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Part: Am29LV200B-120
Category:
Memory
-> ROM
-> EEPROM
-> Parallel
-> 2 Mb
Description: 2 Megabit (256 K X 8-bit/128 K X 16-bit) CMOS 3.0 Volt-only Boot Sector Flash Memory
Company: Advanced Micro Systems, Inc.
Datasheet: Download Am29LV200B-120 datasheet File size : 1747 kB
Request For quote: Find where to buy Am29LV200B-120
Datasheet text preview:
PRELIMINARY
Am29LV200
2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only Boot Sector Flash Memory
DISTINCTIVE CHARACTERISTICS
s Single power supply operation -- Full voltage range: 2.7 to 3.6 volt read and write operations for battery-powered applications -- Regulated voltage range: 3.0 to 3.6 volt read and write operations and for compatibility with high performance 3.3 volt microprocessors s High performance -- Full voltage range: access times as fast as 100 ns -- Regulated voltage range: access times as fast as 90 ns s Ultra low power consumption (typical values at 5 MHz) -- 200 nA Automatic Sleep mode current -- 200 nA standby mode current -- 10 mA read current -- 20 mA program/erase current s Flexible sector architecture -- One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and three 64 Kbyte sectors (byte mode) -- One 8 Kword, two 4 Kword, one 16 Kword, and three 32 Kword sectors (word mode) -- Supports full chip erase -- Sector Protection features: A hardware method of locking a sector to prevent any program or erase operations within that sector Sectors can be locked via programming equipment Temporary Sector Unprotect feature allows code changes in previously locked sectors s Top or bottom boot block configurations available s Embedded Algorithms -- Embedded Erase algorithm automatically preprograms and erases the entire chip or any combination of designated sectors -- Embedded Program algorithm automatically writes and verifies data at specified addresses s Typical 1,000,000 write cycles per sector (100,000 cycles minimum guaranteed) s Package option -- 48-pin TSOP -- 44-pin SO s Compatibility with JEDEC standards -- Pinout and software compatible with singlepower supply Flash -- Superior inadvertent write protection s Data# Polling and toggle bits -- Provides a software method of detecting program or erase operation completion s Ready/Busy# pin (RY/BY#) -- Provides a hardware method of detecting program or erase cycle completion s Erase Suspend/Erase Resume -- Suspends an erase operation to read data from, or program data to, a sector that is not being erased, then resumes the erase operation s Hardware reset pin (RESET#) -- Hardware method to reset the device to reading array data
Publication# 20513 Rev: D Amendment/+1 Issue Date: March 1998
PRELIMINARY
GENERAL DESCRIPTION
T h e Am29LV200 is a 2 Mbit, 3.0 volt-only Flash memory organized as 262,144 bytes or 131,072 words. The device is offered in 44-pin SO and 48-pin TSOP p a c k a g e s . The word-wide data (x16) appears on DQ15DQ0; the byte-wide (x8) data appears on DQ7 DQ0. This device is designed to be programmed insystem using only a single 3.0 volt VCC supply. No VPP is required for write or erase operations. The device c a n also be programmed in standard EPROM programmers. The standard device offers access times of 90, 100, 120, and 150 ns, allowing high speed microprocessors to operate without wait states. To eliminate bus contention the device has separate chip enable (CE#), write enable (WE#) and output enable (OE#) controls. The device requires only a single 3.0 volt power supply for both read and write functions. Internally genera t e d and regulated voltages are provided for the program and erase operations. The device is entirely command set compatible with the JEDEC single-power-supply Flash standard. Comm a n d s are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state-machine that co ntr ol s the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from other Flash or EPROM devices. Device programming occurs by executing the program c o m m a n d sequence. This initiates the Embedded Program algorithm--an internal algorithm that automatically times the program pulse widths and verifies proper cell margin. Device erasure occurs by executing the erase command sequence. This initiates the Embedded Erase algorithm--an internal algorithm that automatically preprograms the array (if it is not already programmed) before executing the erase operation. During erase, the device automatically times the erase pulse widths and verifies proper cell margin. The host system can detect whether a program or erase operation is complete by observing the RY/BY# pin, or by reading the DQ7 (Data# Polling) and DQ6 (toggle) status bits. After a program or erase cycle has been completed, the device is ready to read array data or accept another command. The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the d a t a contents of other sectors. The device is fully erased when shipped from the factory. Hardware data protection measures include a low VCC detector that automatically inhibits write operations during power transitions. The hardware sector protection feature disables both program and erase operations in any combination of the sectors of memory. This can be achieved via programming equipment. The Erase Suspend feature enables the user to put erase on hold for any period of time to read data from, or program data to, any sector that is not selected for erasure. True background erase can thus be achieved. The hardware RESET# pin terminates any operation in progress and resets the internal state machine to reading array data. The RESET# pin may be tied to the system reset circuitry. A system reset would thus also reset the device, enabling the system microprocessor to read the boot-up firmware from the Flash memory. The device offers two power-saving features. When addresses have been stable for a specified amount of time, the device enters the automatic sleep mode. The system can also place the device into the standby mode. Power consumption is greatly reduced in both these modes. A M D 's Flash technology combines years of Flash m e m o r y manufacturing experience to produce the highest levels of quality, reliability and cost effectiven e s s . The device electrically erases all bits within a sector simultaneously via Fowler-Nordheim tunn e l i n g . The data is programmed using hot electron inject ion.
Am29LV200
2
PRELIMINARY
PRODUCT SELECTOR GUIDE
Family Part Number Speed Options Regulated Voltage Range: VCC =3.03.6 V Full Voltage Range: VCC = 2.73.6 V Max access time, ns (tACC) Max CE# access time, ns (tCE) Max OE# access time, ns (tOE) 90 90 40 -90R -100 100 100 40 -120 120 120 50 -150 150 150 55 Am29LV200
Note: See "AC Characteristics" for full specifications.
BLOCK DIAGRAM
RY/BY# VCC V SS RESET# Erase Voltage Generator Input/Output Buffers Sector Switches DQ0DQ15 (A-1)
WE# BYTE#
State Control Command Register
PGM Voltage Generator Chip Enable Output Enable Logic STB Data Latch
CE# OE#
STB VCC Detector Timer Address Latch
Y-Decoder
Y-Gating
X-Decoder
Cell Matrix
A0A16
20513D-1
3
Am29LV200
PRELIMINARY
CONNECTION DIAGRAMS
A15 A14 A13 A12 A11 A10 A9 A8 NC NC WE# RESET# NC NC RY/BY# NC NC A7 A6 A5 A4 A3 A2 A1
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Standard TSOP
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
A16 BYTE# VSS DQ15/A-1 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 OE# VSS CE# A0
A16 BYTE# VSS DQ15/A-1 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 OE# VSS CE# A0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Reverse TSOP
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
A15 A14 A13 A12 A11 A10 A9 A8 NC NC WE# RESET# NC NC RY/BY# NC NC A7 A6 A5 A4 A3 A2 A1
20513D-2
Am29LV200
4
PRELIMINARY
CONNECTION DIAGRAMS
NC RY/BY# NC A7 A6 A5 A4 A3 A2 A1 A0 CE# VSS OE# DQ0 DQ8 DQ1 DQ9 DQ2 DQ10 DQ3 DQ11 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 RESET# WE# A8 A9 A10 A11 A12 A13 A14 A15 A16 BYTE# VSS DQ15/A-1 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC
SO
20513D-3
PIN CONFIGURATION
A0A16 = 17 addresses DQ0DQ14 = 15 data inputs/outputs DQ15/A-1 BYTE# C E# OE# WE# RESET# RY/BY# VCC = DQ15 (data input/output, word mode), A-1 (LSB address input, byte mode) = Selects 8-bit or 16-bit mode = Chip enable = Output enable = Write enable = Hardware reset pin, active low = Ready/Busy# output = 3.0 volt-only single power supply (see Product Selector Guide for speed options and voltage supply tolerances) = Device ground = Pin not connected internally
LOGIC SYMBOL
17 A0A16 DQ0DQ15 (A-1) CE# OE# WE# RESET# BYTE# RY/BY# 16 or 8
20513D-4
V SS NC
5
Am29LV200
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