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Details, datasheet, quote on part number:PKF4629
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Datasheet text preview:
PKF 4000 I
37 W DC/DC Power Modules 48 V Input Series
· SMD and through-hole versions with ultra low component height 8.0 mm (0.315 in) · 83% efficiency (typ at 5V) · 1,500 V dc isolation voltage · MTBF > 4.9 million hours at +50°C pin temperature (+40°C ambient) · Low EMI in conformance with class A in CISPR 22 and FCC part 15J
Patents
US: D357901 DE: M94022763
The MacroDensÔ 3 7 W PKF 4000 I series true component level on-board DC/DC power modules are intended as distributed power sources in decentralized 48 V and 60 V DC power systems. Utilization of thick film technology and a high degree of silicon integration has made it possible to achieve a MTBF of more than 4.9 million hours. The high reliability and the very low height of these DC/DC power modules makes them particularly suited for Information Technology and Telecom (IT&T) applications, with board spacing down to 15 mm or 0.6 in. The over-moulded rugged design makes them also suitable for other demanding industrial applications. They are optimized for free
convection cooling and have an operational ambient temperature range in compliance with present and future application needs, including non temperature controlled environments. The mechanical design offers the choice of surface mount or through-hole versions, delivered in ready-to-use tubes, trays or tape & reel package and compatibility with semi and fully aqueous cleaning processes. The PKF series is manufactured using highly automated manufacturing lines with a world-class quality commitment and a five-year warranty. Ericsson Microelectronics AB has been an ISO 9001 certified supplier since 1991. For a complete product program please reference the back cover.
E
General
Absolute Maximum Ratings
Characteristics TP TS VI VISO Wtr VRC Vadj Pin temperature at full output power1) Storage temperature Continuous input voltage2) Isolation voltage (input to output test voltage) Transient input energy 3) Remote control voltage pin 10, 11 Output adjust voltage pin 8, 9 5 5 min 4 5 55 0.5 1,500 0.1 + 40 + 40 max +95 +125 + 75 Unit °C °C V dc V dc Ws V dc V dc
Stress in excess of Absolute Maximum Ratings may cause permanent damage. Absolute Maximum Ratings, sometimes referred to as no destruction limits, are normally tested with one parameter at a time exceeding the limits of Output data or Electrical Characteristics. If exposed to stress above these limits, function and performance may degrade in an unspecified manner.
Input TP < TP max unless otherwise specified
NOTES : Characteristics VI VI off VI on CI P Ii P RC Input voltage range2) 4) Tur n-off input voltage (See typical characteristics) Tur n-on input voltage (See typical characteristics) Input capacitance Input idling power IO =0, TP = 30...+85°C TP = 30... +85 °C, RC connected to pin 17 (VI = 53 V) (VI = 67 V) (VI = 53 V) (VI = 67 V) 25 30 Conditions min 38 30 34.5 36.5 1.4 130 170 typ max 72 36 38 Unit V V V mF
2) 1)
mW
Input stand-by power
mW
Environmental Characteristics
Characteristics Vibration (Sinusoidal) JESD 22-B103
(IEC 68-2-6 Fc)
3) 4)
Test procedure & conditions Frequency Amplitude Acceleration Number of cycles Frequency Acceleration density spectrum Duration R e p ro d u c a b i l i t y Peak acceleration Shock duration Temperature Number of cycles Temperature Humidity Duration Temperature, solder Duration Duration Temperature Concentration 10...500 Hz 0.75 mm 10 g 10 in each axis 10...500 Hz 0 . 5 g 2/ H z 10 min in 3 directions medium (IEC 62-2-36) 200 g 3 ms 40°C...+125°C 500 85°C 85% RH 1000 hours 260°C 10...13 s 96 h 35°C 5%
5)
TP, is defined as the maximum temperature on the connection pins at the PB (Printed Board) solder joint, mounted on a 5 8 dm2 (1 dm2=15.5 in2) multi-layer PB (>4 layers), with 20 mm (0.8 in) board-pitch and free convection cooling. Corresponding ambient temperature range (TA) at full output power is 45...+85°C. The input voltage range 38...72 V dc meets the European Telecom Standard prETS 300 132-2 Nominal input voltage range in 48V and 60 Vdc power systems, 40.5... 57.0V and 50.0... 72.0V respectively. At input voltages exceeding 72V (abnormal voltage) the power loss will be higher than at normal input voltage and TP must be limited to max +85°C. Absolute max continuous input voltage is 75 Vdc. Output characteristics will be marginally affected at input voltages exceeding 72 V. For more information see page 5. The power modules will operate down to VI £36 V, when VI decreases, but will turn on at VI £38 V, when VI increases (see also Operating information). The test is applicable for through-hole versions.
Random vibration
MIL-STD-883 Method 2026
(IEC 68-2-34 Ed)
Shock (Half sinus) Temperature change Accelerated damp heat Solder resistability5) Aggressive environment
JESD 22-B104
(IEC 68-2-27 Ea)
JESD 22-A104
(IEC 68-2-14 Na)
JESD 22-A101
(IEC 68-2-3 Ca with bias)
JESD 22-B106
(IEC 68-2-20 Tb 1A)
IEC 68-2-11 Ka
2
EN/LZT 146 33 R1A (Replaces EN/LZT 137 09 R7) © Ericsson Microelectronics AB, June 2000
Mechanical Data
Through-hole version Surface-mount version
Foot print Component side
Foot print Component side
1
2
3
4
5
6
7
8
9
5.0 [0.197] 40.0 [1.575]
3.6 [0.142]
Dimensions in mm (in)
24.0 [0.945] 29.6 [1.165]
18 17 16 15 14 13 12 11 10
2.8 [0.110]
Dimensions in mm (in)
Connections
Pin 1 2 3 46 7 8 9 10 11 12 16 17 18 Designation Out 1 Rtn Out 2 NC Aux Vadj NOR TOA RC NC In + In Function Output 1. Positive voltage ref. to Rtn. Output return. Output 2 (+ or ). Not connected in single output models. Galvanically isolated from input pins. Not connected. Not connected. Output voltage adjust. To set typical output voltage (VO i) connect pin 8 to pin 9. Connection of Nominal Output voltage Resistor. (See Operating Information, Output Voltage Adjust). Turn-on/off input voltage adjust (VIon/VIoff). Used to decrease the tur n-on/off input voltage threshold. (See Operating Information). Remote control and turn-on/off input voltage adjust. Used to turn-on and turn-off output and to set the turn-on/off input voltage threshold. Not connected. Negative input. Positive input.
Weight
Maximum 20 g (0.71 oz).
Case
The case consists of semiconductor grade epoxy with embedded pins. Coefficient of thermal expansion (CTE) is typ. 15 ppm/°C.
Connection Pins
Base material is copper (Cu), first plating is nickel (Ni) and second (outer) plating is palladium (Pd). 3
EN/LZT 146 33 R1A (Replaces EN/LZT 137 09 R7) © Ericsson Microelectronics AB, June 2000
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