Digchip : Database on electronics components
Electronic components database
Search:                      In section:
Member, Distributor  
Log In
Email:
Password:

Details, datasheet, quote on part number:HSMF-C155
 
 
Part:HSMF-C155
Category:Optoelectronics => Display => LEDs => LED Lamps
Description:Surface Mount Chipleds HSMF-C155
Company:Agilent Technologies, Inc.
Datasheet:Download HSMF-C155 datasheet   File size : 211 kB
Request For quote:  Find where to buy HSMF-C155
 



Datasheet text preview:
Surface Mount Chip LEDs Technical Data
HSMF-C155/C156/C157
Features
· · · · · Small Size Industry Standard Footprint Compatible with IR Solder Diffused Optics Operating Temperature Range of ­30°C to +85°C · Three Color Combinations Available: Red/Green, Yellow/Green, and Orange/Green. · Available in 8 mm Tape on 7 in. (178 mm) Diameter Reels
Description
The HSMF-C15x series of bicolor chip-type LEDs is designed in an industry standard package for ease of handling and use. These bicolor LEDs are available as high efficiency red/green, yellow/ green and orange/green. The HSMF-C15x has the widely used 3.2 x 2.7 mm footprint and wide viewing angle make this LED exceptional for backlighting applications. All packages are compatible with IR reflow solder processes. The small size and wide viewing angle make these LEDs prime choices for backlighting applications and front panel indicators especially where space is a premium.
Applications
· · · · Push-Button Backlighting Symbol Backlighting Status Indicator Front Panel Indicator
Device Selection Guide
Part Number HSMF-C155 HSMF-C156 HSMF-C157 Color Combinations High Efficiency Red/Green Yellow/Green Orange/Green Parts Per Reel 3000 3000 3000
2
Package Dimensions
LED DIE M CATHODE ARK
0
1
2 ( 1.4 0.055) ( 2.7 0.106)
3 4
.2 (0.126 )
( 0.60 0.024) DIFEUSED F POXY
( 2.00 0.079)
PART NUMBER POLARITY HSMF-C-155
1.10 (0.043) PC BOARD
HSMF-C-156 GREEN YELLOW
HSMF-C-157 GREEN ORANGE
1
2 4
GREEN RED
( 0.55 0.022) R 0.25 (0.010) T YP.
( .40 0.016)
4 ­ 0.05 (0.002) MAX.
3
3
0.50 (0.020)
POSITION OF COLOR SOURCE ON DEVICE
( 0.55 0.022)
SOLDERING T ERMINAL 1.10 (0.043)
( 0.40 0.016)
1 NOTES: . ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
HSMF-C155/C156/C157
3
Absolute Maximum Ratings at TA=25°C
Parameter DC Forward Current[1] Peak Pulsing Current[2] Power Dissipation Reverse Voltage (IR = 100 µA) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature HSMF-C155/C156/C157 Units 25 mA 100 mA 65 mW 5 V 95 °C ­30 to +85 °C ­40 to +85 °C See IR soldering profile (Figure 6)
Notes: 1. Derate linearly as shown in Figure 4 for temperature above 25°C. 2. Pulse condition of 1/10 duty and 0.1 msec. width.
Optical Characteristics at TA=25°C
Color HER Orange Yellow Green Luminous I n t e n s i t y[1] Iv(mcd) @ 20mA Min. Typ. 2.50 10.0 2.50 8.0 2.50 8.0 4.00 15.0 Peak Wavelength peak(nm) Typ. 630 605 589 570 Dominant Wavelength d(nm) Typ. 626 604 586 572 Viewing Angle 2 1/2 Degrees[2] Typ. 170 170 170 170
Notes: 1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Electrical Characteristics at TA=25 °C
Color HER Orange Yellow Green Forward Voltage VF(V) @ IF= 20 mA Typ. Max. 2.1 2.6 2.2 2.6 2.1 2.6 2.2 2.6 Reverse Capacitance Breakdown V R (V) C(pF) @ IR = 100 µA @ VF = 0, f = 1Mhz Min. Typ. 5 5 5 7 5 6 5 9 Thermal Resistance R J-P (°C/W) Typ. 325 325 325 325
Note: The bicolor package contains two individual light sources of different color. The specifications above refer to each color of a particular package.