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Details, datasheet, quote on part number: VH148
 
 
Part numberVH148
CategoryDiscrete
Description
CompanyDiotec Electronics Corporation
DatasheetDownload VH148 datasheet
Request For QuoteFind where to buy VH148
 


 
Specifications, Features, Applications
18020 Hobart Blvd., Unit B Gardena, CA 90248 U.S.A Tel.: (310) 767-1052 Fax: (310) 767-7958
FEATURES

VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOAD RATING TO 250 AMPS PEAK

Case: Molded plastic, U/L Flammability Rating 94V-0 Terminals: Round silver plated copper pins Soldering: Per MIL-STD 202 Method 208 guaranteed Polarity: Marked on side of case; positive lead at beveled corner Mounting Position: Any. Through hole provided for #6 screw Weight: 0.13 Ounces (3.6 Grams)

Ratings 25 ░C ambient temperature unless otherwise specified. Single phase, 60Hz, resistive or inductive load. For capacitive loads, derate current by 20%.

Series Number Maximum DC Blocking Voltage Working Peak Reverse Voltage Maximum Peak Recurrent Reverse Voltage RMS Reverse Voltage Power Dissipation in V(BR) Region for 100 ÁS Square Wave Continuous Power Dissipation in V(BR) Region THS=80 oC (Heat Sink Temp) Thermal Energy (Rating for Fusing) < 8.3mSec Peak Forward Surge Current. Single 60Hz Half-Sine Wave Superimposed on Rated Load (JEDEC Method). 60O C Average Forward Rectified Current, 60 C (Note 2)

Junction Operating and Storage Temperature Range Minimum Avalanche Voltage Maximum Avalanche Voltage Maximum Forward Voltage (Per Diode) at 6 Amps DC Typical Junction Capacitance (Note 4)

VRM VRWM VRRM VR (RMS) PRM PR I2t IFSM IO TJ, TSTG V(BR) Min V(BR) Max VFM 25 C @TA 125o C IRM VISO RJC See Note 5 See Note 5

Minimum Insulation Breakdown Voltage (Circuit to Case) Typical Thermal Resistance, Junction to Case (Note 2)

NOTES: (1) Bolt bridge on heat sink with #6 screw, using silicon thermal compound between bridge and mounting surface for maximum heat transfer.

(2) Bridge mounted on 4.0" sq. x 0.11" thick (10.5cm sq. x 0.3cm) aluminum plate (3) Bridge mounted on PC Board with 0.5" sq. (12mm sq.) copper pads and bridge lead length (9.5mm) (4) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts (5) These bridges exhibit the avalanche characteristic at breakdown. If your application requires a specific breakdown voltage range, please contact us.

Temperature, oC FIGURE 1. FORWARD CURRENT DERATING CURVE
Number of Cycles 60 Hz FIGURE 2. MAXIMUM NON-REPETITIVE SURGE CURRENT
Instantaneous Forward Voltage (Volts) FIGURE 3. TYPICAL FORWARD CHARACTERISTIC PER DIODE
Percent of Rated Peak Reverse Voltage FIGURE 4. TYPICAL REVERSE CHARACTERISTICS PER DIODE

NOTES NOTE 4 (1) Case Temperature, TC, With Bridge Mounted x 0.11" Thick (10.5cm Sq. x 0.3cm) Aluminum Plate 25o C; Pulse Width 300ÁSec; 1% Duty Cycle = 1 MHz; Vsig - 1000V

Reverse Voltage, (Volts) FIGURE 5. TYPICAL JUNCTION CAPACITANCE PER DIODE



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