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Details, datasheet, quote on part number:UPC8178TB
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Datasheet text preview:
SILICON RFIC LOW CURRENT AMPLIFIER FOR MOBILE COMMUNICATIONS
FEATURES
· LOW CURRENT CONSUMPTION ICC = 1.9 mA TYP @ VCC = 3.0 V · SUPPLY VOLTAGE: VCC = 2.4 to 3.3 V · EXCELLENT ISOLATION: ISOL = 39 dB TYP @ f = 1.0 GHz ISOL = 40 dB TYP @ f = 1.9 GHz ISOL = 38 dB TYP @ f = 2.4 GHz · POWER GAIN: GP = 11.0 dB TYP @ f = 1.0 GHz GP = 11.5 dB TYP @ f = 1.9 GHz GP = 11.5 dB TYP @ f = 2.4 GHz · OPERATING FREQUENCY: 0.1 to 2.4 GHz (Output port LC matching) · 1 dB GAIN COMPRESSION OUTPUT POWER: PO(1 dB) = -4.0 dBm TYP @ f = 1.0 GHz PO(1 dB) = -7.0 dBm TYP @ f = 1.9 GHz PO(1 dB) = -7.5 dBm TYP @ f = 2.4 GHz · HIGH-DENSITY SURFACE MOUNTING: 6-pin super minimold package (2.0 x 1.25 x 0.9 mm) · LOW WEIGHT: 7 mg (Standard Value)
+20
UPC8178TB
POWER GAIN vs. FREQUENCY
VCC = 3.0 V 1.0 GHz +10 TA = -40°C TA = +25°C TA = +85°C 0 2.4 GHz
-10
-20
1.9 GHz
-30
-40 0.1
0.3
1.0
3.0
DESCRIPTION
NEC'S UPC8178TB is a silicon monolithic integrated circuit designed as an amplifier for mobile communications. This IC can realize low current consumption with an external chip inductor which cannot be realized on an internal 50 wideband matched IC. This low current amplifier operates on 3.0 V. This device is manufactured using NEC's 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process which uses direct silicon nitride passivation film and gold electrodes. These materials can protect the chip surface from pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability. NEC's stringent quality assurance and test procedures ensure the highest reliability and performance.
UPC8178TB S06 UNITS mA dB dB dB dB dB dB dBm dBm dBm dB dB dB dB dB dB MIN 1.4 9.0 9.0 9.0 34 35 33 -8.0 -11.0 -11.5 4 5 6.5 TYP 1.9 11.0 11.5 11.5 39 40 38 -4.0 -7.0 -7.5 5.5 5.5 5.5 7 8 9.5 MAX 2.4 13.0 13.5 13.5 7.0 7.0 7.0
APPLICATIONS
· Buffer Amplifiers on 0.1 to 2.4 GHz mobile communications system
ELECTRICAL CHARACTERISTICS
PART NUMBER PACKAGE OUTLINE SYMBOLS ICC GP Power Gain ISOL Isolation PO(1dB) 1 dB Gain Compression Output Power NF Noise Figure RLin Input Return Loss f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz PARAMETERS AND CONDITIONS1 Circuit Current (no signal) f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz
(TA = 25°C, VCC = VOUT = 3.0 V, ZS = ZL = 50, at LC matched frequency unless otherwise specified)
f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz
California Eastern Laboratories
UPC8178TB ABSOLUTE MAXIMUM RATINGS1
(TA = +25°C unless otherwise specified) SYMBOLS VCC ICC PD TA T STG PIN PARAMETERS Supply Voltage2 UNITS V mA mW °C °C dBm RATINGS 3.6 15 270 -40 to +85 -55 to +150 +5
RECOMMENDED OPERATING CONDITIONS
SYMBOLS VCC TA PARAMETERS Supply Voltage1 Operating Ambient Temperature UNITS MIN V °C 2.4 -40 TYP MAX 3.0 +25 3.3 +85
Circuit Current Power Dissipation3 Operating Ambient Temperature Storage Temperature Input Power
Note: 1. Same voltage applied to pins 4 and 6.
Notes: 1. Operation in excess of any one of these conditions may result in permanent damage. 2. Pins 4 and 6. 3. Mounted on a double-sided copper clad 50x50x1.6 mm epoxy glass PWB, TA = +85°C.
SERIES PRODUCTS1 (TA = +25°C, VCC = Vout = 3.0 V, ZS = ZL = 50 )
Parameter ICC (mA) 1.9 4.0 2.8 4.2 5.6 1.0 GHz output port matching frequency GP ISOL PO(1 dB) (dB) (dB) (dBm) 11 39 -4.0 13.5 44 +3.0 12.5 12.5 23 39 38 40 -4.0 +2.5 -4.5 1.66 GHz output port matching frequency GP ISOL PO(1 dB) (dB) (dB) (dBm) 13 15 19.5 39 36 38 -4.0 +1.5 -8.5 1.9 GHz output port matching frequency GP ISOL PO(1 dB) (dB) (dB) (dBm) 11.5 40 -7.0 15.5 42 +1.5 13 15 17.5 37 34 35 -4.0 +0.5 -8.5 2.4 GHz output port matching frequency GP ISOL PO(1 dB) (dB) (dB) (dBm) 11.5 38 -7.5 15.5 41 +1.0 Marking
Part No. UPC8178TB UPC8179TB UPC8128TB UPC8151TB UPC8152TB Note: 1. Typical performance.
C3B C3C C2P C2U C2V
PIN FUNCTIONS (Pin Voltage is measured at VCC = 3.0 V)
Pin No. 1 Pin Name Input Applied Voltage (V) -- Pin Voltage (V) 0.91 Function and Applications Internal Equivalent Circuit
Signal input pin. An internal matching circuit, configured with resistors, enables a 50 connection over a wide band. This pin must be coupled to the signal source with the capacitor for DC out. Ground pin. This pin should be connected to the system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with a wide ground pattern to decrease impedance difference. Signal output pin. This pin is designed as the collector output. Due to the high impedance output, this pin should be externally equipped with LC matching circuit to next stage. For L, a size 1005 chip inductor can be used. Power supply pin. This pin should be externally equipped with a bypass capacitor to minimize it's impedance.
3 1
6 4
2 3 5
GND
0
--
4
Output
Voltage same as VCC through external inductor 2.4 to 3.3
2
6
VCC
5
UPC8178TB TEST CIRCUIT 1 (f = 1.0 GHz)
VCC
C3
C4
Output port matching circuit
6 50 IN C1 1 4
L1 C2 C3 50 OUT
2, 3, 5
EXAMPLE OF TEST CIRCUIT 1 ASSEMBLED ON EVALUATION BOARD
f = 1.0 GHz
Top View
C3B
IN Connector
C1 C4
Mounting direction
COMPONENT LIST
1.0 GHz Output Port Matching C1, C3, C5 C2 C4 L1 1000 pF 0.75 pF 10 pF 12 nH
AMP. 4
C2 C5 C3
OUT
Connector
L1
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