|Datasheet||Download STK6860H datasheet
Reversible Brush-Type DC Motor Driver (output current: 8 A)
The an H bridge power pack reversible brushtype DC motor driver that uses Sanyo's unique insulated metal substrate technology (IMST) substrate. This technology provides superlative thermal dissipation characteristics. By adopting MOSFET devices as its power elements, this hybrid IC realizes reduced loss and increased current outputs as compared to our earlier STK6860H series.
Wide operating power supply voltage range to 42 V) Few required external components (Operation is possible with only two external bootstrap capacitors.)Applications
Plain paper copier drum and scanner motors LBP drum motors Printer head carriage motors All types of DC motor application equipmentFeatures
Increased margins with respect to rush currents due to the adoption of MOSFET elements TTL level compatible inputs Support for both two pin control saturation operation and three pin control PWM control A braking function is provided.Specifications
Parameter Maximum supply voltage 1 Maximum supply voltage 2 Maximum motor rush current Operating substrate temperature Junction temperature Storage temperature range Symbol VCC1 max VCC2 max IO peak Tc max Tj max Tstg No signal No signal Period = 100 ms, duty 5.0 V Conditions Ratings to +125 Unit A °C
Any and all SANYO products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your SANYO representative nearest you before using any SANYO products described or contained herein in such applications. SANYO assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all SANYO products described or contained herein.SANYO Electric Co.,Ltd. Semiconductor Bussiness Headquarters
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
Parameter Supply voltage 1 Supply voltage 2 Motor output current PWM frequency FET withstand voltage Symbol VCC1 VCC2 IOH max fp VDSS Input active Input active DC Conditions Ratings 30 60 Unit V A kHz V
Parameter Quiescent current Output saturation voltage Input on voltage Input off voltage Input on current 1 Input on current 2 Input off current 1 Input off current 2 Diode forward voltage Sensing voltage Symbol ICCO Vst VIH VIL IIL1 IIL2 Vdf Vsens 2.7 V, pin 2.7 V, pin 13 or pin 0.4 V, pin 0.4 V, pin 13 or pin 15 Idf 8 A, VGS 2.8 RL Conditions Ratings min 30 typ 40 0.90 max 50 1.20 Unit mA VNote: Constant voltage power supplies must be used.
Note: 1. Boot is an abbreviation for bootstrap. 2. The OSC pin (pin 11) must be left open in operation.
0 V Note: 1. Input pin specifications TTL levels handled Maximum PWM input frequency: 30 kHz When used in two pin control mode, the PWM pin must be tied high. 2. Since the OSC pin (pin is a monitor pin, it should be left open in normal operation.
1. Heat Sink Thermal Resistance (c-a) Derivation The size of the heat sink required for the hybrid IC is determined by the motor output current (IOH), the electrical characteristics of the motor and the chopping frequency, and the frequency of current application. The thermal resistance (c-a) of the heat sink is derived from the following formula. c-a = Tc max Ta (°C/W) Pd Tc max: Hybrid IC case temperature (°C) Ta: Ambient temperature within the set (°C) Pd: Average internal power dissipation within the hybrid IC (W) As an example, Figure 2 can be used to derive the required area for 2 mm aluminum plate heat sink. Since the ambient temperature within a set varies greatly with the set internal air circulation conditions, the size of the heat sink must be determined taking into account the constraint that the temperature of the back surface of the IC (the aluminum plate side) must never under any conditions exceed 105°C.
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