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Part: QFBR-1149
Category:
Description: HFBR-5204/5205 Series - Atm Multimode Fiber Transceivers For Sonet OC-3/SDH STM-1 in Low Cost 1x9 Package Style
Company: Agilent Technologies, Inc.
Datasheet: Download QFBR-1149 datasheet File size : 211 kB
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Datasheet text preview:
ATM Multimode Fiber Transceivers for SONET OC-3/SDH STM-1 in Low Cost 1x9 Package Style Data Sheet
Features
· Full Compliance with ATM Forum UNI SONET OC-3 Multimode Fiber Physical Layer Specification · Multisourced 1 x 9 Package Style with Choice of Duplex SC or Duplex ST* Receptacle · Wave Solder and Aqueous Wash Process Compatibility · Manufactured in an ISO 9002 Certified Facility
HFBR-5204/-5204P/-5204T 1300 nm 500 m HFBR-5205/-5205A/ -5205AT/-5205P/-5205T/ -5205PE 1300 nm 2 km
These transceivers are all supplied in the new industry standard 1x9 SIP package style with either a duplex SC or a duplex ST* connector interface. ATM 2000 m Backbone Links The HFBR-5205/-5205T are 1300 nm products with optical performance compliant with the SONET STS-3c (OC-3) Physical Layer Interface Specification. This physical layer is defined in the ATM Forum User-Network Interface (UNI) Specification Version 3.0. This document references the ANSI T1E1.2 specification for the details of the interface for 2000 meter multimode fiber backbone links. Selected versions of these transceivers may be used to implement the ATM Forum UNI Physical Layer Interface at the 155 Mbps/194 MBd rate. The ATM 100 Mbps/125 MBd Physical Layer interface is best implemented with the HFBR-5100 family of FDDI Transceivers which are specified for use in this 4B/5B encoded physical layer per the FDDI PMD standard.
Applications
· Multimode Fiber ATM Backbone Links · Multimode Fiber ATM Wiring Closet to Desktop Links · ATM 155 Mbps/194 MBd Encoded Links (available upon special request)
ATM 500 m Backbone and Desktop Links The HFBR-5204/-5204T are 1300 nm products which are similar to the HFBR-5205/5205T except that they are intended to provide a lower cost SONET OC-3 link to distances up to 500 meters in 62.5/125 µm multimode fiber optic cables. Transmitter Sections The transmitter sections of the HFBR-5204 and HFBR-5205 series utilize 1300 nm InGaAsP LEDs. These LEDs are packaged in the optical subassembly portion of the transmitter section. They are driven by a custom silicon IC which converts differential PECL logic signals, ECL referenced (shifted) to a +5 Volt supply, into an analog LED drive current.
Description
The HFBR-5200 family of transceivers from Agilent Technologies provide the system designer with products to implement a range of solutions for multimode fiber SONET OC-3 (SDH STM-1) physical layers for ATM and other services.
*ST is a registered trademark of AT&T Lightguide Cable Connectors.
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Receiver Sections The receiver sections of the HFBR-5204 and HFBR-5205 series utilize InGaAs PIN photodiodes coupled to a custom silicon transimpedance preamplifier IC. These are packaged in the optical subassembly portion of the receiver. These PIN/preamplifier combinations are coupled to a custom quantizer IC which provides the final pulse shaping for the logic output and the Signal Detect function. The data output is differential. The signal detect output is single-ended. Both data and signal detect outputs are PECL compatible, ECL referenced (shifted) to a +5 volt power supply. Package The overall package concept for the Agilent transceivers consists of three basic elements; the two optical subassemblies, an electrical subassembly, and the housing as illustrated in the block diagrams in Figure 1 and Figure 1a. The package outline drawing and pin out are shown in Figures 2, 2a, and 3. The details of this package outline and pin out are compliant with the multisource definition of the 1x9 SIP. The low profile of the Agilent transceiver design complies with the maximum height allowed for the duplex SC connector over the entire length of the package.
Figures 2b and 2c show the outline drawings for options that include mezzanine height and extended and flush shields respectively. The optical subassemblies utilize a high volume assembly process together with low cost lens elements which result in a cost effective building block. The electrical subassembly consists of a high volume multilayer printed circuit board on which the IC chips and various surfacemounted passive circuit elements are attached. The package includes internal shields for the electrical and optical subassemblies to insure low EMI emissions and high immunity to external EMI fields. The outer housing including the duplex SC connector or the duplex ST ports is molded of filled non-conductive plastic to provide mechanical strength and electrical isolation. The solder posts of the Agilent design are isolated from the circuit design of the transceiver and do not require
connection to a ground plane on the circuit board. The transceiver is attached to a printed circuit board with the nine signal pins and the two solder posts which exit the bottom of the housing. The two solder posts provide the primary mechanical strength to withstand the loads imposed on the transceiver by mating with the duplex or simplex SC or ST connectored fiber cables. Note: The "T" in the product numbers indicates a transceiver with a duplex ST connector receptacle. Product numbers without a "T" indicate transceivers with a duplex SC connector receptacle.
Application Information
The Applications Engineering group in the Agilent Optical Communication Division is available to assist you with the technical understanding and design trade-offs associated with these transceivers. You can contact them through your Agilent sales representative.
ELECTRICAL SUBASSEMBLY DIFFERENTIAL DATA OUT SINGLE-ENDED D SIGNAL ETECT OUT QUANTIZER IC PREAMP IC
DUPLEX SC RECEPTACLE PIN PHOTODIODE
S OPTICAL UBASSEMBLIES
DIFFERENTIAL DATA IN DRIVER IC
LED
TOP VIEW
Figure 1. SC Block Diagram.
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ELECTRICAL SUBASSEMBLY DIFFERENTIAL DATA OUT SINGLE-ENDED D SIGNAL ETECT OUT QUANTIZER IC PREAMP IC
DUPLEX ST RECEPTACLE PIN PHOTODIODE
S OPTICAL UBASSEMBLIES
DIFFERENTIAL DATA IN DRIVER IC
LED
TOP VIEW
Figure 1a. ST Block Diagram.
(39.12 AX. 1.540) M (12.70 0.500)
( 6.35 0.250)
(25.40 MAX. 1.000)
R AREA F ESERVED POR PROCESS LUG
(12.70 0.500)
A
D HFBR-5XXX ATE CODE (YYWW) SINGAPORE
5.93 ± 0.1 (0.233 ± 0.004) (10.35 MAX. 0.407)
3.30 ± 0.38 (0.130 ± 0.015)
+ 0.08 - 0.05 + 0.003 ) (0.030 - 0.002 0.75
( 2.92 0.115) ø ( 0.46 (9x) N0.018) OTE 1
(18.52 0.729) ( 4.14 0.163)
+ 0.25 - 0.05 + 0.010 ) (0.050 - 0.002 NOTE 1 1.27
(23.55 0.927)
(20.32 [8x(2.54/.100)] 0.800)
(16.70 0.657)
(17.32 (20.32 (23.32 0.682) 0.800) 0.918)
( 0.87 0.034)
(23.24 0.915)
(15.88 0.625)
NOTE 1: THE SOLDER POSTS AND ELECTRICAL PINS ARE PHOSPHOR BRONZE WITH TIN LEAD OVER NICKEL PLATING. D IMENSIONS ARE IN MILLIMETERS (INCHES).
Figure 2. SC Package Outline Drawing with Standard Height.
Others parts begin by qf
QF-1
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