Details, datasheet, quote on part number: MCIMX357CJQ5C
PartMCIMX357CJQ5C
CategorySemiconductors => Integrated Circuits (ICs) => MCU, MPU, DSP, DSC, SoC Processors => Processors - Application Specialized
TitleProcessors - Application Specialized RINGO MX35 TO2.1
Description
CompanyFreescale Semiconductor
DatasheetDownload MCIMX357CJQ5C datasheet
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Specifications 
ManufacturerFreescale Semiconductor
Product CategoryProcessors - Application Specialized
RoHS Details
Operating Supply Voltage1.33 V to 1.47 V
Maximum Operating Temperature+ 85 C
Mounting StyleSMD/SMT
Package / CasePBGA-5284
PackagingTray
CoreARM1136JF-S
Data Bus Width32 bit
Data RAM Size128 KB
Interface TypeI2C, JTAG, UART
Maximum Clock Frequency532 MHz
Minimum Operating Temperature- 40 C
Number of Timers3
Processor Seriesi.MX357
MCIMX357CJQ5C photo

 

Features, Applications
Freescale Semiconductor Data Sheet: Technical Data
Package Information Plastic Package Case x 17 mm, 0.8 mm Pitch
Ordering Information See Table 1 on page 3 for ordering information.

The i.MX353 and the i.MX357 multimedia applications processors represent the next generation of ARM11 products with the right performance and integration to address applications within the industrial and consumer markets for applications such as HMI and display controllers. Unless otherwise specified, the material in this data sheet is applicable to both the i.MX353 and i.MX357 devices and referred to singularly throughout this document or MCIMX35. The i.MX353 devices do not include a graphics processing unit (GPU). For information on i.MX35 devices for automotive applications, please refer to document number, MCIMX35SR2AEC. The i.MX35 processor takes advantage of the ARM1136JF-STM core running at 532 MHz that is boosted by a multi-level cache system and integrated features such as LCD controller, Ethernet, and graphics acceleration for creating rich user interfaces. The i.MX35 supports connections to various types of external memories, such as SDRAM, mobile DDR, and DDR2, SLC and MCL NAND Flash, NOR Flash and

1. Introduction. 1 1.1. Features. 2 1.2 Ordering Information. 3 1.3. Block Diagram. 5 2 Functional Description and Application Information. 4 2.1. Application Processor Domain Overview. 5 2.2. Shared Domain Overview. 6 2.3. Advanced Power Management Overview. 2.4. ARM11 Microprocessor Core. 6 2.5. Module Inventory. 7 3. Signal Descriptions: Special Function Related Pins. 12 4. Electrical Characteristics. 4.1. i.MX35 Chip-Level Conditions. 12 4.2. Power Modes. 15 4.3. Supply Power-Up/Power-Down Requirements and Restrictions. 16 4.4. Reset Timing. 17 4.5. Power Characteristics. 18 4.6. Thermal Characteristics. 19 4.7. I/O Pin DC Electrical Characteristics. 20 4.8. I/O Pin AC Electrical Characteristics. 23 4.9. Module-Level AC Electrical Specifications. 29 5. Package Information and Pinout. 130 5.1. MAPBGA Production Package mm, 0.8 Pitch. 131 5.2. MAPBGA Signal Assignments. 132 6. Product Documentation. 144 7. Revision History. 144

SRAM. The devices can be connected to a variety of external devices such as USB 2.0 OTG, ATA, MMC/SDIO, and Compact Flash.

Features

It provides low-power solutions for applications demanding high-performance multimedia and graphics. The i.MX35 is based on the ARM1136 platform, which has the following features: ARM1136JF-S processor, version 16-Kbyte L1 instruction cache 16-Kbyte L1 data cache 128-Kbyte L2 cache, version r0p4 128 Kbytes of internal SRAM Vector floating point unit (VFP11) To boost multimedia performance, the following hardware accelerators are integrated: Image processing unit (IPU) OpenVG 1.1 graphics processing unit (GPU) (not available for the MCIMX351) The MCIMX35 provides the following interfaces to external devices (some of these interfaces are muxed and not available simultaneously): 2 controller area network (CAN) interfaces 2 SDIO/MMC interfaces, 1 SDIO/CE-ATA interface (CE-ATA is not available for the MCIMX351) 32-bit mobile DDR, DDR2 (4-bank architecture), and SDRAM (up to 133 MHz) 2 configurable serial peripheral interfaces (CSPI) (up to 52 Mbps each) Enhanced serial audio interface (ESAI) 2 synchronous serial interfaces (SSI) Ethernet MAC 10/100 Mbps 1 USB 2.0 host with ULPI interface or internal full-speed PHY. to 480 Mbps if external HS PHY is used. 1 USB 2.0 OTG (up to 480 Mbps) controller with internal high-speed OTG PHY Flash controller--MLC/SLC NAND and NOR GPIO with interrupt capabilities 3 I2C modules (up to 400 Kbytes each) JTAG Key pin port Asynchronous sample rate converter (ASRC) 1-Wire Parallel camera sensor (4/8/10/16-bit data port for video color models: YCC, YUV, 30 Mpixels/s) Parallel display (primary x 1024)

i.MX35 Applications Processors for Industrial and Consumer Products, Rev. 9 2 Freescale Semiconductor

Parallel ATA (up to 66 Mbytes) (not available for the MCIMX351) PWM SPDIF transceiver 3 UART (up to 4.0 Mbps each)

Table 1 provides the ordering information for the i.MX35 processors for consumer and industrial applications.

Description

Table 93 Table 93 Table 93 Table 93 Table 93 Table 93 Table 93 Table 93 Table 93 Table 93 Table 94 Table 94 Table 94 Table 94 Table 94 Table 94 Table 94 Table 94 Table 94 Table 94

Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: Indicated by the Icon 2 Case 5284 is RoHS-compliant, lead-free, MSL MHz rated devices meet all specifications of 400 MHz rated devices. A 532 MHz device can be substituted in place a 400 MHz device.

i.MX35 Applications Processors for Industrial and Consumer Products, Rev. 9 Freescale Semiconductor 3


 

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