|18020 Hobart Blvd., Unit B Gardena, CA 90248 U.S.A Tel.: (310) 767-1052 Fax: (310) 767-7958
PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. 10% of Die Area)
Compact molded design High surge current, 175 C Low cost Peak performance at elevated temperatures: 175 C
Case: Transfer molded plastic Finish: All external surfaces are silver plated for corrosion resistance and superior solderability Soldering Temperature: 250 oC maximum Mounting Position: Any Polarity: Color band denotes cathode Weight: 0.6 Ounces (1.8 Grams) MILLIMETERS DIM MIN MAX INCHES MIN MAX
Ratings 25 °C ambient temperature unless otherwise specified.
Series Number Maximum DC Blocking Voltage Maximum RMS Voltage Maximum Peak Recurrent Reverse Voltage Non-repetitive Peak Reverse Voltage (Half wave, single phase, 60 Hz peak) Average Forward Rectified Current =150 oC Peak Forward Surge Current (8.3mS single half sine wave superimposed on rated load) Repetitive Peak Reverse Surge Current (Half wave, single phase, 60 Hz applied to rated load) Maximum Forward Voltage Drop at 35 Amp DC Maximum Average DC Reverse Current At Rated DC Blocking Voltage Junction Operating and Storage Temperature Range Notes: 1) Single Side Cooled 100 oC
BAR 3500 VRRM VRWM VDC VRSM IO IFSM IRSM VFM IRM RJC TJ ,TSTG
Maximum Thermal Resistance, Junction to Case (Note 1)