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Details, datasheet, quote on part number:FD400R33KF2
 
 
Part:FD400R33KF2
Category:Discrete => IGBTs (Insulated Gate Bipolar Transistors) => IGBT Modules
Description:
Company:Eupec GmbH & Co KG
Datasheet:Download FD400R33KF2 datasheet   File size : 113 kB
Request For quote:  Find where to buy FD400R33KF2
 



Datasheet text preview:
Technische Information / Technical Information
IGBT-Module IGBT-Modules

FD 400 R 33 KF2
Datenblatt data sheet

Höchstzulässige Werte / Maximum rated values
Elektrische Eigenschaften / Electrical properties
Kollektor-Emitter-Sperrspannung collector-emitter voltage Kollektor-Dauergleichstrom DC-collector current Periodischer Kollektor Spitzenstrom repetitive peak collector current Gesamt-Verlustleistung total power dissipation Gate-Emitter-Spitzenspannung gate-emitter peak voltage Dauergleichstrom DC forward current Periodischer Spitzenstrom repetitive peak forw. Current Grenzlastintegral der Diode I2t - value, Diode Spitzenverlustleistung der Diode maximum power dissipation diode Isolations-Prüfspannung insulation test voltage Teilentladungs-Aussetzspannung partial discharge extinction voltage tP = 1 ms Tj = 25°C Tj = -25°C TC = 80°C TC = 25 °C tP = 1 ms, TC = 80°C VCES 3300 3300 400 660 800 V V A A A

IC,nom. IC ICRM

TC=25°C, Transistor

Ptot

4,8

kW

VGES

+/- 20V

V

IF

400

A

IFRM

800

A

VR = 0V, t p = 10ms, T Vj = 125°C

It

2

55.600

As

2

Tj = 125°C

PRQM

400

kW

RMS, f = 50 Hz, t = 1 min.

VISOL

6.000

V

RMS, f = 50 Hz, Q PD 10 pC (acc. to IEC 1287)

VISOL

2.600

V

Charakteristische Werte / Characteristic values
Transistor / Transistor
Kollektor-Emitter Sättigungsspannung collector-emitter saturation voltage Gate-Schwellenspannung gate threshold voltage Eingangskapazität input capacitance Rückwirkungskapazität reverse transfer capacitance Gateladung gate charge Kollektor-Emitter Reststrom collector-emitter cut-off current Gate-Emitter Reststrom gate-emitter leakage current IC = 400 A, V GE = 15V, Tvj = 25°C IC = 400 A, V GE = 15V, Tvj = 125°C IC = 40 mA, VCE = VGE, Tvj = 25°C VGE(th) VCE sat

min.
4,2

typ.
3,40 4,30 5,1

max.
4,25 5,00 6,0 V V V

f = 1MHz,Tvj = 25°C,V CE = 25V, V GE = 0V

Cies

-

50

-

nF

f = 1MHz,Tvj = 25°C,V CE = 25V, V GE = 0V

Cres

-

2,7

-

nF

VGE = -15V ... + 15V, V CE = 1800V VCE = 3300V, V GE = 0V, Tvj = 25°C VCE = 3300V, V GE = 0V, Tvj = 125°C VCE = 0V, V GE = 20V, Tvj = 25°C

QG ICES

-

8 0,05 20 -

4 50 400

µC mA mA nA

IGES

-

prepared by: Jürgen Göttert approved by: Chr. Lübke: 04.10.99

date of publication : 08.06.99 revision: 2

1 (9)

Datenblatt FD 400 R 33 KF2 04.10.99

Technische Information / Technical Information
IGBT-Module IGBT-Modules

FD 400 R 33 KF2
Datenblatt data sheet

Charakteristische Werte / Characteristic values
Transistor / Transistor
Einschaltverzögerungszeit (ind. Last) turn on delay time (inductive load) IC = 400 A, V CC = 1800V VGE = ±15V, RG = 3,6 , CGE = 68nF, Tvj = 25°C VGE = ±15V, RG = 3,6 , CGE = 68nF, Tvj = 125°C Anstiegszeit (induktive Last) rise time (inductive load) IC = 400 A, V CC = 1800V VGE = ±15V, RG = 3,6 , CGE = 68nF, Tvj = 25°C VGE = ±15V, RG = 3,6 , CGE = 68nF, Tvj = 125°C Abschaltverzögerungszeit (ind. Last) turn off delay time (inductive load) IC = 400 A, V CC = 1800V VGE = ±15V, RG = 3,6 , CGE = 68nF, Tvj = 25°C VGE = ±15V, RG = 3,6 , CGE = 68nF, Tvj = 125°C Fallzeit (induktive Last) fall time (inductive load) IC = 400 A, V CC = 1800V VGE = ±15V, RG = 3,6 , CGE = 68nF, Tvj = 25°C VGE = ±15V, RG = 3,6 , CGE = 68nF, Tvj = 125°C Einschaltverlustenergie pro Puls turn-on energy loss per pulse Abschaltverlustenergie pro Puls turn-off energy loss per pulse Kurzschlußverhalten SC Data Modulinduktivität stray inductance module Modul-Leitungswiderstand, Anschlüsse - Chip lead resistance, terminals - chip IC = 400 A, V CC = 1800V, V GE = 15V RG = 3,6 , CGE = 68 nF, Tvj = 125°C, LS = 60nH IC = 400 A, V CC = 1800V, V GE = 15V RG = 3,6 , CGE = 68 nF, Tvj = 125°C, LS = 60nH tP 10µsec, V GE 15V TVj125°C, VCC=2500V , VCEmax=VCES -LsCE ·dI/dt IGBT (Zweig / arm 1 ) Diode (Zweig / arm 2) T = 25°C, IGBT (Zweig / arm 1 ) T = 25°C, Diode (Zweig / arm 2) ISC LsCE 2000 25 25 0,37 0,39 A nH nH m m Eoff 510 mWs Eon 960 mWs tf 200 200 ns ns td,off 1550 1700 ns ns tr 250 270 ns ns td,on 370 350 ns ns

min.

typ.

max.

RCC'+EE'

Charakteristische Werte / Characteristic values
Diode / Diode
Durchlaßspannung forward voltage Sperrstrom reverse current Rückstromspitze peak reverse recovery current IF = 400 A, V GE = 0V, Tvj = 25°C IF = 400 A, V GE = 0V, Tvj = 125°C VCE = 3300V, T vj = 25°C, Zweig / arm 2 VCE = 3300V, T vj = 125°C, Zweig / arm 2 IF = 400 A, - diF/dt = 1200 A/µsec VR = 1800V, VGE = -10V, T vj = 25°C VR = 1800V, VGE = -10V, T vj = 125°C Sperrverzögerungsladung recovered charge IF = 400 A, - diF/dt = 1200 A/µsec VR = 1800V, VGE = -10V, T vj = 25°C VR = 1800V, VGE = -10V, T vj = 125°C Abschaltenergie pro Puls reverse recovery energy IF = 400 A, - diF/dt = 1200 A/µsec VR = 1800V, VGE = -10V, T vj = 25°C VR = 1800V, VGE = -10V, T vj = 125°C Erec 245 500 mWs mWs Qr 235 440 µAs µAs IRM 330 350 A A IR VF

min.
-

typ.
2,80 2,80 0,005 2

max.
3,50 3,50 0,8 10 V V mA mA

2 (9)

Datenblatt FD 400 R 33 KF2 04.10.99

Technische Information / Technical Information
IGBT-Module IGBT-Modules

FD 400 R 33 KF2
Datenblatt data sheet

Thermische Eigenschaften / Thermal properties
min.
Innerer Wärmewiderstand thermal resistance, junction to case Transistor / transistor, DC Diode/Diode, DC, Zweig / arm 1 Diode/Diode, DC, Zweig / arm 2 Übergangs-Wärmewiderstand thermal resistance, case to heatsink Höchstzulässige Sperrschichttemperatur maximum junction temperature Betriebstemperatur operation temperature Lagertemperatur storage temperature pro Modul / per module Paste = 1 W/m*K / grease = 1 W/m*K RthCK RthJC -

typ.
0,006

max.
0,026 0,051 0,051 K/W K/W K/W K/W

Tvj

-

-

150

°C

Top

-40

-

125

°C

Tstg

-40

-

125

°C

Mechanische Eigenschaften / Mechanical properties
Gehäuse, siehe Anlage case, see appendix Material Modulgrundplatte material of module baseplate Innere Isolation internal insulation Kriechstrecke creepage distance Luftstrecke clearance CTI comperative tracking index Anzugsdrehmoment f. mech. Befestigung mounting torque Anzugsdrehmoment f. elektr. Anschlüsse terminal connection torque Gewicht weight terminals M4 terminals M8 G M1 AlSiC

AlN

32,2

mm

19,1

mm

> 400 5 Nm

M2

2 8 .. 10 1000

Nm Nm g

Mit dieser technischen Information werden Halbleiterbauelemente spezifiziert, jedoch keine Eigenschaften zugesichert. Sie gilt in Verbindung mit den zugehörigen Technischen Erläuterungen.

This technical information specifies semiconductor devices but promises no characteristics. It is valid in combination with the belonging technical notes.

3 (9)

Datenblatt FD 400 R 33 KF2 04.10.99

Technische Information / Technical Information
IGBT-Module IGBT-Modules

FD 400 R 33 KF2
Datenblatt data sheet Ausgangskennlinie (typisch) Output characteristic (typical) IC = f (VCE)
V GE = 15V

800 700 600 500
T = 25°C T = 125°C

IC [A]

400 300 200 100 0 0,0 0,5 1,0 1,5 2,0 2,5 3,0 3,5 4,0 4,5 5,0 5,5 6,0 6,5 7,0

VCE [V]

Ausgangskennlinienfeld (typisch) Output characteristic (typical)
800 700 600 500
VGE = 8V VGE = 9V VGE = 10V VGE = 12V VGE = 15V VGE = 20V

IC = f (VCE)
T vj = 125°C

IC [A]

400 300 200 100 0 0,0 0,5 1,0 1,5 2,0 2,5 3,0 3,5 4,0 4,5 5,0 5,5 6,0 6,5 7,0

VCE [V]

4 (9)

Datenblatt FD 400 R 33 KF2 04.10.99

Technische Information / Technical Information
IGBT-Module IGBT-Modules

FD 400 R 33 KF2
Datenblatt data sheet Übertragungscharakteristik (typisch) Transfer characteristic (typical) IC = f (VGE)
VCE = 20V

800
T = 25°C

700 600 500

T = 125°C

IC [A]

400 300 200 100 0 5 6 7 8 9 10 11 12 13

VGE [V]

Durchlaßkennlinie der Inversdiode (typisch) Forward characteristic of inverse diode (typical)
800
Tj = 25°C

IF = f (VF)

700 600 500

Tj = 125°C

IF [A]

400 300 200 100 0 0,0 0,5 1,0 1,5 2,0 2,5 3,0 3,5 4,0

VF [V]

5 (9)

Datenblatt FD 400 R 33 KF2 04.10.99