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Details, datasheet, quote on part number:PKF5000R1A
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Datasheet text preview:
PKF 5000 I
56 W DC/DC Power Modules Wide Input Series
· SMD and through-hole versions with ultra low component height 8 mm (0.315 in.) · 1872 V input voltage range · 82% efficiency (typ at 5 V) · 1,500 V dc isolation voltage · Switching frequency syncronization · MTBF > 4.9 million hours at +55°C case temperature (+40 °C ambient) · Low EMI measured according to CISPR 22 and FCC part 15J
Patents
US: D357901 DE: M94022763
The MacroDensTM PKF 5000 I series true component level on-board DC/DC power modules are intended as distributed power sources in decentralized 24, 48 and 60 V DC power systems. Utilization of thick film technology and a high degree of silicon integration has made it possible to achieve a MTBF of more than 4.9 million hour. The highly reliable and rugged over-moulded design and the ultra low height of these DC/DC power modules makes them particularly suited for Information Technology and Telecom (IT&T) and other demanding industrial applications, with board spacing down to 15 mm or 0.6 in. These DC/DC power modules are optimized for free convection cooling and have an operational ambient temperature
range in compliance with present and future application needs, including non temperature controlled environments. The mechanical design offers the choice of surface mount or through-hole versions, delivered in readyto-use tubes, trays or tape & reel package, and compatibility with semi and fully aqueous cleaning processes. The PKF series is manufactured using highly automated manufacturing lines with a world-class quality commitment and a five-year warranty. Ericsson Microelectronics AB has been an ISO 9001 certified supplier since 1991. For a complete product program please reference the back cover.
E
General
Absolute Maximum Ratings
Characteristics TC TS VI V ISO W tr VRC Vadj Case temperature at full output power Storage temperature Continuous input voltage1) Isolation voltage (input to output test voltage) Transient input energy Remote control voltage pin 10,11 Output adjust voltage pin 8, 9 5 5 min 45 55 0.5 1,500 0.01 + 16 + 40 max +100 +125 +75 Unit °C °C V dc V dc Ws V dc V dc
Stress in excess of Absolute Maximum Ratings may cause permanent damage. Absolute Maximum Ratings, sometimes referred to as no destruction limits, are normally tested with one parameter at a time exceeding the limits of Output data or Electrical Characteristics. If exposed to stress above these limits, function and performance may degrade in an unspecified manner.
NOTES:
Input TC < TCmax unless otherwise specified
Characteristics VI VIoff VIon CI P Ii P RC Input voltage range1) Turn-off input voltage Turn-on input voltage Input capacitance Input idling power IO = 0, TC = 30...+ 90 °C (VI = 27V) (VI = 53 V)
(See typical characteristics) (See typical characteristics)
1)
Conditions
min 18 15
typ
max 72
Unit V V
16 17.4 1.4 244 240 18 67 17.9
V mF
2)
The input voltage range 18...72 V dc meets the European Telecom Standard ETS 300 132-2 Nominal input voltage range in 48 V and 60 V dc power systems, 40.5... 5 7.0 V and 50.0... 72. 0 V respectively. At input voltages exceeding 72 V (abnormal voltage) the power loss will be higher than at normal input voltage and TC must be limited to max +90 °C. Absolute max continuous input voltage is 75 V dc. Output characteristics will be marginally affected at input voltages exceeding 72 V. The test is applicable for through-hole versions.
mW
Input stand-by power
(VI = 27V) T C = 3 0 ... + 9 0 °C RC connected to pin 17 (VI = 53 V)
mW
Environmental Characteristics
Characteristics Vi b r a t i o n (Sinusoidal) JESD 22-B103
(IEC 68-2-6 Fc)
Test procedure & conditions Frequency Amplitude Acceleration Number of cycles Frequency Acceleration density spectrum Duration Reproducability Peak acceleration Shock duration Temperature Number of cycles Temperature Humidity Duration Temperature, solder Duration Duration Temperature Concentration 10...500 Hz 0.75 mm 10 g 10 in each axis 10...500 Hz 0 . 5 g 2/ H z 10 min in 3 directions medium (IEC 62-2-36) 200 g 3 ms 40°C...+125°C 500 85°C 85% RH 1000 hours 260°C 10...13 s 96 h 35°C 5%
Random vibration
MIL-STD-883 Method 2026
(IEC 68-2-34 Ed)
Shock (Half sinus) Temperature change Accelerated damp heat Solder resistability2) Aggressive environment
JESD 22-B104
(IEC 68-2-27 Ea)
JESD 22-A104
(IEC 68-2-14 Na)
JESD 22-A101
(IEC 68-2-3 Ca with bias)
JESD 22-B106
(IEC 68-2-20 Tb 1A)
IEC 68-2-11 Ka
2
EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) © Ericsson Microelectronics, June 2000
Mechanical Data
Through-hole version Surface-mount version
Foot print Component side
Foot print Component side
1
2
3
4
5
6
7
8
9
40.0 [1.575]
5.0 [0.197] 40.0 [1.575]
3.6 [0.142]
Dimensions in mm (in)
24.0 [0.945] 29.6 [1.165]
18 17 16 15 14 13 12 11 10
2.8 [0.110]
Dimensions in mm (in)
Connections
Weight
Maximum 20 g (0.71 oz).
Pin 1 2 36 7 8 9 10 11 12 16 17 18
Designation Out 1 Rtn NC Sync Vadj NOR Aux RC NC In +In
Function Output 1. Positive voltage ref. to Rtn. Output return. Not connected. Synchronization input. Output voltage adjust. To set typical output voltage (VOi) connect pin 8 to pin 9. Connection of Nominal Output voltage Resistor. (See output voltage adjust p. 12). Inter nally connected to pin 11. Remote control and turn-on/off input voltage adjust. Used to turn-on and turn-off output. Not connected. Negative input. Positive input.
Case
The case consists of semiconductor grade epoxy with embedded pins. Coefficient of thermal expansion (CTE) is typ. 15 ppm/°C.
Connection Pins
Base material is copper (Cu), first plating is nickel (Ni) and second (outer) plating is palladium (Pd). 3
EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) © Ericsson Microelectronics, June 2000
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