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Details, datasheet, quote on part number:HSMF-C118
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Datasheet text preview:
Agilent HSMF-C118 TriColor ChipLED
Data Sheet
Features · Common anode · Small 3.2 x 2.7 x 1.1 mm package · Diffused optics · Red/Green/Blue color combination · Available in 8 mm tape on 7 inch (178 mm) diameter reels · High brightness using AlInGaP and InGaN die technology Description The HSMF-C118 tricolor chip-type LED is designed in an ultra small package for miniaturization. It is the first of its kind to achieve such small packaging for 3 dies. With the freedom to have any combination of colors from mixing of the 3 primary colors, this will yield a wide variety of colors to suit every application and product theme. · Compatible with reflow soldering The small size, narrow footprint, and low profile make this LED excellent for back-lighting, status indication, and front panel illumination applications. In order to facilitate pick and place operation, this ChipLED is shipped in tape and reel, with 3000 units per reel. The package is compatible with IR soldering and binned by both color and intensity. Applications · Backlighting · Status indicator · Front panel indicator · Office automation, home appliances, industrial equipment
CAUTION: HSMF-C118 is Class 1 ESD sensitive per MIL-STD-1686. Please observe appropriate precautions during handling and processing. Refer to Agilent Technologies Application Note AN-1142 for additional details.
Package Dimensions
LED DIE
3
A
2 ( 1.5 0.059)
0 ( 2.7 0.106)
4
1
3.2 (0.126 )
A COMMON NODE
( 2.0 0.079) ( 0.6 0.024) DIFEUSED F POXY 1.1 (0.043) PC BOARD R 0.5 (0.020)
2
1
4 3 ED GREEN BLUE POLARITY
( 0.7 0.028)
NODE MARK
1.1 (0.043)
(
.5 0.020)
HSMF-C118
1 NOTES: . DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE NOTED.
2
Absolute Maximum Ratings at TA = 25°C Parameter DC Forward Current[1, 3, 4] Power Dissipation[1] DC Forward Current[2] Power Dissipation[2] Reverse Voltage (I R = 100 µA) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature AlInGaP Red 20 48 15 36 5 95 InGaN Green 20 78 15 59 5 95 40 to +85 40 to +85 See IR soldering profile (Figure 6) InGaN Blue 20 78 15 59 5 95 Units mA mW mA mW V °C °C °C
Notes: 1. Applies when single LED is lit up. 2. Applies when all 3 LEDs are lit up simultaneously. 3. Derate linearly as shown in Figure 4. 4. Drive currents above 5 mA are recommended for best long term performance.
Electrical Characteristics at TA = 25°C Reverse Breakdown VR (Volts) @ IR = 100 µA Min. 5 5 5 Capacitance C (pF), @ VF = 0, f = 1 MHz Typ. 17 110 110 Thermal Resistance RJ-PIN (°C/W) Typ. 400 450 450
Color AlInGaP Red InGaN Green InGaN Blue
Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. 1.9 2.4 3.5 3.9 3.5 3.9
Optical Characteristics at TA = 25°C Peak Wavelength peak (nm) Typ. 637 523 468 Color, Dominant Wavelength d[2] (nm) Typ. 626 525 470 Luminous Efficacy v (lm/W) Typ. 155 490 80
Color AlInGaP Red InGaN Green InGaN Blue
Luminous Intensity Iv (mcd) @ IF = 20 mA[1] Min. Typ. 25 90 40 120 10 40
Viewing Angle 2 1/2 Degrees[3] Typ. 135 130 125
Notes: 1. The luminous intensity, I v, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, d, is derived from the CIE Chromatically Diagram and represents the perceived color of the device. 3. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
CAUTION: 1. The above optical performance specifications are valid in the case when single LED is lit up.
2. The above product specifications DO NOT provide any guarantee on color mixing, color consistency over time, or uniformity in luminous intensity when more than 1 LED is lit.
3. Please refer to Agilent Technologies' Application Brief AB D-007 for additional details/explanation on driving the part in parallel circuit.
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