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Details, datasheet, quote on part number:PKF4910ASI
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Datasheet text preview:
PKF series
PKF series General information
· SMD and through hole versions with ultra-low component height 8.0 mm (0.315 in.) · Up to 87% efficiency at full load · Safety requirements in accordance with EN60950 · MTTF >10 million hours at +50°C case temperature (+40°C ambient) · Low EMI
Patents US: D357901 DE: M94022763
The MacroDensTM PKF family of true component level on-board DC/DC power modules are intended as distributed power sources in decentralized power systems. Utilization of thick film technology and a high degree of silicon integration has made it possible to achieve a MTTF of more than 10 million hours. The high reliability and the very low heights of these DC/DC power modules makes them particularly suited for Information Technology and Telecom (IT&T) applications, with board spacing down to 15 mm or 0.6 in. They are optimized for an operational ambient temperature range in compliance
with present and future application needs, including non temperature controlled environments. The mechanical design offers surface mount and throughhole versions, delivered in ready-to-use tubes, trays or tape & reel packages, and compatibility with semi and fully aqueous cleaning processes. The PKF series is manufactured in highly automated production lines using SMT, laser trimming, 100% burn-in and ATE final inspection. Ericsson Microelectronics AB has been an ISO 9001 certified supplier since 1991. For a complete product program please reference the back cover.
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Environmental Characteristics
Characteristics Test procedure & conditions Frequency Amplitude Acceleration Number of cycles Frequency Acceleration density spectrum Duration Reproducability Peak acceleration Shock duration Temperature Humidity Duration Temperature Number of cycles Duration Temperature Temperature, solder Duration Temperature Duration Number of cycles 10...500 Hz 0.75 mm 10 g 10 in each axis 10...500 Hz 0 . 5 g 2/ H z 10 min in 3 directions medium (IEC 62-36) 200 g 3 ms 85°C 85% RH 1000 hours 40°C...+125°C 500 96 h 35°C 260°C 10...13 s 125°C 1000hrs 2
Vibration (Sinusoidal)
JESD 22-B103 (IEC 68-2-6 Fc)
Random vibration
MIL-STD-883 Method 2026 (IEC 68-2-34 Ed) JESD 22-A104 (IEC 68-2-14 Na) JESD 22-A101 (IEC 68-2-3 Ca with bias) JESD 22-B104 (IEC 68-2-27 Ea) JESD 22-A-A107 (IEC 68-2-11 Ka) JESD 22-B106 (IEC 68-2-20 Tb 1A) JESD22-A10 JESD22-B105 JESD22-B102
Shock (Half sinus) Temperature change Accelerated damp heat Aggressive environment Resistance to soldering temp1) 2) High temp Storage life Lead Integrity Solderability
Operational life test
Temperature Maximum load Input voltage on Input voltage off Duration J-STD-020 Level 1
85°C 9min 3min 1000hrs
Moisture reflow Senitive classification
1) 2)
Applies to through-hole versions For surfacemount versions please see soldering profile page 4.
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EN/LZT 146 57 R1A © Ericsson Microelectronics AB, March 2001
Mechanical Data
Through-hole version Surface-mount version
Foot print Component side
Foot print Component side
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9 3.6[0.142]
5.0[0.197] 40.0[1.575]
Dimensions in mm (in)
Dimensions in mm (in)
Weight
Maximum 20 g (0.71 oz).
Case
The case consists of semiconductor grade epoxy with embedded pins. Coefficient of thermal expansion (CTE) is typ. 15 ppm/°C.
Connection Pins
Base material is copper (Cu), first plating is nickel (Ni) and second (outer) plating is palladium (Pd).
24.0[0.945] 29.6[ 1.165]
18 17 16 15 14 13 12 11 10
2.8[0.110]
Dimensions in mm (in)
EN/LZT 146 57 R1A © Ericsson Microelectronics AB, March 2001
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