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Details, datasheet, quote on part number:74ABT16501
 
 
Part:74ABT16501
Category:Logic => Bus Interface => Bus Oriented Circuits
Description:18-Bit Universal Bus Transceivers With 3-STATE Outputs
Company:Fairchild Semiconductor
Datasheet:Download 74ABT16501 datasheet   File size : 69 kB
Request For quote:  Find where to buy 74ABT16501
 



Datasheet text preview:
74ABT16501 18-Bit Universal Bus Transceivers with 3-STATE Outputs

January 1995 Revised January 1999

74ABT16501 18-Bit Universal Bus Transceivers with 3-STATE Outputs
General Description
The ABT16501 18-bit universal bus transceiver combines D-type latches and D-type flip-flops to allow data flow in transparent, latched, and clocked modes. Data flow in each direction is controlled by output-enable (OEAB and OEBA), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is HIGH. When LEAB is LOW, the A data is latched if CLKAB is held at a HIGH or LOW logic level. If LEAB is LOW, the A bus data is stored in the latch/flip-flop on the LOW-to-HIGH transition of CLKAB. Output-enable OEAB is active-high. When OEAB is HIGH, the outputs are active. When OEAB is LOW, the outputs are in the high-impedance state. Data flow for B to A is similar to that of A to B but uses OEBA, LEBA, and CLKBA. The output enables are complementary (OEAB is active HIGH and OEBA is active LOW). To ensure the high-impedance state during power up or power down, OE inputs should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

Features
s Combines D-Type latches and D-Type flip-flops for operation in transparent, latched, or clocked mode s Flow-through architecture optimizes PCB layout s Guaranteed latch-up protection s High impedance glitch free bus loading during entire power up and power down cycle s Non-destructive hot insertion capability

Ordering Code:
Order Number 74ABT16501CSSC 74ABT16501CMTD Package Number MS56A MTD56 Package Description 56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300" Wide 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide

Devices also available in Tape or Reel. Specify by appending the suffix letter "X" to the ordering code.

Connection Diagram
Pin Assignment for SSOP

Function Table
OEAB L H H H H H H LEAB X H H L L L L

(Note 1) Output A X L H L H X X B Z L H L H B0 (Note 2) B0 (Note 3) X X X H L

Inputs CL KAB

Note 1: A-to-B data flow is shown: B-to-A flow is similar but uses OEBA, LEBA, and CLKBA. Note 2: Output level before the indicated steady-state input conditions were established. Note 3: Output level before the indicated steady-state input conditions were established, provided that CLKAB was HIGH before LEAB went LOW.

© 1999 Fairchild Semiconductor Corporation

DS011690.prf

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74ABT16501

Logic Diagram

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Absolute Maximum Ratings(Note 4)
Storage Temperature Ambient Temperature under Bias Junction Temperature under Bias VCC Pin Potential to Ground Pin Input Voltage (Note 5) Input Current (Note 5) Voltage Applied to Any Output in the Disabled or Power-off State in the HIGH State Current Applied to Output in LOW State (Max) twice the rated IOL (mA) -0.5V to 5.5V -0.5V to VCC -0.5V to +7.0V -0.5V to +7.0V -30 mA to +5.0 mA -65°C to +150°C -55°C to +125°C -55°C to +150°C

DC Latchup Source Current Over Voltage Latchup (I/O)

-500 mA 10V

Recommended Operating Conditions
Free Air Ambient Temperature Supply Voltage Minimum Input Edge Rate (V/t) Data Input Enable Input 50 mV/ns 20 mV/ns -40°C to +85°C +4.5V to +5.5V

Note 4: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 5: Either voltage limit or current limit is sufficient to protect inputs.

DC Electrical Characteristics
Symbol VIH VIL V CD VOH VOL IIH IB V I IIL VID IIH + IOZH IIL + IOZL IOS IC E X IZ Z ICCH ICCL ICCZ ICCT ICCD Output Short-Circuit Current Output HIGH Leakage Current Bus Drainage Test Power Supply Current Power Supply Current Power Supply Current -100 -275 50 100 1.0 68 1.0 2.5 No Load 0.23 mA µA µA mA mA mA mA mA/ MHz Max Max 0 .0 Max Max Max Max Max VOUT = 0V VOUT = VCC VOUT = 5.5V; All Others GND All Outputs HIGH An or Bn Outputs LOW OEn = VCC, All Others at VCC or GND Additional ICC/Input Dynamic ICC (Note 6)
Note 6: Guaranteed, but not tested.

Parameter Input HIGH Voltage Input LOW Voltage Input Clamp Diode Voltage Output HIGH Voltage Output LOW Voltage Input HIGH Current Input HIGH Current Breakdown Test Input LOW Current Input Leakage Test Output Leakage Current

M in 2.0

Typ

Max

Units V

VCC

Conditions Recognized HIGH Signal Recognized LOW Signal

0.8 -1.2 2.5 2.0 0.55 1 1 7 -1 -1 4.75 10 -10

V V V V V µA µA µA V µA µA Min Min Min Min Max Max Max 0 .0

IIN = -18 mA IOH = -3 mA IOH = -32 mA IOL = 64 mA VIN = 2.7V (Note 6) VIN = VCC VIN = 7.0V VIN = 0.5V (Note 6) VIN = 0.0V IID = 1.9 µA All Other Pins Grounded

0 - 5.5V VOUT = 2.7V; OE, OE = 2.0V 0 - 5.5V VOUT = 0.5V; OE, OE = 2.0V

Output Leakage Current

VI = VCC - 2.1V All Others at VCC or GND Outputs Open Transparent Mode One Bit Toggling, 50% Duty Cycle

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74ABT16501

DC Electrical Characteristics
Symbol VOLP VOLV VOHV VIHD VILD Parameter Quiet Output Maximum Dynamic VOL Quiet Output Minimum Dynamic VOL Minimum HIGH Level Dynamic Output Voltage Minimum HIGH Level Dynamic Input Voltage Maximum LOW Level Dynamic Input Voltage -1.5 2.5 2.2 M in Typ 0.7 -1.0 3 .0 1.8 1 .2 0.8 Max 1 .2 Units V V V V V VCC 5 .0 5.0 5 .0 5.0 5.0 Conditions CL = 50 pF; RL = 500 TA = 25°C (Note 7) TA = 25°C (Note 7) TA = 25°C (Note 8) TA = 25°C (Note 9) TA = 25°C (Note 9)

Note 7: Max number of outputs defined as (n). n - 1 data inputs are driven 0V to 3V. One output at LOW. Guaranteed, but not tested. Note 8: Max number of outputs defined as (n). n - 1 data inputs are driven 0V to 3V. One output HIGH. Guaranteed, but not tested. Note 9: Max number of data inputs (n) switching. n - 1 inputs switching 0V to 3V. Input-under-test switching: 3V to threshold (VILD), 0V to threshold (VIHD ). Guaranteed, but not tested.

AC Electrical Characteristics
TA = +25°C Symbol Parameter Min fmax tPLH tP H L tPLH tP H L tPLH tP H L tPZH tPZL tP H Z tPLZ Maximum Clock Frequency Propagation Delay A or B to B or A Propagation Delay LEAB or LEBA to B or A Propagation Delay CLKAB or CLKBA to B or A Propagation Delay OEAB or OEBA to B or A Propagation Delay OEAB or OEBA to B or A 150 1 .0 1 .0 1 .0 1 .0 1 .0 1 .0 1 .5 1.5 1 .5 1.5 VCC = +5V CL = 50 pF Typ 200 2.7 3.2 3.1 3.6 3.4 3 .7 2.7 3 .0 3.7 3 .2 4.6 4.6 5.0 5.5 5.3 5.3 5.6 5.6 6.0 6.0 Max TA = -40°C to +85°C VCC = 4.5V­5.5V CL = 50 pF Min 150 1.0 1.0 1.0 1.0 1.0 1 .0 1.5 1 .5 1.5 1 .5 4 .6 4 .6 5 .0 5 .5 5 .3 5 .3 5 .6 5.6 6 .0 6.0 ns ns ns ns Max MHz ns Units

AC Operating Requirements
TA = +25°C Symbol Parameter Min tS(H) tS(L) tH(H) tH(L) tS(H) tS(L) tH(H) tH(L) tS(H) ts(L) tH(H) tH(L) tW(H) tW(L) tW(H) tW(L) Setup Time, A to CLKAB, B to CLKBA Hold Time, A to CLKAB, B to CLKBA Setup Time, A to LEAB or B to LEBA, CLK HIGH Hold Time, A to LEAB or B to LEBA, CLK HIGH Setup Time, A to LEAB or B to LEBA, CLK LOW Hold Time, A to LEAB or B to LEBA, CLK LOW Pulse Width, LEAB or LEBA, HIGH Pulse Width, CLKAB or CLKBA, HIGH or LOW 4.0 4 .0 0 0 4.0 4.0 1.5 1.5 1.5 1.5 1.5 1.5 3.3 3 .3 3 .3 3 .3 VCC = +5V CL = 50 pF M ax Min 4.0 4.0 0 0 4.0 4.0 1.5 1.5 1.5 1.5 1.5 1.5 3.3 3.3 3.3 3.3 ns ns ns ns ns ns ns TA = -40°C to +85°C VCC = 4.5V­5.5V CL = 50 pF Max ns Units

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Capacitance
Symbol CIN CI/O (Note 10) Parameter Input Capacitance Output Capacitance Typ 5.0 11.0 Units pF pF VCC = 0.0V VCC = 5.0V Conditions TA = 25°C

Note 10: CI/O is measured at frequency f = 1 MHz per MIL-STD-883, Method 3012.

AC Loading

*Includes jig and probe capacitance.

FIGURE 1. Standard AC Test Load Input Pulse Requirements Amplitude 3.0V Rep. Rate 1 MHz tW 500 ns tr 2.5 ns

FIGURE 2. VM = 1.5V

tf 2.5 ns

FIGURE 3. Test Input Signal Requirements

AC Waveforms

FIGURE 4. Propagation Delay Waveforms for Inverting and Non-Inverting Functions

FIGURE 6. 3-STATE Output HIGH and LOW Enable and Disable Times

FIGURE 5. Propagation Delay, Pulse Width Waveforms

FIGURE 7. Setup Time, Hold Time and Recovery Time Waveforms

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