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Part: CPD75
Category: Discrete
Description:
Company: Central Semiconductor Corporation
Datasheet: Download CPD75 datasheet File size : 704 kB
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Datasheet text preview:
PROCESS
Schottky Rectifier
CPD75
Central
TM
5 Amp Schottky Barrier Rectifier Chip
Semiconductor Corp.
PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization 72.5 x 72.5 MILS 11.8 MILS 63.8 x 63.8 MILS Al - 30,000Å Au - 18,000Å
GEOMETRY GROSS DIE PER 4 INCH WAFER 2,160 PRINCIPAL DEVICE TYPES CZSH5-40 CZSH10-40C (Dual Chip)
The Typical Electrical Characteristics data for this chip is currently being revised. For the latest updated data for this Chip Process, please visit our website at:
145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
www.centralsemi.com/chip
R1 (1-August 2002)
Others parts begin by cp
CP-1 CP-2 CP-3 CP-4 CP-5
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