperature Range............................ to +150°C Soldering Temperature (reflow)

110-Bump WLP Junction-to-Ambient Thermal Resistance (JA)......26.93°C/W Junction-to-Case Thermal Resistance (JC)...................... N/A 48-Pin TQFN Junction-to-Ambient Thermal Resistance (JA)...........25°C/W Junction-to-Case Thermal Resistance (JC)..................1°C/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to

Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

(VCC 5V ±5%, VDD to 5.5V. Typical values are VDD = +2.5V, VCC = +25°C. Limits are 100% tested = +85°C and are guaranteed by design in the entire temperature range ) PARAMETER POWER SUPPLIES VDD Logic Supply Voltage VDD Static Current VDD Dynamic Current VCC Supply Static Current VCC Supply Dynamic Current VCC Supply Voltage Range LOGIC LEVELS Logic-Input Low Voltage Logic-Input High Voltage Logic-Output Low Voltage Logic-Output High Voltage Logic-Input Capacitance VIL VIH VOL VOH CIN ISINK = 1mA ISOURCE = 1mA VDD x VDD 0.33 x VDD pF VDD IDDS IDD ICCS ICC VCC VDD = +5V, fCLK = 5MHz, fDIN = 2.5MHz, CDOUT = 15pF All switches remain on or off, COM_= NO_= GND All Channel Switching, mA V SYMBOL CONDITIONS MIN TYP MAX UNITS

(VCC 5V ±5%, VDD to 5.5V. Typical values are VDD = +2.5V, VCC = +25°C. Limits are 100% tested = +85°C and are guaranteed by design in the entire temperature range ) PARAMETER Logic-Input Leakage LEB Pullup Resitor CLR, SET Pulldown Resistor SWITCH CHARACTERISTICS Analog Dynamic Signal Range Small Signal On-Resistance Small Signal On-Resistance Matching VSW_ RONS DRONS AC operation only, > 500kHz V(NO) = 0V, I(COM) 5mA 3 std, VNO_ = 0V, ICOM_ 5mA AC measured, 100 Resistive load NO and GND. Transmit bipolar low frequency pulse = 0.5MHz Compare positive and negative output level on NO Symmetry = [VOP - VON]/ [0.5 x (VOP + VON)] V(NO) = GND, V(COM) HV pulse 100ns duration V(COM) = ±100mV V(COM) = 100mV V(NO) = 100mV V(NO) = 100mV Ref. Test Circuit = 100K Ref. Test Circuit = 100K Ref. Test Circuit = 100K Ref. Test Circuit. VCOM_ = 50, from switch ON digital command 90% of the transition completed Ref. Test Circuit VCOM_ = 50 from switch OFF digital command 90% of the transition completed Ref. Test Circuit V % SYMBOL IIN RPU RPDW CONDITIONS CLK, DIN pins MIN TYP MAX +1 UNITS µA K

Analog Switch Peak Current COM to GND Leakage Current Switch OFF COM to GND Equivalent Resistor. Switch NO to GND Equivalent Resistor. Switch OFF NO to GND Equivalent Resistor Switch ON Switch-Off DC Offset COM Pin Switch-Off DC Offset NO Pin Switch-On DC Offset


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