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Part: EK04

Category:
 Others

Description: Evaluation Kit For Pa04 Pin-out

Company: Apex Microtechnology Corporation

Datasheet: Download EK04 datasheet     File size : 74 kB

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Datasheet text preview:
EVALUATION KIT FOR PA04 PIN-OUT

EK04
MICROTECHNOLOGY

HTTP://WWW.APEXMICROTECH.COM

(800) 546-APEX

(800) 546-2739

INTRODUCTION
This easy-to-use kit provides a platform for the evaluation of power op amps using the PA04 pin-out configuration. It can be used to analyze a multitude of standard or proprietary circuit configurations, and is flexible enough to do most standard amplifier test configurations. The schematic of the PC board is shown in Figure 2. Note that all of the components shown on the schematic will probably not be used for any single circuit. The component locations on the PC board (See Figure 3) provide maximum flexibility for a variety of configurations. Also included are loops for current probes as well as connection pads on the edge of the PC board for easy interconnects. The hardware required to mount the PC board and the device under evaluation to the heatsink are included in the kit. Because of the limitless combination of configurations and component values that can be used, no other parts are included in this kit. However, generic formulas and guidelines are included in the APEX DATABOOK.

ASSEMBLY HINTS
The mating socket included with this kit has recessed nut sockets for mounting the device under evaluation. This allows assembly from one side of the heatsink, making it easy to swap devices under evaluation. The sizes of the stand-offs were selected to allow proper spacing of the board-to-heatsink and allow enough height for components when the assembly is inverted.

ASSEMBLY
1. Insert a #6 x 1/4" hex nut in each of the nut socket recesses located on the bottom of the mating socket. 2. Insert the socket into the PC board until it is firmly pressed against the ground plane side of the PC board. 3. Solder the socket in place (Figure 1). Be sure the nuts are in the recesses prior to soldering. 4. Mount the PC board assembly to the heatsink using the standoffs and spacers included. 5. Apply thermal grease or a TW05 to the bottom of the device under evaluation. Insert into the mating socket through the heatsink. 6. Use the #6 x 1.25" panhead screws to mount the amplifier to the heat sink. Do not overtorque. Recommended mounting torque is 8-10 in-lbs (.90-1.13 N·M). Mounting precautions, general operating considerations, and heatsinking information may be found in the APEX DATABOOK. NOTE: Refer to HS11 in Accessories Section.

PARTS LIST
Part # HS11 EK04PC MS05 HWRE01 TW05 Description Heatsink PC Board Mating Socket Hardware Kit Hardware Kit Quantity 1 1 1 1 1

HWRE01 contains the following: 4 #8 Panhead Screws 4 #8 .375" Hex Spacers 4 #8 1.00" Hex Stand Offs FIGURE 1.

4 #6 x 1.25" Panhead Screws 4 #6 x 5/16" Hex Nuts 2 #6 x 1/4" Hex Nuts

Heatsink

#6 Screw

Power Op Amp Package

#8 Screw Recessed Nuts #8 .375" Hex Spacer #8 1.00" Hex Standoff

Teflon Tubing (2 Opposite Pins Minimum)

PC Board Mating Socket

BEFORE YOU GET STARTED
· All Apex amplifiers should be handled using proper ESD precautions! · Initially set all power supplies to the minimum operating levels allowed in the device data sheet. · Check for oscillations. · Always use the heatsink included in this kit with thermal grease or TW05 and torque the part to the specified 8-10 in-lbs (.90-1.13 N·M). · Do not change connections while the circuit is under power. · Never exceed any of the absolute maximums listed in the device data sheet. · Always use adequate power supply bypassing. · Remember that internal power does not equal load power. · Do not count on internal diodes to protect the output against sustained, high frequency, high energy kickback pulses.

APEX MICROTECHNOLOGY CORPORATION · TELEPHONE (520) 690-8600 · FAX (520) 888-3329 · ORDERS (520) 690-8601 · EMAIL prodlit@apexmicrotech.com

EK04
FIGURE 2.
CR1
S

EVALUATION KIT FOR PA04 PIN-OUT

L1 C2
G D

OPTIONAL VBOOST CIRCUIT 45 1 IC1 C3 Max632 73

R3

Q4

C19 Q1 J1 Q2 C5

+V BOOST R2 R4

C6

6
LOGIC LEVEL SHUTDOWN 7

C4 J3 C7 C8

R5 C9 C1 R1 8
CR4 CR6 CR8

1 2 3
R11 R7 C10 R10 R13 R8
CR3 CR5 CR7

R6 Q3

1

9 12 10 11 7 5 R9 10W

D.U.T. 2 3 6 4

4
R12

+V C11 CR2 ­V BOOST CR9 C17 C16 ­V

5

C12

C13

R14

C14 J2

Q5

6
CR11

IC2 1 Max636 5 3 4

7

8

CR10 C15 L2 C20

C18

OPTIONAL VBOOST CIRCUIT

TYPICAL COMPONENT FUNCTIONS
COMPONENT R1 R2 R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 C1 C4 C5 C7 C8 C9 C10 C11 C12 C13 C14 C16 C17 CR2 CR3-8 CR9 CR11 FUNCTION Feedback resistor Logic shutdown Input resistor logic input Current setting resistor Input resistor logic input Input resistor Input bias current measurement (Note 4) Current limit Noise gain compensation (Note 1) Resistor divider network for biasing inputs (Note 2) Input bias current measurement (Note 4) Resistor divider network for biasing inputs (Note 2) Compensation resistor AC gain or stability (Note 1) Power supply bypass (Note 3) Power supply bypass (Note 3) Input coupling AC gain set Power supply bypass (Note 3) Noise gain compensation (Note 1) Power supply bypass (Note 3) Bias node noise bypass (Note 2) Bias node noise bypass (Note 2) Compensation Power supply bypass (Note 3) Power supply bypass (Note 3) Flyback protection (Note 5) Input protection (Note 5) Flyback protection (Note 5) Zener reference for MAX636 OPTIONAL Vboost COMPONENT FUNCTIONS AND RECOMMENDED VALUES C2 C3 C6 C15 C18 C19 C20 CR1 CR10 CR11 IC1 IC2 L1 L2 Q4 Q5 R3 100µF 25V 100µF 100V 10µF 200V 100µF 100V 100µF 25V 1µF X7R 100V 1µF X7R 100V 1N5242 1N5819 1N5242 MAX632 MAX636 330µH 330µH IRF9240 IRF240 50K 1Watt Regulator Input Capacitor Boost Output Filter Capacitor Bias Filter Capacitor Boost Output Filter Capacitor Regulator Input Capacitor Boost Output Filter Capacitor Boost Output Filter Capacitor Positive Input Boost Reference Negative Boost Flyback Diode Negative Input Boost Reference Positive Boost Regulator Negative Boost Regulator Positive Boost Output Inductor Negative Boost Output Inductor Positive Pass Element Negative Pass Element Reference Bias Resistor

NOTE: Q4 and Q5 can optionally be attached to heatsinks, Apex part # HS01. This should be done when the total supply voltage to the PA04 exceeds 60 Vdc. NOTES: Please refer to the following sections of the APEX DATABOOK as noted. 1. See Stability section of "General Operating Considerations." 2. See "General Operating Considerations." 3. See Power Supplies section of "General Operating Considerations." 4. See "Parameter Definitions and Test Methods." 5. See Amplifier Protection section of "General Operating Considerations."

APEX MICROTECHNOLOGY CORPORATION · 5980 NORTH SHANNON ROAD · TUCSON, ARIZONA 85741 · USA · APPLICATIONS HOTLINE: 1 (800) 546-2739

EVALUATION KIT FOR PA04 PIN-OUT

EK04

FIGURE 3.

6

7

2

1

3

C12
C7 C13 R4 R1 C8
B

5

4

R6

R13 R11 R10

R5 R7
C E

C10
C1

Q3

B

Q2
C

E C B

R12
R8

CR3

CR5

CR7

R2
E

Q1

C3 C19

CR4

APEX MICROTECHNOLOGY CORPORATION · TELEPHONE (520) 690-8600 · FAX (520) 888-3329 · ORDERS (520) 690-8601 · EMAIL prodlit@apexmicrotech.com

R3 C6 L1 IC1 Q4 S C5 D J3 C2 CR1 +VB G C9 J1

CR6

CR8
Q5 S G

R14 C14
CR11 C11 J2

D

8"

C18

IC2

C4

C17
R9 C16

Q5-D

L2

CR10

C15 C20

CR9 CR2
+V OUT ­V

­VB

6"

EK04
TYPICAL APPLICATION
The PA04 is well suited for wideband, low distortion, high power applications. The circuit in Figure 4 displays the simplicity of use offered by the PA04. The circuit is in an inverting gain of 10. This relatively low gain allows the amplifier to have more than adequate loop gain available, resulting in extremely low distortion at the power levels delivered. The use of the inverting configuration

EVALUATION KIT FOR PA04 PIN-OUT

avoids any concern of common mode effects. Typical specs of such a circuit would read as follows: Po = 200W F = 10kHz RL = 4 Ohms THD = .0061
10R R1

FIGURE 4.

+VS

C4 C9

C5 CR2 J1 NC

R 2 R7 V IN

R8 CR3 CR5 CR7 CR4 CR6 CR8

8 9 1 DUT 2 3 R14 4

12 6

10 11 7 5

R9

R12 4 J2 C14 C16 C17

C11 CR9

OPTIONAL V BOOST

­VS

One of many inexpensive ways to acquire V boost for the PA04 has been included as an option on this evaluation kit. The addition of these parts not only increases swing, but also extends the

common mode range of the amplifier. The ground connection of J3 needs to be made when assembled.

FIGURE 5.
CR1
S

L1 C2
G D

OPTIONAL VBOOST CIRCUIT 45 1 IC1 C3 Max632 73

R3

Q4

C19 Q1 Q2 C5 R1 C9

+V BOOST R2 R4

C6

6
LOGIC LEVEL SHUTDOWN 7

C4

R5 R6 Q3

2
R7

R8
CR3 CR5 CR7 CR4 CR6 CR8

8 1

9 12 10 11 5 7 R9 10W

D.U.T. 2 3 6 4

4

+V C11 CR2 ­V BOOST

R14 Q5 6
CR11

C14

IC2 1 Max636 5 3 4

7

8

CR10 C15 C16 L2 C20

CR9 C17 ­V

C18

OPTIONAL VBOOST CIRCUIT

HS11 HEATSINK NOTE
The HS11 Heatsink is overkill for the average application. Once maximum power dissipation for the application is determined (refer to "General Operating Considerations" and Application Note 11 in the APEX DATABOOK), the final mechanical design will probably require substantially less heatsinking. APEX MICROTECHNOLOGY makes no representation that the use or interconnection of the circuits described herein will not infringe on existing or future patent rights, nor do the descriptions contained herein imply the granting of licenses to make, use, or sell equip­ ment constructed in accordance therewith.
APEX MICROTECHNOLOGY CORPORATION · 5980 NORTH SHANNON ROAD · TUCSON, ARIZONA 85741 · USA · APPLICATIONS HOTLINE: 1 (800) 546-2739

COMMON CONFIGURATIONS

EK04
VOLTAGE-TO-CURRENT CONVERSION SINGLE SUPPLY, BRIDGE MODE RI RF VS RS RI LOAD CB RF VOLTAGE FOLLOWER WITH GAIN SINGLE SUPPLY, BRIDGE MODE RI RF VS LOAD CB RB VS R R VS VS 2 VIN R RD CF VS R R R VS

VOLTAGE-TO-CURRENT CONVERSION
NON-INVERTING CONFIGURATION

IO VIN CF RD LOAD

V I O = IN RS

RS

DIFFERENCE AMPLIFIER RF V1 V2 RI RI RF VO = VO
C

R VS 2 R

RF ( V2 ­ V ) 1 RI

CI VIN

VOLTAGE-TO-CURRENT CONVERSION
INVERTING CONFIGURATION

RI IO VIN RD CF RF ­VIN RF IO = RS RI LOAD
V1 R1

INTEGRATION
VS RI RB VS

SINGLE SUPPLY
NON-INVERTING CONFIGURATION

RF VS

R2

RS

V2 V3 VX VO = R3 RX T C1

C1 VO
VIN

VO

RI

RB RF RF RI For VIN = 0 V (R I //R F ) VCM = S RB + ( R I //R F ) VO = VCM = VIN (RB //R F ) R I + (RB //R F ) + VCM

VOLTAGE-TO-CURRENT CONVERSION IMPROVED HOWLAND CURRENT PUMP RI RF IO VIN RI RF I O = ­VIN RF R I RS RS ZL

(
T O

V1 V2 V3 VX + + + RX R3 R2 R1

)

dt
i) ii)

SUMMING / SCALING V1
RD CF

R1 R2

RF

V2 V3 VX

iii)

R3 RX VO = ­ RF V (R
1 1

VO

iv)

For VIN > 0 VCM = VCM @ VIN = 0

SINGLE SUPPLY OPERATION
INVERTING CONFIGURATION

+

RI VIN VS RA

RF VS

V2 V3 VX + + R2 R3 RX

)
RI

INVERTER RF
VO

PARALLEL OPERATION RF RS I

VIN

RI VO
VIN

2I

RB VS RB RF VO (Bias) = 1+ RA + RB RI RF VO (Signal) = VIN ­ RI

(

)( ()

)

VO = ­

R ( R )V
F I

RL RS I

IN

This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible inaccuracies or omissions. All specifications prodlit@apexmicrotech.com APEX MICROTECHNOLOGY CORPORATION · TELEPHONE (520) 690-8600 · FAX (520) 888-3329 · ORDERS (520) 690-8601 · EMAILare subject to change without notice. EK04U REV. F JANUARY 1998 © 1998 Apex Microtechnology Corp.




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