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Part: 6N134-883B300
Category:
Description: Hermetically Sealed, High Speed, High Cmr, Logic Gate Optocouplers
Company: Agilent Technologies, Inc.
Datasheet: Download 6N134-883B300 datasheet File size : 144 kB
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Datasheet text preview:
Hermetically Sealed, High Speed, High CMR, Logic Gate Optocouplers Technical Data
6N134* 81028 HCPL-563X HCPL-663X HCPL-565X
5962-98001 HCPL-268K HCPL-665X 5962-90855 HCPL-560X
*See matrix for available extensions.
Features
· Dual Marked with Device Part Number and DSCC Drawing Number · Manufactured and Tested on a MIL-PRF-38534 Certified Line · QML-38534, Class H and K · Five Hermetically Sealed Package Configurations · Performance Guaranteed over -55°C to +125°C · High Speed: 10 M Bit/s · CMR: > 10,000 V/µs Typical · 1500 Vdc Withstand Test Voltage · 2500 Vdc Withstand Test Voltage for HCPL-565X · High Radiation Immunity · 6N137, HCPL-2601, HCPL2630/-31 Function Compatibility · Reliability Data · TTL Circuit Compatibility
· · · · · ·
Line Receiver Voltage Level Shifting Isolated Input Line Receiver Isolated Output Line Driver Logic Ground Isolation Harsh Industrial Environments · Isolation for Computer, Communication, and Test Equipment Systems
Truth Table
(Positive Logic) Multichannel Devices Input On (H) Off (L) Output L H
Single Channel DIP Input On (H) Off (L) On (H) Off (L) Enable H H L L Output L H H H
Description
These units are single, dual and quad channel, hermetically sealed optocouplers. The products are capable of operation and storage over the full military temperature range and can be purchased as either standard product or with full MIL-PRF-38534 Class Level H or K testing or from the appropriate DSCC Drawing. All devices are manufactured and tested on a MIL-PRF-38534 certified line and are included in the DSCC Qualified Manufacturers List QML38534 for Hybrid Microcircuits. Quad channel devices are available by special order in the 16 pin DIP through hole packages.
Functional Diagram
Multiple Channel Devices Available
VCC VE VOUT
Applications
· Military and Space · High Reliability Systems · Transportation, Medical, and Life Critical Systems
GND
The connection of a 0.1 µF bypass capacitor between VCC and GND is recommended. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
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Each channel contains a GaAsP light emitting diode which is optically coupled to an integrated high speed photon detector. The output of the detector is an open collector Schottky clamped transistor. Internal shields provide a guaranteed common mode transient immunity specification of 1000 V/µs. For Isolation Voltage applications requiring up to 2500 Vdc, the HCPL-5650 family is also available. Package styles for these parts are 8 and 16 pin DIP through hole (case outlines P and
E respectively), and 16 pin surface mount DIP flat pack (case outline F), leadless ceramic chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options. See Selection Guide Table for details. Standard Microcircuit Drawing (SMD) parts are available for each package and lead style. Because the same electrical die (emitters and detectors) are used for each channel of each device listed in this data sheet, absolute
maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the figures are identical for all parts. Occasional exceptions exist due to package variations and limitations, and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other parts' performance for reliability and certain limited radiation test results.
Selection GuidePackage Styles and Lead Configuration Options
Package Lead Style Channels Common Channel Wiring Withstand Test Voltage
Agilent Part # & Options
16 Pin DIP 8 Pin DIP 8 Pin DIP 8 Pin DIP 16 Pin Flat Pack 20 Pad LCCC Through Hole Through Hole Through Hole Through Hole Unformed Leads Surface Mount 2 VCC, GND 1500 Vdc 6N134* HCPL-268K Gold Plate Option #200 Option #100 Option #300 None 8102801EX 8102801EC 8102801EA 8102801UC 8102801UA 8102801TA 59621 None 1500 Vdc HCPL-5600 HCPL-5601 HCPL-560K Gold Plate Option #200 Option #100 Option #300 59629085501HPX 9085501HPC 9085501HPA 9085501HYC 9085501HYA 9085501HXA 59622 VCC, GND 1500 Vdc HCPL-5630 HCPL-5631 HCPL-563K Gold Plate Option #200 Option #100 Option #300 None 8102802PX 8102802PC 8102802PA 8102802YC 8102802YA 8102802ZA 596259629800104KFX 9800104KFC 9800103K2A 59629800103K2X None 8102805PX 8102805PC 8102805PA None 8102804FX 8102804FC 81028032A None 81028032X Gold Plate Option #200 2 VCC, GND 2500 Vdc HCPL-5650 HCPL-5651 4 VCC, GND 1500 Vdc HCPL-6650 HCPL-6651 HCPL-665K Gold Plate 2 None 1500 Vdc HCPL-6630 HCPL-6631 HCPL-663K Solder Pads
Commercial MIL-PRF-38534, Class K Standard Lead Finish Solder Dipped Butt Cut/Gold Plate Gull Wing/Soldered Class H SMD Part # Prescript for all below Either Gold or Solder Gold Plate Solder Dipped Butt Cut/Gold Plate Butt Cut/Soldered Gull Wing/Soldered Class K SMD Part # Prescript for all below Either Gold or Solder Gold Plate Solder Dipped Butt Cut/Gold Plate Butt Cut/Soldered Gull Wing/Soldered
*JEDEC registered part.
MIL-PRF-38534, Class H 6N134/883B
9800101KEX 9085501KPX 9800102KPX 9800101KEC 9085501KPC 9800102KPC 9800101KEA 9085501KPA 9800102KPA 9800101KUC 9085501KYC 9800102KYC 9800101KUA 9085501KYA 9800102KYA 9800101KTA 9085501KXA 9800102KZA
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Functional Diagrams
16 Pin DIP Through Hole 2 Channels
1 2 3 4 5 6 7 8 GND VO2 VCC VO1 16 15 14 13 12 11 10 9 3 4 1 2 VCC VE VOUT 6 5 8 7
1 VCC VO1 VO2 8
8 Pin DIP Through Hole 1 Channel
8 Pin DIP Through Hole 2 Channels
16 Pin Flat Pack Unformed Leads 4 Channels
1 2 3 4
6
20 Pad LCCC Surface Mount 2 Channels
15 VCC2 19 20 VO2 GND2 VO1 GND1 7 8 VCC1 13 12
16 VCC VO1 VO2 VO3 VO4 GND 15 14 13 12 11 10 9
2 3
2 3 4
7
5
GND 5
10
6 7 8
GND
Note: All DIP and flat pack devices have common VCC and ground. Single channel DIP has an enable pin 7. LCCC (leadless ceramic chip carrier) package has isolated channels with separate VCC and ground connections. All diagrams are "top view."
Outline Drawings
16 Pin DIP Through Hole, 2 Channels
20.06 (0.790) 20.83 (0.820) 0.89 (0.035) 1.65 (0.065)
0.51 (0.020) MIN.
3.81 (0.150) MIN.
4
8.13 (0.320) MAX.
.45 (0.175) MAX.
0.20 (0.008) 0.33 (0.013)
2.29 (0.090) 2.79 (0.110)
0.51 (0.020) MAX.
7.36 (0.290) 7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
Leaded Device Marking
Agilent DESIGNATOR Agilent P/N DSCC SMD* DSCC SMD* PIN ONE/ ESD IDENT A QYYWWZ X XXXXX X XXXXXXX XX XXX · 50434 COMPLIANCE INDICATOR,* DATE CODE, SUFFIX (IF NEEDED) COUNTRY OF MFR. Agilent CAGE CODE*
Leadless Device Marking
Agilent DESIGNATOR Agilent P/N PIN ONE/ ESD IDENT COUNTRY OF MFR. A QYYWWZ XXXXXX · XXXX XXXXXXX XX 50434 COMPLIANCE INDICATOR,* DATE CODE, SUFFIX (IF NEEDED) DSCC SMD* DSCC SMD* Agilent CAGE CODE*
* QUALIFIED PARTS ONLY
* QUALIFIED PARTS ONLY
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Outline Drawings (continued)
8 Pin DIP Through Hole, 1 and 2 Channels 8 Pin DIP Through Hole, 2 Channels 2500 Vdc Withstand Test Voltage
9.40 (0.370) 9.91 (0.390) 0.76 (0.030) 1.27 (0.050)
9.40 (0.370) 9.91 (0.390) 0.76 (0.030) 1.27 (0.050)
0.51 (0.020) MIN.
3
8.13 (0.320) MAX. 7.16 (0.282) 7.57 (0.298) 4.32 (0.170) MAX.
.81 (0.150) MIN.
0.20 (0.008) 0.33 (0.013)
0.51 (0.020) MIN.
0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110)
7.36 (0.290) 7.87 (0.310) 2.29 (0.090) 2.79 (0.110)
3
8.13 (0.320) MAX. 7.16 (0.282) 7.57 (0.298)
5.08 (0.200) MAX.
.81 (0.150) MIN.
0.20 (0.008) 0.33 (0.013)
0.51 (0.020) MAX.
7.36 (0.290) 7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
16 Pin Flat Pack, 4 Channels
7.24 (0.285) 6.99 (0.275)
20 Terminal LCCC Surface Mount, 2 Channels
11.13 (0.438) 10.72 (0.422)
0.46 (0.018) 0.36 (0.014) 2.85 (0.112) MAX. 8.13 (0.320) MAX.
0.31 (0.012) 0.23 (0.009)
2
.29 (0.090) MAX.
1.78 (0.070) 2.03 (0.080)
8.70 (0.342) 9.10 (0.358) 4.95 (0.195) 5.21 (0.205) 1.02 (0.040) (3 PLCS) 1.14 (0.045) 1.40 (0.055) 8.70 (0.342) 9.10 (0.358) 4.95 (0.195) 5.21 (0.205)
TERMINAL 1 IDENTIFIER 2.16 (0.085) C METALLIZED ASTILLATIONS (20 PLCS) ( 0.64 (0.025) 20 PLCS) 0.51 (0.020)
1.27 (0.050) REF.
1.78 (0.070) 2.03 (0.080)
1.52 (0.060) 2.03 (0.080)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES). SOLDER THICKNESS 0.127 (0.005) MAX.
0.89 (0.035) 0.69 (0.027)
( 5.23 0.206) M AX.
0.88 (0.0345) MIN. 9.02 (0.355) 8.76 (0.345)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
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Hermetic Optocoupler Options
Option 100
Description Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details).
0.51 (0.020) MIN.
2.29 (0.090) 2.79 (0.110)
0.51 (0.020) MIN. 2.29 (0.090) 2.79 (0.110)
0.51 (0.020) MAX. NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
1
0.51 (0.020) MAX.
1
4.32 (0.170) MAX.
.14 (0.045) 1.40 (0.055)
4.32 (0.170) MAX.
.14 (0.045) 1.40 (0.055)
0.20 (0.008) 0.33 (0.013) 7.36 (0.290) 7.87 (0.310)
200
300
Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel product in 8 and 16 pin DIP. DSCC Drawing part numbers contain provisions for lead finish. All leadless chip carrier devices are delivered with solder dipped terminals as a standard feature. Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details). This option has solder dipped leads.
0
0.51 (0.020) MIN. 2.29 (0.090) 2.79 (0.110)
0.51 (0.020) MAX.
1
4.57 (0.180) MAX.
.40 (0.055) 1.65 (0.065)
4.57 (0.180) MAX. 0.20 (0.008) 0.33 (0.013) 9.65 (0.380) 9.91 (0.390)
4.57 (0.180) MAX.
.51 (0.020) MIN. 2.29 (0.090) 2.79 (0.110)
1.40 (0.055) 1.65 (0.065) 0.51 (0.020) MAX.
5° MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
Others parts begin by 6n
6N-1
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