|
|
Part: 4N55K
Category:
Optoelectronics
-> Optocouplers
Description: Hermetically Sealed, Transistor Output Optocouplers For Analog And Digital Applications
Company: Agilent Technologies, Inc.
Datasheet: Download 4N55K datasheet File size : 339 kB
Request For quote: Find where to buy 4N55K
Datasheet text preview:
Hermetically Sealed, Transistor Output Optocouplers for Analog and Digital Applications Technical Data
4N55* 5962-87679 HCPL-553X HCPL-653X HCPL-257K HCPL-655X 5962-90854 HCPL-550X
*See matrix for available extensions.
Features
· Dual Marked with Device Part Number and DSCC Drawing Number · Manufactured and Tested on a MIL-PRF-38534 Certified Line · QML-38534, Class H and K · Five Hermetically Sealed Package Configurations · Performance Guaranteed, Over -55°C to +125°C · High Speed: Typically 400 kBit/s · 9 MHz Bandwidth · Open Collector Output · 2-18 Volt VCC Range · 1500 Vdc Withstand Test Voltage · High Radiation Immunity · 6N135, 6N136, HCPL-2530/ -2531, Function Compatibility · Reliability Data
· Analog Signal Ground Isolation (see Figures 7, 8, and 13) · Isolated Input Line Receiver · Isolated Output Line Driver · Logic Ground Isolation · Harsh Industrial Environments · Isolation for Test Equipment Systems
improve the speed up to a hundred times that of a conventional phototransistor optocoupler by reducing the base-collector capacitance. These devices are suitable for wide bandwidth analog applications, as well as for interfacing TTL to LSTTL or CMOS. Current Transfer Ratio (CTR) is 9% minimum at IF = 16 mA. The 18 V VCC
Description
These units are single, dual and quad channel, hermetically sealed optocouplers. The products are capable of operation and storage over the full military temperature range and can be purchased as either standard product or with full MIL-PRF-38534 Class Level H or K testing or from the appropriate DSCC Drawing. All devices are manufactured and tested on a MIL-PRF-38534 certified line and are included in the DSCC Qualified Manufacturers List QML-38534 for Hybrid Microcircuits. Each channel contains a GaAsP light emitting diode which is optically coupled to an integrated photon detector. Separate connections for the photodiodes and output transistor collectors
Truth Table
(Positive Logic) Input On (H) Off (L) Output L H
Functional Diagram
Multiple Channel Devices Available
VCC VB VO
Applications
· Military and Space · High Reliability Systems · Vehicle Command, Control, Life Critical Systems · Line Receivers · Switching Power Supply · Voltage Level Shifting
GND
The connection of a 0.1 µF bypass capacitor between VCC and GND is recommended. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
2
capability will enable the designer to interface any TTL family to CMOS. The availability of the base lead allows optimized gain/ bandwidth adjustment in analog applications. The shallow depth of the IC photodiode provides better radiation immunity than conventional phototransistor couplers. These products are also available with the transistor base node connected to improve common mode noise immunity and ESD susceptibility. In addition, higher CTR minimums are available by special request.
Package styles for these parts are 8 and 16 pin DIP through hole (case outlines P and E respectively), 16 pin DIP flat pack (case outline F), and leadless ceramic chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options, see Selection Guide Table for details. Standard Microcircuit Drawing (SMD) parts are available for each package and lead style. Because the same functional die (emitters and detectors) are used for each channel of each device
listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the figures are identical for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other part's performance for die related reliability and certain limited radiation test results.
Selection GuidePackage Styles and Lead Configuration Options
Package Lead Style Channels Common Channel Wiring Agilent Part # & Options Commercial MIL-PRF-38534, Class H MIL-PRF-38534, Class K Standard Lead Finish Solder Dipped Butt Cut/Gold Plate Gull Wing/Soldered Class H SMD Part # Prescript for all below Either Gold or Solder Gold Plate Solder Dipped Butt Cut/Gold Plate Butt Cut/Soldered Gull Wing/Soldered Prescript for all below Either Gold or Solder Gold Plate Solder Dipped Butt Cut/Gold Plate Butt Cut/Soldered Gull Wing/Soldered
*JEDEC registered part.
16 Pin DIP Through Hole 2 None 4N55* 4N55/883B HCPL-257K Gold Plate Option #200 Option #100 Option #300 59628767901EX 8767901EC 8767901EA 8767901UC 8767901UA 8767901TA 59628767905KEX 8767905KEC 8767905KEA 8767905KUC 8767905KUA 8767905KTA
8 Pin DIP Through Hole 1 None HCPL-5500 HCPL-5501 HCPL-550K Gold Plate Option #200 Option #100 Option #300 59629085401HPX 9085401HPC 9085401HPA 9085401HYC 9085401HYA 9085401HXA 59629085401KPX 9085401KPC 9085401KPA 9085401KYC 9085401KYA 9085401KXA
8 Pin DIP Through Hole 2 VCC GND HCPL-5530 HCPL-5531 HCPL-553K Gold Plate Option #200 Option #100 Option #300 59628767902PX 8767902PC 8767902PA 8767902YC 8767902YA 8767902XA 59628767906KPX 8767906KPC 8767906KPA 8767906KYC 8767906KYA 8767906KXA
16 Pin Flat Pack Unformed Leads 4 VCC GND HCPL-6550 HCPL-6551 HCPL-655K Gold Plate
20 Pad LCCC Surface Mount 2 None HCPL-6530 HCPL-6531 HCPL-653K Solder Pads
59628767904FX 8767904FC
596287679032X 87679032A
59628767908KFX 8767908KFC
59628767907K2X 8767907K2A
3
8 Pin Ceramic DIP Single Channel Schematic
ANODE 2 + IF ICC 8 IB IO 7 6 VCC VB VO
VF CATHODE 3
5
GND
Note base pin 7.
Functional Diagrams
16 Pin DIP Through Hole 2 Channels
1 VB1 VCC1 VO1 GND 16
8 Pin DIP Through Hole 1 Channel
8 Pin DIP Through Hole 2 Channels
16 Pin Flat Pack Unformed Leads 4 Channels
1 16
20 Pad LCCC Surface Mount 2 Channels
15 14 VCC2 19 20 VB2 VO2 GND2 VO1 GND1 VCC1 13 12
1
2 3 4 15
VCC VB VOUT
8
1
VCC VO1 VO2
8
2 VCC VO1 VO2 VO3 VO4 GND 15 14
2
14
7 6 5
2 3 4
7
3
3
13
6
4 13
2 3
10
4
5 VB2 VCC2 GND VO2 12
GND
GND
5
5 12
VB1 9 7 8
6 7 8
11 10 9
6 7 8
11 10 9
Note: 8 pin DIP and flat pack devices have common VCC and ground. 16 pin DIP and LCCC (leadless ceramic chip carrier) packages have isolated channels with separate VCC and ground connections.
Outline Drawings
16 Pin DIP Through Hole, 2 Channels
20.06 (0.790) 20.83 (0.820) 0.89 (0.035) 1.65 (0.065)
0.51 (0.020) MIN.
3.81 (0.150) MIN.
4
8.13 (0.320) MAX.
.45 (0.175) MAX.
0.20 (0.008) 0.33 (0.013)
2.29 (0.090) 2.79 (0.110)
0.51 (0.020) MAX.
7.36 (0.290) 7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
4
Leaded Device Marking
Agilent DESIGNATOR Agilent P/N DSCC SMD* DSCC SMD* PIN ONE/ ESD IDENT A QYYWWZ X XXXXX X XXXXXXX XX XXX 50434 COMPLIANCE INDICATOR,* DATE CODE, SUFFIX (IF NEEDED) COUNTRY OF MFR. Agilent CAGE CODE*
Leadless Device Marking
Agilent DESIGNATOR Agilent P/N PIN ONE/ ESD IDENT COUNTRY OF MFR. A QYYWWZ XXXXXX XXXX XXXXXXX XX 50434 * QUALIFIED PARTS ONLY COMPLIANCE INDICATOR,* DATE CODE, SUFFIX (IF NEEDED) DSCC SMD* DSCC SMD* Agilent CAGE CODE*
* QUALIFIED PARTS ONLY
Outline Drawings
16 Pin Flat Pack, 4 Channels
7.24 (0.285) 6.99 (0.275) .29 (0.090) MAX.
11.13 (0.438) 10.72 (0.422)
2.85 (0.112) MAX.
8.13 (0.320) MAX.
2
0.88 (0.0345) MIN. 9.02 (0.355) 8.76 (0.345)
9.40 (0.370) 9.91 (0.390) 0.76 (0.030) 1.27 (0.050)
1.27 (0.050) REF.
0.46 (0.018) 0.36 (0.014)
0.31 (0.012) 0.23 (0.009)
0.89 (0.035) 0.69 (0.027)
( 5.23 0.206) M AX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
20 Terminal LCCC Surface Mount, 2 Channels
8.70 (0.342) 9.10 (0.358) 4.95 (0.195) 5.21 (0.205) 1.78 (0.070) 2.03 (0.080) 1.02 (0.040) (3 PLCS) 1.14 (0.045) 1.40 (0.055) 8.70 (0.342) 9.10 (0.358) 4.95 (0.195) 5.21 (0.205)
8 Pin DIP Through Hole, 1 and 2 Channel
TERMINAL 1 IDENTIFIER 2.16 (0.085) C METALIZED ASTILLATIONS (20 PLCS) ( 0.64 (0.025) 20 PLCS) 0.51 (0.020)
0.51 (0.020) MIN.
1.78 (0.070) 2.03 (0.080)
3
8.13 (0.320) MAX. 7.16 (0.282) 7.57 (0.298) 4.32 (0.170) MAX.
.81 (0.150) MIN.
0.20 (0.008) 0.33 (0.013)
1.52 (0.060) 2.03 (0.080)
2.29 (0.090) 2.79 (0.110)
0.51 (0.020) MAX. NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
7.36 (0.290) 7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES). SOLDER THICKNESS 0.127 (0.005) MAX.
5
Hermetic Optocoupler Options
Option 100
Description Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details).
0.51 (0.020) MIN.
2.29 (0.090) 2.79 (0.110)
0.51 (0.020) MIN. 2.29 (0.090) 2.79 (0.110)
0.51 (0.020) MAX. NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
1
0.51 (0.020) MAX.
1
4.32 (0.170) MAX.
.14 (0.045) 1.40 (0.055)
4.32 (0.170) MAX.
.14 (0.045) 1.40 (0.055)
0.20 (0.008) 0.33 (0.013) 7.36 (0.290) 7.87 (0.310)
200
300
Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel product in 8 and 16 pin DIP. DSCC drawing part numbers contain provisions for lead finish. All leadless chip carrier devices are delivered with solder dipped terminals as a standard feature. Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details). This option has solder dipped leads.
0
0.51 (0.020) MIN. 2.29 (0.090) 2.79 (0.110)
0.51 (0.020) MAX.
1
4.57 (0.180) MAX.
.40 (0.055) 1.65 (0.065)
4.57 (0.180) MAX. 0.20 (0.008) 0.33 (0.013) 9.65 (0.380) 9.91 (0.390)
4.57 (0.180) MAX.
.51 (0.020) MIN. 2.29 (0.090) 2.79 (0.110)
1.40 (0.055) 1.65 (0.065) 0.51 (0.020) MAX.
5° MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
Others parts begin by 4n
4N-1 4N-2
|
|
|
