|Company||Allegro Micro Systems, Inc.|
|Datasheet||Download 8227 datasheet
Designed specifically to meet the requirement for extended operation of battery-powered equipment such as cordless and cellular telephones, the A8226SLM thru A8233SLM voltage regulators offer the reduced dropout voltage and quiescent current essential for maximum battery life. Applicable also to palmtop computers and personal data assistants, these devices deliver a regulated output 100 mA (transient), which is limited only by package power dissipation. Regulated output voltages of and 3.3 are currently provided. Other voltages, down to 2.0 volts, are available on special order. A PMOS pass element provides a typical dropout voltage of only mA of load current. The low dropout voltage permits deeper battery discharge before output regulation is lost. Quiescent current does not increase significantly as the dropout voltage is approached, an ideal feature in standby/resume power systems where data integrity is crucial. Regulator accuracy and excellent temperature characteristics are provided by a bandgap reference. The A8226SLM thru A8233SLM include ENABLE inputs to give the designer complete control over power up, standby, or power down. These devices are supplied in a thermally enhanced 5-lead smalloutline plastic package similar to the SOT-23, and fitting the SC-74A footprint. All devices are rated for operation over a temperature range to +85°C.
Input Voltage, VI. 7 V Peak Output Current, IOM. 100 mA* Enable Input Voltage, VE. VI Operating Temperature Range, TA. to +85°C Junction Temperature, TJ. +150°C Storage Temperature Range, TS. to +150°C
* Output current rating is limited by input voltage, duty cycle, and ambient temperature. Under any set of conditions, do not exceed a junction temperature of +150°C. See following pages.
I High Efficiency Provides Extended Battery Life 125 mV Typical Dropout Voltage 32 µA Typical Quiescent Current Less Than 1 µA "Sleep" Current I Low Output Noise 100 mA Peak Output Current I Improved PSRR and Transient PerformanceAPPLICATIONS
Cordless and Cellular Telephones Personal Data Assistants Personal Communicators Palmtop Computers
Always order by complete part number, e.g., A82xxSLM , where "xx" is the required output voltage in tenths.
A82xxSLM Maximum Allowable Average Output Current* with device mounted x 56.9 mm) solder-coated copper-clad board in still air.
* Absolute maximum peak output current rating is 100 mA; absolute maximum input voltage IO = (TJ TA)/([VI VO] RJA x dc) (150 TA)/([VI VO] x 1.00) Output current rating can be increased (to 100 mA maximum) by additional heat sinking or reducing the duty cycle.
115 Northeast Cutoff, Box 15036 Worcester, Massachusetts (508) 853-5000 Copyright © 2000, Allegro MicroSystems, Inc.
Limits Characteristic Output Voltage (reference specified VO(nom)) Output Volt. Temp. Coeff. Line Regulation Load Regulation Dropout Voltage Ground Terminal Current aVO VO(VI) VO(IO) VImin - VO IGND IQ ENABLE Input Voltage VEH VEL ENABLE Input Current Rejection Ratio IE PSRR Symbol VO Test Conditions IO 50 mA* VI = VO(nom), = 10 mA, IO 50 mA*, 7 V, Output 7 V, Output OFF VI = VO(nom) = 100 mV, = 10 mA, = 1 kHz = 10 kHz f 100 kHz, = 10 mA, 10 µF Min. -0.05 2.0 Typ. Max. Units V mV/°C V µA
Typical values are = +25°C and are given for circuit design information only. * Pulse test (20 ms). See previous page for duty cycle limitations.
|Some Part number from the same manufacture Allegro Micro Systems, Inc.|
|8283 LNB Supply And Control Voltage Regulator|
|8284 Two Output LNB Supply And Control Voltage Regulator|
|8902A 3-phase Brushless DC Motor Controller/driver With Back-emf Sensing|
|8906 Bidirectional 3-phase Brushless DC Motor Controller/driver With Back-emf Sensing|
|8932-A Voice-coil Motor Driver|
FSS234 : . s Parameter Drain-to-Source Voltage Gate-to-Source Voltage Drain Current (DC) Drain Current (Pulse) Allowable Power Dissipation Channel Temperature Storage Temperature Symbol VDSS VGSS ID IDP PD Tch Tstg PW10µs, duty cycle1% Mounted on a ceramic board (1200mm2!0.8mm) Conditions Ratings to +150 Unit °C Parameter Drain-to-Source Breakdown Voltage Zero-Gate.
NJU7087 : Sound Enhancement Audio Processor. Sound Enhancement Processor For Telephone.
LTC3101 : Wide Vin, Multi-Output DC/DC Converter And PowerPath Controller The LTC3101 is a complete power management solution for low power portable devices. It provides three high efficiency switching DC/DC converters which seamlessly transition from battery to USB/wall adapter power when available. A synchronous buck-boost regulator provides complete flexibility,.
L234-155.52 : 5.0x7.0mm Surface Mount LVDS Clock Oscillator Series. 5.0x7.0mm Surface Mount LVDS Clock Oscillator Series The Connor Winfield Lxxx - Series a 5x7.5mm Surface Mount, LVDS, Fixed Frequency Crystal Controlled Oscillator (XO) designed for applications requiring tight frequency stability, wide temperature range and low jitter. Operating or 3.3V supply voltage, the Lxxx Series provides an LVDS Differential.
HV739DB1 : Hv739 ¡ÿ100v 3.0A Ultrasound Pulser Demo Board. The is a monolithic single channel, high-speed, high voltage, ultrasound transmitter pulser. This integrated, high performance circuit in a single, 5x5mm, 32-lead QFN package. The HV739 can deliver a ±3.0A source and sink current to a capacitive transducer. It is designed for the ultrasound material inspection NDT and medical ultrasound imaging applications.
LX1677 : Amd64 Processor VRM Controller. KEY High Current Biphase Operation Outputs As Low As 0.800V Biphase LoadSHARETM Transient Correction LoopTM Reduces Required Capacitance Differential Amplifier For Remote Voltage Sensing Integrated High Current MOSFET Drivers to 1MHz Frequency Operation Programmable Slew Rate Control For Start-Up Sequence and VID change VID Changes On The Fly Power.
UL634H256SA35G1 : Low Voltage Powerstore 32K x 8 Nvsram. Not Recommended For New Designs High-performance CMOS nonvolatile static RAM x 8 bits 35 and 45 ns Access Times 15 and 20 ns Output Enable Access Times ICC 8 mA typ. 200 ns Cycle Time Automatic STORE to EEPROM on Power Down using external capacitor Software initiated STORE Automatic STORE Timing 106 STORE cycles to EEPROM 100 years data retention in EEPROM.
STLC2500A : Bluetoothtm EDR Single Chip. The lowest power consumption by design and technology (see Table 1) World best EDR throughput (see Table 1) World most performing BT-WLAN coexistence support for several BT/WLAN coexistence algorithms (i.e. 2/3/4-wire PTA, in a very flexible and parametrical way to optimize voice and data quality over Bluetooth and WLAN) Superior voice quality Pitch-Period.
903-367P-51A2 : RF Connectors R/A PLG 316/174 Ni. s: Manufacturer: Amphenol ; Product Category: RF Connectors ; RoHS: Details ; Product: Connectors ; RF Series: SMB ; Gender: Plug (Male) ; Contact Plating: Gold ; Shell Plating: Nickel ; Impedance: 50 Ohms ; Termination Style: Solder ; Body Style: Right Angle ; Cable Type: RG 174, 188A ; Connector Type: Connectors.
MEC6-150-02-L-D-RA1 : Gold Surface Mount, Right Angle Card Edge, Edgeboard Connector Connectors, Interconnect Non Specified - Dual Edge; CONN EDGE CARD DL 100POS SMD. s: Card Thickness: 0.062" (1.57mm) ; Card Type: Non Specified - Dual Edge ; Contact Finish: Gold ; Mounting Type: Surface Mount, Right Angle ; : - ; Number of Positions: 100 ; Number of Rows: 2 ; Pitch: 0.025".
UBA2014P/N1,112 : Pmic - Lighting, Ballast Controller Integrated Circuit (ics) Ballast Controller Tube 1.5mA 9.1 V ~ 13 V; IC CNTL BALLAST 600V 16-DIP. s: Package / Case: 16-DIP (0.300", 7.62mm) ; Packaging: Tube ; Voltage - Supply: 9.1 V ~ 13 V ; Type: Ballast Controller ; Current - Supply: 1.5mA ; Current - Output: 330mA ; Frequency: 40.5 ~ 100 kHz ; Operating Temperature:.
132246-3 : Tin Free Hanging (In-Line) Terminal - Ring Connectors, Interconnect Free Hanging (In-Line); CONN RING TONGUE PIDG. s: Color: Red, White Stripe ; : - ; Wire Gauge: 18 AWG ; Insulation: Insulated ; Length - Overall: 0.724" (18.40mm) ; Mounting Type: Free Hanging (In-Line) ; Packaging: Bulk ; Stud/Tab Size: 3 Stud ; Terminal Type: Circular ; Thickness:.
953454-6602-AR : Gold Through Hole Rectangular - Headers, Receptacles, Female Socket Connectors, Interconnect Receptacle, Bottom or Top Entry; CONN SOCKET 54POS 2MM VERT DUAL. s: Color: Black ; Connector Type: Receptacle, Bottom or Top Entry ; Contact Finish: Gold ; : - ; Mounting Type: Through Hole ; Number of Positions Loaded: All ; Number of Rows: 2 ; Pitch: 0.079".
RCBS1901024LG1 : Metal, Steel Handle(s) Rack Boxes, Enclosures, Rack Table Top Rack Cabinet; RACK STEEL 24.5X21X12.5 GRY. s: Color: Gray ; : Handle(s) ; Material: Metal, Steel ; Dimensions - Panel: 24.500" L x 17.810" W x 10.530" H (622.30mm x 452.37mm x 267.46mm) ; Dimensions - Overall: 24.500" L x 21.000" W x 12.500" H (622.30mm x 533.40mm x 317.50mm) ; Weight: 39 lbs (17.7kg).
TNPW120633R2BETA : 33.2 Ohm 0.25W, 1/4W Chip Resistor - Surface Mount; RES 33.2 OHM 1/4W 0.1% 1206. s: Resistance (Ohms): 33.2 ; Power (Watts): 0.25W, 1/4W ; Tolerance: ±0.1% ; Packaging: Tape & Reel (TR) ; Composition: Thin Film ; Temperature Coefficient: ±25ppm/°C ; Lead Free Status: Contains Lead ; RoHS Status: RoHS Non-Compliant.
7-1614892-4 : 5.49K Ohm 0.1W, 1/10W Chip Resistor - Surface Mount; RES 5.49K OHM 1/10W 0.1% 0805. s: Resistance (Ohms): 5.49K ; Power (Watts): 0.1W, 1/10W ; Tolerance: ±0.1% ; Packaging: Tape & Reel (TR) ; Composition: Thin Film ; Temperature Coefficient: ±25ppm/°C ; Lead Free Status: Lead Free ; RoHS Status: RoHS Compliant.
160032 : Tin Free Hanging (In-Line) Terminal - Ring Connectors, Interconnect Free Hanging (In-Line); TERM RING TONGUE STR 6AWG. s: Color: - ; : Brazed Seam, Serrated Termination ; Wire Gauge: 6 AWG ; Insulation: Non-Insulated ; Length - Overall: 1.244" (31.60mm) ; Mounting Type: Free Hanging (In-Line) ; Packaging: Bulk ; Stud/Tab Size: M10 Stud ; Terminal Type:.
FDZ661PZ : -20V P-Channel 1.5 V Specified PowerTrenchÂ® Thin WL-CSP MOSFET Designed on Fairchild\'s advanced 1.5 V PowerTrenchÂ® process with state of the art \"fine pitch\" Thin WLCSP packaging process, the FDZ661PZ minimizes both PCB space and rDS(on). This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which enables the device to combine.