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Part: BAV20

Category:
 Discrete
   -> Diodes & Rectifiers
     -> General Purpose Diodes
             -> Small Signal

Description: High Voltage General Purpose Diode

Company: Fairchild Semiconductor

Datasheet: Download BAV20 datasheet     File size : 67 kB

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Datasheet text preview:
BAV19 / BAV20 / BAV21

BAV19 / 20 / 21

DO-35
Color Band Denotes Cathode

Small Signal Diode
Absolute Maximum Ratings*
Symbol
VRRM IF(AV) IFSM Ts t g TJ
TA = 25°C unless otherwise noted

Parameter
Maximum Repetitive Reverse Voltage Average Rectified Forward Current Non-repetitive Peak Forward Surge Current Pulse Width = 1.0 second Pulse Width = 1.0 microsecond Storage Temperature Range Operating Junction Temperature BAV19 BAV20 BAV21

Value
120 200 250 200 1.0 4.0 -65 to +200 175

Units
V V V mA A A °C °C

*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
NOTES: 1) These ratings are based on a maximum junction temperature of 200 degrees C. 2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.

Thermal Characteristics
Symbol
PD RJA Power Dissipation Thermal Resistance, Junction to Ambient
TA = 25°C unless otherwise noted

Parameter

Value
500 300

Units
mW °C/W

Electrical Characteristics
Symbol
VR

Parameter
Breakdown Voltage BAV19 BAV20 BAV21

Test Conditions
IR = 100 µA IR = 100 µA IR = 100 µA IF = 100 mA IF = 200 mA VR = 100 V VR = 100 V, TA = 150°C VR = 150 V VR = 150 V, TA = 150°C VR = 200 V VR = 200 V, TA = 150°C VR = 0, f = 1.0 MHz IF = IR = 30 mA, IRR = 3.0 mA, RL = 100

Min
120 200 250

Max

Units
V V V V V nA µA nA µA nA µA pF ns

VF IR

Forward Voltage Reverse Current BAV19 BAV20 BAV21

CT trr

Total Capacitance Reverse Recovery Time

1.0 1.25 100 100 100 100 100 100 5.0 50

2 0 0 1 Fairchild Semiconductor Corporation

B AV 1 9 / 2 0 / 2 1 , Rev. C

BAV19 / BAV20 / BAV21

Small Signal Diode
(continued)

Typical Characteristics

3 25

T a = 2 5 °C

50

° Ta= 25 °C

R e v e r s e Current, I R [nA]

R e v e r s e Voltage, V [V] R

40

30

3 00

20

10

2 75

3

5

10

20

30

50

100

0

55

Figure 1. Reverse Voltage vs Reverse Current BV - 1.0 to 100uA
10 0 90 80 70 60 50 40 30 20

R e v e r s e C u r r e n t , I R [uA]

R e v e r s e Voltage, V R [V]
GENERAL RULE: The Reverse Current of a diode will approximately double for every ten (10) Degree C increase in Temperature

100

Figure 2. Reverse Current vs Reverse Voltage IR - 55 to 205 V
Ta= 25 ° C

Ta= 25 ° C

4 50

Forward Voltage, V R [mV]
18 0 200

R e v e rs e Current, I R [nA]

4 00

3 50

3 00

2 50

R e v e rs e Voltage, V R [V]

220

240

255

1

2

3

5

10

20

30

50

100

GENERAL RULE: The Reverse Current of a diode will approximately double for every ten (10) Degree C increase in Temperature

F orwa rd Current, IF [uA]

Figure 3. Reverse Current vs Reverse Roltage IR - 180 to 225 V

Figure 4. Forward Voltage vs Forward Current VF - 1.0 to 100uA

70 0

Ta= 25 °C

1.4 1.3

° Ta= 25 C

Forw ard Voltage, V F [mV]

65 0

F orward Voltage, VF [mV]

1.2 1.1 1.0 0.9 0.8 0.7

60 0

55 0

50 0

45 0

0. 1

0.2

0.3

0.5

1

2

3

5

10

10

20

30

50

100

200

300

500

800

F o rw a rd Current, I F [mA]

F o r w a r d Current, IF [mA]

Figure 5. Forward Voltage vs Forward Current VF - 0.1 to 10mA

Figure 6. Forward Voltage vs Forward Current VF - 10 to 800mA

B AV 1 9 / 2 0 / 2 1 , Rev. C

BAV19 / BAV20 / BAV21

Small Signal Diode
(continued)

Typical Characteristics

(continued)

900 800

1 .3

T a = 25 °C

F o r w a r d Voltage, V [mV] F

700 600 500 400

T a = -40°°C

T o t a l Capacitance [pF]
1 3 10

1 .2

T a = 25 ° C

1 .1

1 .0

Ta= +80 ° C
300 200 100 0 .0 0 1

0 .9

0.003

0.01

0.03

0.1

0.3

0 .8

F o r w a r d C u r r e n t, I F [m A ]

0

2

4

6

8

10

12

14

R e v e r s e Voltage [V]

Figure 7. Forward Voltage vs Ambient Temperature VF - 1.0 uA - 10 mA (-40 to +80 Deg C)
50 4 00

Figure 8. Total Capacitance

R e v e r s e Recovery Time [nS]

3 00

Current [mA]

40

2 00

IF

(A V

)

-A V

ER

AG

30

ER E

CT

1 00

IF I E

DC U

RR

I F = I R = 30 mA R lo o p = 100 Ohms
20 1 .0 1 .5 2 .0 2 .5 3 .0 0 0 50 1 00

EN

TmA

1 50

R e v e r s e Recovery Current, I rr [mA]

A m b i e n t Temperature, T A [ C]

Figure 9. Reverse Recovery Time vs Reverse Recovery Current

Figure 10. Average Rectified Current (IF(AV)) versus Ambient Temperature (TA)

500

Power Dissipation, P [mW] D

400

DO-35 Pkg
300

SOT-23 Pkg
200

100

0

0

50

100

150

200

Average Temperature, IO [ C]

Figure 11. Power Derating Curve

B AV 1 9 / 2 0 / 2 1 , Rev. C

TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.

ACExTM BottomlessTM CoolFETTM CROSSVOLT TM DenseTrenchTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM
DISCLAIMER

FAST ® FASTrTM FRFETTM GlobalOptoisolatorTM GTOTM HiSeCTM ISOPLANARTM LittleFETTM MicroFETTM MicroPakTM MICROWIRETM

OPTOLOGICTM OPTOPLANARTM PACMANTM POPTM Power247TM PowerTrench ® QFETTM QSTM QT OptoelectronicsTM Quiet SeriesTM SILENT SWITCHER ®

SMART STARTTM STAR*POWERTM StealthTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM TruTranslationTM UHCTM UltraFET ®

VCXTM

STAR*POWER is used under license

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant into support device or system whose failure to perform can the body, or (b) support or sustain life, or (c) whose be reasonably expected to cause the failure of the life failure to perform when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS D e f i n i t i o n of Terms D a t a s h e e t Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.

Preliminary

First Production

No Identification Needed

Full Production

Obsolete

Not In Production

This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.

Rev. H4




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