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Details, datasheet, quote on part number:DT3055
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Datasheet text preview:
DT3055
N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR Features
· · · · · High Cell Density DMOS Technology Low On-State Resistance High Power and Current Capability Fast Switching Speed High Transient Tolerance
SOT-223 Dim
A B
Min 6.30 2.90 6.71 3.30 2.22 0.92 1.10 1.55 0.025 0.66 4.55 -- 10° 0.254 10°
Max 6.71 3.10 7.29 3.71 2.35 1.00 1.30 1.80 0.102 0.79 4.70 10° 16° 0.356 16°
A B C D E
D
CD
G
E J K
D
S
G H
G
P R S
H J K L M N P R S
L M
N
Mechanical Data
· · SOT-223 Plastic Case Terminal Connections: See Outline Drawing and Internal Circuit Diagram Above
All Dimensions in mm
Maximum Ratings
Drain-Source Voltage
25°C unless otherwise specified Symbol VDSS VGSS Note 1a Continuous Pulsed Note 1a Note 1b Note 1c ID Pd Tj, TSTG Value 60 ±20 ±4 ±25 3.0 1.3 1.1 -65 to +150 Unit V V A W °C
Characteristic Gate-Source Voltage - Continuous Drain Current Maximum Power Dissipation
Operating and Storage Temperature Range
Thermal Characteristics
Characteristic Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case Note 1 Symbol RQJA RQJC Value 42 12 Unit °C/W °C/W
Notes:
1. RQJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RQJC is guaranteed by design while RQCA is determined by the user's board design. 1a. With 1 in2 oz 2 oz. copper mounting pad RQJA = 42°C/W. 1b. With 0.0066 in2 oz 2 oz. copper mounting pad RQJA = 95°C/W. 1c. With 0.0123 in2 oz 2 oz. copper mounting pad RQJA = 110°C/W.
DS11604 Rev. C-4
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DT3055
Electrical Characteristics 25°C unless otherwise specified
Characteristic OFF CHARACTERISTICS Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Tj =125°C Gate-Body Leakage, Forward Gate-Body Leakage, Reverse ON CHARACTERISTICS (Note 2) Gate Threshold Voltage Tj = 100°C Static Drain-Source On-Resistance Tj = 125°C On-State Drain Current Forward Transconductance DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge CISS COSS CRSS tD(ON) tr tD(OFF) tf Qg Qgs Qgd -- -- -- -- -- -- -- -- -- -- 350 135 40 18 25 43 34 10 2.0 6.0 -- -- -- 25 50 65 60 15 4.0 10 pF pF pF ns ns ns ns nC nC nC VDS = 40V. ID = 4.0A. VGS = 10V VDD = 25V, ID = 1.2A VGS = 10V, RGEN = 50W VDS = 30V, VGS = 0V f = 1.0MHz VGS(th) RDS (ON) ID(ON) gFS 2.0 1.5 -- -- 15 -- 2.9 2.3 0.075 0.13 -- 3.5 4.0 3.0 0.10 0.22 -- -- V W A m VDS = VGS, ID = 250µA VGS = 10V, ID = 4.0A VGS = 10V. VDS = 10V VDS = 15V, ID = 4.0A BVDSS IDSS IGSSF IGSSR 60 -- -- -- -- -- -- -- -- -- -- 10 100 100 -100 V µA nA nA VGS = 0V, ID = 250µA VDS = 48V, VGS = 0V VGS = 20V, VDS = 0V VGS = -20V, VDS = 0V Symbol Min Typ Max Unit Test Condition
SWITCHING CHARACTERISTICS (Note 2)
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS Max Continuous Drain-Source Diode IS -- -- Forward Current Source-Drain Diode Forward Voltage Notes: VSD -- --
2.5 1.2
A V VGS = 0V, IS = 4.0A (Note 2)
2. Pulse Test: Pulse width l 300µs, duty cycle l 2.0%.
DS11604 Rev. C-4
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DT3055
RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE
15
VGS = 10V
3.0
VGS = 5.0V 5.5 6.0
8.0 7.0
ID, DRAIN-SOURCE CURRENT
12
2.5
7.0
9
6.0
2.0
6
5.5
1.5
8.0 10
3
5.0 4.5
1.0
0 0 1 2 3 4 VDS, DRAIN-SOURCE VOLTAGE (V) Fig. 1, On-Region Characteristics
0.5
0
4
8
12
16
20
ID, DRAIN CURRENT (A) Fig. 2, On-Resistance vs Gate Voltage and Drain Current
RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -50
10
ID = 4A VGS = 10V
VDS = 10V
TJ = -55 C
125 C
8
25 C
ID, DRAIN CURRENT (A)
-25 0 25 50 75 100 125 150
6
4
2
0 2 4 6 8 VGS, GATE TO SOURCE VOLTAGE (V) Fig. 4, On-Resistance vs Gate Voltage & Temperature
Tj, JUNCTION TEMPERATURE ( C) Fig. 3, On-Resistance Variation vs Temperature
DS11604 Rev. C-4
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DT3055
40
10 0 s
10
ID, DRAIN CURRENT (A)
RD
O S(
N)
LI
M
IT
10 1s
0m
s
1
10
s dc
-.1
0.01
0.1
1
10
100
VDS, DRAIN-SOURCE VOLTAGE (V) Fig. 5, Maximum Safe Operating Area
1.0
D = 0.5
r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE
0.2
0.1
0.1 0.05 0.02 0.01
P(pk) RQJA (t) = r(t) b RQJA RQJA = See Note 1c
0.01
Single Pulse
t1 t2 TJ - TA = PPK b RQJA(t) Duty Cycle, D = t1/t2
0.001 0.0001
0.001
0.01
0.1
1.0
10
100
1000
3000
t1, SQUARE WAVE PULSE DURATION (seconds) Fig. 6, Typical Normalized Transient Thermal Impedance Curves
Remark: Thermal characterization performed under conditions described in note 1c. Transient thermal response will change depending on the circuit board design.
DS11604 Rev. C-4
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DT3055
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