Details, datasheet, quote on part number: AK58256AG
PartAK58256AG
Category
Description256K X 8, 30 Pin Sip Module, 2-Chip Version
CompanyAccutek Microcircuit Corporation
DatasheetDownload AK58256AG datasheet
  

 

Features, Applications
DESCRIPTION

The Accutek AK58256AG/AS high density memory module is a random access memory organized x 8 bit words. The assembly consists of two x 4 DRAMs in surface mount packages mounted to the front side of a printed circuit board. The module can be configured as a leadless 30 pad SIM or a leaded 30 pin SIP. This packaging approach provides a better than to 1 density increase over standard DIP packaging. The operation of the AK58256 is identical to two x 4 DRAMs. The data input/output is brought out separately for each x 4 device, with common RAS, CAS and WE control. The OE pins are tied to Vss which dictates the use of early-write cycles to prevent contention of D and Q. Since the Write-Enable (WE) signal must always go low before CAS in a write cycle, Read-Write and Read-Modify-Write operation is not possible.

FEATURES

x 8 bit organization Optional 30 Pad leadless SIM (Single In-Line Module) or 30 Pin leaded SIP (Single In-Line Package) JEDEC standard pinout Common CAS, RAS and WE control for eight DQ lines Separate CAS control for one separate pair of D and Q lines 1024 refresh A8 Power:.99 Watt Max Active (60 nS).88 Watt Max Active (70 nS).77 Watt Max Active (80 nS).65 Watt Max Active (100 nS) 11 mWatt standby (max)

Operating free air temperature: to 700C Upward compatible with AK581024, AK584096 and AK5816384 Functionally and Pin compatible with AK48256 Available with access times 100 nS

- A8 CAS RAS WE Vcc Vss NC Data In / Data Out Address Inputs Column Address Strobe Row Address Strobe Write Enable 5v Supply Ground No Connect

x 8, Dynamic RAM, Leadless SIM, Page Mode, Commercial, 60 nSEC Access Time x 8, Dynamic RAM, Leaded SIP, Static Column Mode Commercial, 70 nSEC AccessTime

Product AK = Accutek Memory Type 4 = Dynamic RAM 5 = CMOS Dynamic RAM 6 = Static RAM Organization/Word Width by 9 Size/Bits Depth = 4 MEG = 8 MEG = 1 MEG = 16 MEG Package Type G = Single In-Line Package (SIP) S = Single In-Line Module (SIM) D = Dual In-Line Package (DIP) W =.050 inch Pitch Edge Connect Z = Zig-Zag In-Line Package (ZIP) Special Designation P = Page Mode N = Nibble Mode K = Static Column Mode W = Write Per Bit Mode V = Video Ram Separator - = Commercial M = Military Equivalent Screened I = Industrial Temperature Tested X = Burned In Speed (first two significant digits) DRAMS SRAMS 85 nS

The numbers and coding on this page do not include all variations available, but are shown as examples of the most widely used variations. Contact Accutek if other information is required.

ACCUTEK MICROCIRCUIT CORPORATION BUSINESS CENTER at NEWBURYPORT 2 NEW PASTURE ROAD, SUITE 1 NEWBURYPORT, MA 01950-4054 VOICE: 978-465-6200 FAX: 978-462-3396 Email: accutek@seacoast.com Internet: www.accutekmicro.com

Accutek Reserves the right to make changes in specifications at any time and without notice. Accutek does not assume any responsibility for the use of any circuitry described; no circuit patent licenses are implied. Preliminary data sheets contain minimum and maximum limits based upon design objectives, which are subject to change upon full characterization over the specific operating conditions.


 

Related products with the same datasheet
AK58256AGK-70
AK58256AS
AK58256ASP-60
Some Part number from the same manufacture Accutek Microcircuit Corporation
AK58256AGK-70 256K X 8, 30 Pin Sip Module, 2-Chip Version
AK584096AG 4 Meg X 8, 30 Pin Sip Module
AK584096BG 4 Meg X 8, 30 Pin Sip Module, 2-Chip Version
AK591024AG 1 Meg X 9, 30 Pin Sip Module, 3-Chip Version
AK5916384G 16 Meg X 9, 30 Pin Sip Module
AK59256AG 256K X 9, 30 Pin Sip Module, 3-Chip Version
AK594096AG 4 Meg X 9, 30 Pin Sip Module
AK594096BG 4 Meg X 9, 30 Pin Sip Module, 3-Chip Version
AK61664Z 64K X 16, 40 Pin Zip Module
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AK63232W 32K X 32, 64 Pin Sim Module
AK63232Z 32K X 32, 64 Pin Zip Module
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