Details, datasheet, quote on part number: AK584096AG
Description4 Meg X 8, 30 Pin Sip Module
CompanyAccutek Microcircuit Corporation
DatasheetDownload AK584096AG datasheet


Features, Applications

The Accutek AK584096 high density memory module is CMOS DRAM organized in 4 Meg x 8 bit words. The assembly consists of eight standard 4 Meg x 1 DRAMs in plastic SOJ packages mounted on the front side of a printed circuit board. The module can be configured as a leadless 30 pad SIM or a leaded 30 pin SIP. The module is only 0.800 inch high (same height as a standard 1 Meg module) making it ideally suited for applications with low height restrictions. The operation of the AK584096 is identical to eight 4 Meg x 1 DRAMs. The data input is tied to the data output and brought out separately for each device, with common RAS, CAS and WE control. This common I/O feature dictates the use of early-write cycles to prevent contention of D and Q. Since the Write-Enable (WE) signal must always go low before CAS in a write cycle, Read-Write and Read-Modify-Write operation is not possible.


x 8 bit organization Optional 30 Pad leadless SIM (Single In-Line Module) or 30 Pin leaded SIP (Single In-Line Package) JEDEC standard pinout Each device has common D and Q lines with common RAS, CAS and WE control CAS-before-RAS refresh Power 4.40 Watt Max Active (80 nSEC) 3.75 Watt Max Active (100 nSEC) 44 mW Max Standby

Operating free air temperature to 700C Upward compatible with AK5816384 Downward compatible with AK58256 and AK581024

- A10 CAS RAS WE Vcc Vss NC Data In / Data Out Address Inputs Column Address Strobe Row Address Strobe Write Enable 5v Supply Ground No Connect


Product AK = Accutek Memory Type 4 = Dynamic RAM 5 = CMOS Dynamic RAM 6 = Static RAM Organization/Word Width by 9 Size/Bits Depth = 4 MEG = 8 MEG = 1 MEG = 16 MEG Package Type G = Single In-Line Package (SIP) S = Single In-Line Module (SIM) D = Dual In-Line Package (DIP) W =.050 inch Pitch Edge Connect Z = Zig-Zag In-Line Package (ZIP) Special Designation P = Page Mode N = Nibble Mode K = Static Column Mode W = Write Per Bit Mode V = Video Ram Separator - = Commercial M = Military Equivalent Screened I = Industrial Temperature Tested X = Burned In Speed (first two significant digits) DRAMS SRAMS 15 nS

The numbers and coding on this page do not include all variations available but are show as examples of the most widely used variations. Contact Accutek if other information is required.

AK584096ASP-80 4 Meg 8, 80 nSEC DRAM 30 pin SIM Configuration, Page Mode AK584096AGN-70 4 Meg 8, 70 nSEC Dram 30 pin SIP Configuration, Nibble Mode ACCUTEK MICROCIRCUIT CORPORATION BUSINESS CENTER at NEWBURYPORT 2 NEW PASTURE ROAD, SUITE 1 NEWBURYPORT, MA 01950-4054 VOICE: 978-465-6200 FAX: 978-462-3396 Email: Internet:

Accutek Reserves the right to make changes in specifications at any time and without notice. Accutek does not assume any responsibility for the use of any circuitry described; no circuit patent licenses are implied. Preliminary data sheets contain minimum and maximum limits based upon design objectives, which are subject to change upon full characterization over the specific operating conditions.


Related products with the same datasheet
Some Part number from the same manufacture Accutek Microcircuit Corporation
AK584096AGN-70 4 Meg X 8, 30 Pin Sip Module
AK584096BG 4 Meg X 8, 30 Pin Sip Module, 2-Chip Version
AK591024AG 1 Meg X 9, 30 Pin Sip Module, 3-Chip Version
AK5916384G 16 Meg X 9, 30 Pin Sip Module
AK59256AG 256K X 9, 30 Pin Sip Module, 3-Chip Version
AK594096AG 4 Meg X 9, 30 Pin Sip Module
AK594096BG 4 Meg X 9, 30 Pin Sip Module, 3-Chip Version
AK61664Z 64K X 16, 40 Pin Zip Module
AK62464Z 64K X 24, 64 Pin Zip Module
AK6321024W 1 Meg X 32, 72 Pin Sim Module
AK632128AW 128K X 32, 64 Pin Sim Module
AK63216Z 16K X 32, 64 Pin Zip Module
AK632256AW 256K X 32, 64 Pin Sim Module, Available With Solder or Gold Leads
AK632256BZ 256K X 32, 64 Pin Zip Module
AK632256W 256K X 32, 64 Pin Sim Module, Available With Solder or Gold Leads
AK632256W-72 256K X 32, 72 Pin Sim Module, Available With Solder or Gold Leads
AK632256Z 256K X 32, 64 Pin Sim Module, Available With Solder or Gold Leads
AK63232W 32K X 32, 64 Pin Sim Module
AK63232Z 32K X 32, 64 Pin Zip Module
AK632512AW-64 512K X 32, 64 Pin Sim Module
Same catergory

SKR135F08 : Fast Recovery Rectifier Diode. Stud Diode Fast Recovery Rectifier Diode Fig. 1 Typ. recovery charge vs. current decrease Fig. 2 Peak recovery current vs. current decrease This technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee expressed or implied is made regarding delivery, performance or suitability. .

C4_OUTPUT : I/O Modules. Nominal Voltage VDC Minimum Voltage VDC Maximum Voltage VDC Drop-out Voltage Maximum Current (2) (3) Resistance Nominal Line Voltage Minimum Line Voltage Maximum Line Voltage Max Off-State Voltage (4) Max Off-State Leakage (5) Static Off-State dv/dt (6) Maximum Rated On-State Current (7) Minimum On-State Current Max Surge Current (8) On-State Voltage.

BB-HE133-C : Surface Mount Blinking CHIP LED Lamps. Chip Part No. Material BB-HJF33-C BB-HUB33-C GaP/GaP GaAsP/GaP GaAlAs AlGalnP Emitted Color Bright Red Yellow Green Hi-Eff Green Pure Green Yellow Hi-Eff Red Super Red Super Orange Super Yellow Soft Orange Soft Orange Super Red p (nm) .

CBWSSA2115533290653 : Band Filters for 200ghz Add/drop Multiplexing. Bookham band skip filters leverage the proprietary Advanced Energetic Deposition (AED) process to produce the industry's best banded filter solution. The AED process state-of-the-art layer thickness control to produce thin-film interference filters that are unparalleled for optical add/drop multiplexing (OADM) WDM applications. Standard 5.5mm diameter.

FLZ3V0B : Zener Diodes. Color Band Marking Tolerance 1st Band Blue 2nd Band Red Green Black Gray Storage Temperature Range Maximum Junction Temperature Maximum Regulator Current * These ratings are limiting values above which the serviceability of the diode may be impaired. * Device mounted on FR-4 PCB with X 0.06 with only signal trace Electrical Characteristics (Continued).

M2250_07 : 5x7 mm, 2.5 Volt, Hcmos/ttl, Clock Oscillator. 2.5 Volt Operation Standby Option High density boards, low power circuits, portable test sets NOTE: A capacitor of value mF or greater between Vdd and Ground is recommended. MtronPTI reserves the right to make changes to the product(s) and service(s) described herein without notice. No liability is assumed as a result of their use or application. Please.

102448-1 : Gold Free Hanging (In-Line) Rectangular - Free Hanging, Panel Mount Connectors, Interconnect Receptacle; CONN RCPT 6POS .100 GOLD. s: Color: Black ; Connector Type: Receptacle ; Contact Finish: Gold ; : Closed End ; Mounting Type: Free Hanging (In-Line) ; Number of Rows: 2 ; Pitch: 0.100" (2.54mm) ; Row Spacing: 0.100" (2.54mm) ; Packaging: Tray ; Fastening.

RR1220P-564-B-T5 : 560K Ohm 0.1W, 1/10W Chip Resistor - Surface Mount; RES 560K OHM 1/10W .1% 0805 SMD. s: Resistance (Ohms): 560K ; Power (Watts): 0.1W, 1/10W ; Tolerance: 0.1% ; Packaging: Cut Tape (CT) ; Composition: Thin Film ; Temperature Coefficient: 25ppm/C ; Lead Free Status: Lead Free ; RoHS Status: RoHS Compliant.

TNPW201068R0BEEF : 68 Ohm 0.4W Chip Resistor - Surface Mount; RES 68.0 OHM .40W 0.1% 2010. s: Resistance (Ohms): 68 ; Power (Watts): 0.4W ; Tolerance: 0.1% ; Packaging: Tape & Reel (TR) ; Composition: Thin Film ; Temperature Coefficient: 25ppm/C ; Lead Free Status: Lead Free ; RoHS Status: RoHS Compliant.

2113-1-00-44-00-00-07-0 : Silver Swage Terminal - Pc Pin Connectors, Interconnect Turret; TERMINAL SOLDER TURRET.053". s: Contact Finish: Silver ; Flange Diameter: 0.062" (1.57mm) ; Length: 0.147" (3.73mm) ; Pin Diameter: 0.040" (1.02mm) ; Type: Turret ; Hole Diameter: 0.043" (1.09mm) ; Mounting Type: Swage ; Contact Finish Thickness: 300in (7.62m).

T0058767701 : Accessory Tool; WAH12 ANGLE HEAD FOR WBTS12L. s: Lead Free Status: Lead Free ; RoHS Status: RoHS Compliant.

09-10-1085 : 8 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, IDC. s: Connector Type: TWO PART BOARD CONNECTOR ; Gender: Female ; Termination Types: IDC ; Number of Contacts: 8.

PIC12F508-I/MC : 8-BIT, FLASH, 4 MHz, RISC MICROCONTROLLER, PDSO8. s: Life Cycle Stage: ACTIVE ; Clock Speed: 4 MHz ; ROM Type: Flash ; Supply Voltage: 2 to 3 volts ; I/O Ports: 6 ; Package Type: Other, 3 X 2 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, DFN-8 ; Operating Range: Industrial ; Pin Count: 8 ; Operating Temperature: -40 to 85 C (-40 to 185 F).

1206CC101KAT1A : CAPACITOR, CERAMIC, MULTILAYER, 630 V, X7R, 0.0001 uF, SURFACE MOUNT, 1206. s: Configuration / Form Factor: Chip Capacitor ; Technology: Multilayer ; Applications: General Purpose ; Electrostatic Capacitors: Ceramic Composition ; RoHS Compliant: Yes ; Capacitance Range: 1.00E-4 microF ; Capacitance Tolerance: 10 (+/- %) ; WVDC: 630 volts ; Mounting.

0-C     D-L     M-R     S-Z