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Part: 5962-8876801YC
Category:
Description: Class H DSCC SMD 5962-8876801 With Butt Joint Lead Form
Company: Agilent Technologies, Inc.
Datasheet: Download 5962-8876801YC datasheet File size : 117 kB
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Datasheet text preview:
Hermetically Sealed, Low IF, Wide VCC, Logic Gate Optocouplers Technical Data
HCPL-520x* 5962-88768 HCPL-523x HCPL-623x HCPL-625x 5962-88769
*See matrix for available extensions.
Features
· Dual Marked with Device Part Number and DSCC Standard Microcircuit Drawing · Manufactured and Tested on a MIL-PRF-38534 Certified Line · QML-38534, Class H and K · Four Hermetically Sealed Package Configurations · Performance Guaranteed over -55°C to +125°C · Wide VCC Range (4.5 to 20 V) · 350 ns Maximum Propagation Delay · CMR: > 10,000 V/µs Typical · 1500 Vdc Withstand Test Voltage · Three State Output Available · High Radiation Immunity · HCPL-2200/31 Function Compatibility · Reliability Data Available · Compatible with LSTTL, TTL, and CMOS Logic
· Isolated Bus Driver (Single Channel) · Pulse Transformer Replacement · Ground Loop Elimination · Harsh Industrial Environments · Computer-Peripheral Interfaces
eliminates the potential for output signal chatter. The detector in the single channel units has a tri-state output stage
Truth Tables
(Positive Logic) Multichannel Devices Input Output On (H) H Off (L) L
Description
These units are single, dual and quad channel, hermetically sealed optocouplers. The products are capable of operation and storage over the full military temperature range and can be purchased as either standard product or with full MIL-PRF-38534 Class Level H or K testing or from the appropriate DSCC Drawing. All devices are manufactured and tested on a MIL-PRF-38534 certified line and are included in the DSCC Qualified Manufacturers List QML-38534 for Hybrid Microcircuits. Each channel contains an AlGaAs light emitting diode which is optically coupled to an integrated high gain photon detector. The detector has a threshold with hysteresis which provides differential mode noise immunity and
Single Channel DIP Input Enable On (H) H Off (L) H On (H) L Off (L) L
Output Z Z H L
Functional Diagram
Multiple Channel Devices Available
VCC VO
Applications
· Military and Space · High Reliability Systems · Transportation and Life Critical Systems · High Speed Line Receiver
VE GND
A 0.1 µF bypass capacitor must be connected between VCC and GND pins.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
2
which allows for direct connection to data buses. The output is noninverting. The detector IC has an internal shield that provides a guaranteed common mode transient immunity of up to 10,000 V/µs. Improved power supply rejection eliminates the need for special power supply bypass precautions. Package styles for these parts are 8 pin DIP through hole (case outline P), 16 pin DIP flat pack (case outline F), and leadless
ceramic chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options, see Selection Guide Table for details. Standard Microcircuit Drawing (SMD) parts are available for each package and lead style. Because the same electrical die (emitters and detectors) are used for each channel of each device listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical
specifications, and performance characteristics shown in the figures are identical for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other part's performance for die related reliability and certain limited radiation test results.
Selection GuidePackage Styles and Lead Configuration Options
Package Lead Style Channels Common Channel Wiring Agilent Part # & Options Commercial MIL-PRF-38534, Class H MIL-PRF-38534, Class K Standard Lead Finish Solder Dipped Butt Cut/Gold Plate Gull Wing/Soldered Class H SMD Part # Prescript for all below Either Gold or Solder Gold Plate Solder Dipped Butt Cut/Gold Plate Butt Cut/Soldered Gull Wing/Soldered Class K SMD Part # Prescript for all below Either Gold or Solder Gold Plate Solder Dipped Butt Cut/Gold Plate Butt Cut/Soldered Gull Wing/Soldered 8 Pin DIP Through Hole 1 None 8 Pin DIP Through Hole 2 VCC, GND 16 Pin Flat Pack Unformed Leads 4 VCC, GND 20 Pad LCCC Surface Mount 2 None
HCPL-5200 HCPL-5201 HCPL-520K Gold Plate Option #200 Option #100 Option #300 59628876801PX 8876801PC 8876801PA 8876801YC 8876801YA 8876801XA 59628876802KPX 8876802KPC 8876802KPA 8876802KYC 8876802KYA 8876802KXA
HCPL-5230 HCPL-5231 HCPL-523K Gold Plate Option #200 Option #100 Option #300 59628876901PX 8876901PC 8876901PA 8876901YC 8876901YA 8876901XA 59628876904KPX 8876904KPC 8876904KPA 8876904KYC 8876904KYA 8876904KXA
HCPL-6250 HCPL-6251 HCPL-625K Gold Plate
HCPL-6230 HCPL-6231 HCPL-623K Soldered Pads
59628876903FX 8876903FC
596288769022X 88769022A
59628876906KFX 8876906KFC
59628876905K2X 8876905K2A
3
Functional Diagrams
8 Pin DIP Through Hole 1 Channel 8 Pin DIP Through Hole 2 Channels 16 Pin Flat Pack Unformed Leads 4 Channels
1 16 VCC 15 VO1 14 VO2 13 VO3 12 VO4 11 GND 10 9
20 Pad LCCC Surface Mount 2 Channels
15 VCC2 19 20 VO2 GND2 VO1 GND1 7 8 VCC1 13 12
1 2 3 4
VCC VO
8 7 6 5
1 2 3 4
VCC VO1
8 7
2 3 4
VO2
VE GND
6 5
5 6 7 8
2 3
10
GND
Note: Multichannel DIP and flat pack devices have common VCC and ground. Single channel DIP has an enable pin 6. LCCC (leadless ceramic chip carrier) package has isolated channels with separate VCC and ground connections.
Outline Drawings
16 Pin Flat Pack, 4 Channels
7.24 (0.285) 6.99 (0.275)
.29 (0.090) MAX.
11.13 (0.438) 10.72 (0.422)
2.85 (0.112) MAX.
8.13 (0.320) MAX.
2
0.88 (0.0345) MIN. 9.02 (0.355) 8.76 (0.345)
1.27 (0.050) REF.
0.46 (0.018) 0.36 (0.014)
0.31 (0.012) 0.23 (0.009)
0.89 (0.035) 0.69 (0.027)
( 5.23 0.206) M AX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
20 Terminal LCCC Surface Mount, 2 Channels
8.70 (0.342) 9.10 (0.358) 4.95 (0.195) 5.21 (0.205) 1.78 (0.070) 2.03 (0.080) 1.02 (0.040) (3 PLCS) 1.14 (0.045) 1.40 (0.055) 8.70 (0.342) 9.10 (0.358) 4.95 (0.195) 5.21 (0.205) 1.78 (0.070) 2.03 (0.080) ( 0.64 (0.025) 20 PLCS) 1.52 (0.060) 2.03 (0.080)
8 Pin DIP Through Hole, 1 and 2 Channel
9.40 (0.370) 9.91 (0.390) 0.76 (0.030) 1.27 (0.050) 8.13 (0.320) MAX. 7.16 (0.282) 7.57 (0.298) 4.32 (0.170) MAX.
TERMINAL 1 IDENTIFIER 2.16 (0.085) C METALIZED ASTILLATIONS (20 PLCS) 0.51 (0.020)
0.51 (0.020) MIN.
3
.81 (0.150) MIN.
0.20 (0.008) 0.33 (0.013)
2.29 (0.090) 2.79 (0.110)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES). SOLDER THICKNESS 0.127 (0.005) MAX.
0.51 (0.020) MAX. NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
7.36 (0.290) 7.87 (0.310)
4
Leaded Device Marking
Agilent LOGO Agilent P/N DSCC SMD* DSCC SMD* PIN ONE/ ESD IDENT A QYYWWZ X XXXXX X XXXXXXX XX XXX 50434 COMPLIANCE INDICATOR,* DATE CODE, SUFFIX (IF NEEDED) COUNTRY OF MFR. Agilent FSCN*
Leadless Device Marking
Agilent LOGO Agilent P/N PIN ONE/ ESD IDENT COUNTRY OF MFR. A QYYWWZ XXXXXX XXXX XXXXXXX XX 50434 COMPLIANCE INDICATOR,* DATE CODE, SUFFIX (IF NEEDED) DSCC SMD* DSCC SMD* Agilent FSCN*
*QUALIFIED PARTS ONLY
*QUALIFIED PARTS ONLY
Hermetic Optocoupler Options
Option 100
Description Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for details).
0.51 (0.020) MIN. 2.29 (0.090) 2.79 (0.110)
0.51 (0.020) MAX. NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
1
4.32 (0.170) MAX.
.14 (0.045) 1.40 (0.055)
0.20 (0.008) 0.33 (0.013) 7.36 (0.290) 7.87 (0.310)
200
300
Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel product in 8 pin DIP. DSCC Drawing part numbers contain provisions for lead finish. All leadless chip carrier devices are delivered with solder dipped terminals as a standard feature. Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for details). This option has solder dipped leads.
0
4.57 (0.180) MAX. 0.20 (0.008) 0.33 (0.013) 9.65 (0.380) 9.91 (0.390)
4.57 (0.180) MAX.
.51 (0.020) MIN. 2.29 (0.090) 2.79 (0.110)
1.40 (0.055) 1.65 (0.065) 0.51 (0.020) MAX.
5° MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
5
Absolute Maximum Ratings
Storage Temperature Range, TS .......... -65°C to +150°C Operating Temperature, TA ........ -55°C to +125°C Case Temperature, TC ....... +170°C Junction Temperature, TJ .......... +175°C Lead Solder Temperature .... 260°C for 10 s Average Forward Curre, IF AVG (each channel) ..... 8 mA Peak Input Current, IF PK (each channel) ....... 20 mA[1] Reverse Input Voltage, VR (each channel) ...... 3 V Supply Voltage ,VCC .... 0.0 V min., 20 V max. Average Output Current, IO (each channel) ......... 15 mA Output Voltage, VO (each channel) ........... 0.3 V min., 20 V max. Package Power Dissipation, Pd (each channel) ....... 200 mW Single Channel Product Only Tri-State Enable Voltage, VE ....... 0.3 V min., 20 V max.
8 Pin Ceramic DIP Single Channel Schematic
ANODE
CATHODE
Note enable pin 6. An external 0.01 µF to 0.1 µF bypass capacitor is recommended between VCC and ground for each package type.
ESD Classification
(MIL-STD-883, Method 3015) HCPL-5200/01/0K, HCPL-6230/31/3K ........ ( ), Class 1 HCPL-5230/31/3K, HCPL-6250/51/5K .... (Dot), Class 3
Recommended Operating Conditions
Parameter Power Supply Voltage Input Current, High Level, Each Channel Input Voltage, Low Level, Each Channel Fan Out (TTL Load) Each Channel Symbol VCC IFH VFL N Min. 4.5 2 0 Max. 20 8 0.8 4 Units V mA V
Single Channel Product Only High Level Enable Voltage VEH Low Level Enable Voltage VEL
2.0 0
20 0.8
V V
Others parts begin by 59
59-1 59-2 59-3 59-4 59-5 59-6 59-7 59-8 59-9 59-10 59-11 59-12 59-13 59-14 59-15 59-16 59-17 59-18 59-19 59-20 59-21 59-22 59-23 59-24 59-25
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