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Details, datasheet, quote on part number:HSDL-3310
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| Part: | HSDL-3310 |
| Category: | Optoelectronics => Drivers/Controllers => Infrared/Remote Control => Remote Control |
| Description: | Irda 1.3 Data Compliant 1.15Mb/s 3-5V Infrared Transceiver |
| Company: | Agilent Technologies, Inc. |
| Datasheet: | Download HSDL-3310 datasheet File size : 278 kB |
| Request For quote: | Find where to buy HSDL-3310
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Datasheet text preview:
Agilent HSDL-3310 IrDA® Data Compliant 1.152 Mb/s Infrared Transceiver
Data Sheet
Functional Description The HSDL-3310 is a small form factor infrared (IR) transceiver module that provides interface between logic and IR signals for through-air, serial, half-duplex IR data link. The module is compliant to IrDA physical layer specifications 1.3 and is IEC 825-Class 1 eye safe. The HSDL-3310 is designed to interface with input/output logic circuits as low as 1.8 V.
The HSDL-3310 can be shut down completely to achieve very low power consumption. In the shutdown mode, the PIN diode will be inactive and thus producing very little photocurrent even under very bright ambient light. Also, HSDL-3310 incorporates adjustable optical power feature to enhance low power consumption. Applications · Mobile telecommunication Cellular phone Pager Smart phone · Data communication PDA Printer · Digital imaging Digital camera Photo-imaging printer · Electronic wallet · Medical and industry data collection
Features · Fully compliant to IrDA 1.3 specifications: 2.4 kb/s to 1.152 Mb/s Excellent nose-to-nose operation Typical link distance > 1.5 m · Guaranteed temperature performance, 20 to 70 °C Critical parameters are guaranteed over specified temperatures and supply voltages · Low power consumption Low shutdown current (10 nA typical) Complete shutdown for TXD, RXD, and PIN diode · Input/output interfacing voltage of as low as 1.8 V · Small module size 4 x 10 x 5 mm max (H x W x D) · Adjustable optical power management Adjustable LED driver current for saving power while maintaining link integrity · Typically withstands >100 mVp-p power supply ripple · VCC supply 2.7 to 5.5 volts · Integrated EMI shield · LED stuck-high protection
CX2
Functional Block Diagram
CX1
R1 LEDA (9)
I/0 VCC (2) CX3
VCC (3)
TXD (8)
ADJUSTABLE O P TICAL P OWER
MD0 (5) MD1 (6) HSDL-3310
SHIELD
RXD (7)
MIR_SEL (4)
GND (1)
Pinout
REAR VIEW
9
8
7
6
5
4
3
2
1
I/O Pins Configuration Table Pin Symbol 1 2 3 4 5 6 7 8 9 GND I/OV CC VCC MIR_SEL MD0 MD1 RXD TXD LEDA SHIELD Description Ground Input/Output ASIC V CC Supply Voltage MIR Select Mode 0 Mode 1 Receiver Data Output. Active Low. Note Connect to system ground. Connect to ASIC logic controller V CC voltage or supply voltage. The voltage at this pin must be equal to or less than supply voltage. Regulated 2.7 to 5.5 volts. This pin to be driven high to select MIR mode and low for SIR mode. Do not float this pin. This pin must be driven either high or low. Do not float this pin. This pin must be driven either high or low. Do not float the pin. Output is a low pulse response when a light pulse is seen. Active low.
Transmitter Data Input. Logic high turns the LED on. If held high longer than ~ 50 µs, the LED is turned Active High. off. TXD must be either driven high or low. Do not float this pin. LED Anode EMI Shield Tied to external resistor, R1, to regulated VCC from 2.7 to 5.5 volts. Do not connect shield directly to ground pin; connect to system ground via a low inductance trace.
2
Transceiver Control Truth Table MD0 1 0 0 1 0 0 1 MD1 0 0 1 1 0 1 1 MIR_SEL X 0 0 0 1 1 1 RXD Shutdown SIR SIR SIR MIR MIR MIR TXD Shutdown Full Distance Power 50 cm Distance Power 30 cm Distance Power Full Distance Power 50 cm Distance Power 30 cm Distance Power
X = Don't care
Transceiver I/O Truth Table Inputs Transceiver Mode Active Active Active Active Shutdown
X = Don't care
Outputs EI X EI H [1] EI H [2] EI L Low (Off) IE (LED) High (On) Low (Off) Low (Off) Low (Off) Low (Off) RXD NV Low [3] Low [3] High NV [5]
MIR_SEL X 0 1 X X
TXD V IH V IL V IL V IL X[4]
NV = Not valid
EI = In-Band infrared intensity at detector
Notes: 1. In-Band EI 115.2 kb/s and MIR_SEL=0 2. In-Band EI 0.576 Mb/s and MIR_SEL=1 3. Logic low is a pulsed response. 4. To maintain low shutdown current, TXD needs to be driven high or low and not to be left floating. 5. RXD is internally pull-up to VCC through high impedance PMOS transistor (equivalent impedance is greater than 300 k).
Recommended Application Circuit Components Component R1 Recommended Value 2.2 ± 5%, 0.5 Watt, for 2.7 VCC 3.3 V operation 2.7 ± 5%, 0.5 Watt, for 3.0 VCC 3.6 V operation 5.6 ± 5%, 0.5 Watt, for 4.5 VCC 5.5 V operation 0.47 µF ± 20%, X7R Ceramic 6.8 µF ± 20%, Tantalum
CX1 [1], CX3 CX2 [2]
Notes: 1. CX1 must be placed within 0.7 cm from HSDL-3310 for optimum noise immunity. 2. When using with noisy power supplies, supply rejection can be enhanced by including CX2 as shown in "HSDL-3310 Functional Block Diagram."
Caution: The component is susceptibile to damage from electrostatic discharge. It is advised that normal static precautions be taken during handling and assembling of this component to prevent damage and/or degradation, which may be caused by ESD.
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