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Part: CPD75

Category:
 Discrete

Description:

Company: Central Semiconductor Corporation

Datasheet: Download CPD75 datasheet     File size : 704 kB

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Datasheet text preview:
PROCESS

Schottky Rectifier

CPD75

Central

TM

5 Amp Schottky Barrier Rectifier Chip

Semiconductor Corp.

PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization 72.5 x 72.5 MILS 11.8 MILS 63.8 x 63.8 MILS Al - 30,000Å Au - 18,000Å

GEOMETRY GROSS DIE PER 4 INCH WAFER 2,160 PRINCIPAL DEVICE TYPES CZSH5-40 CZSH10-40C (Dual Chip)

The Typical Electrical Characteristics data for this chip is currently being revised. For the latest updated data for this Chip Process, please visit our website at:

145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com

www.centralsemi.com/chip

R1 (1-August 2002)




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