Digchip : Database on electronics components
Electronic components database
Search:                      In section:
Member, Distributor  
Log In
Email:
Password:

Details, datasheet, quote on part number:FDS7088N7
 
 
Part:FDS7088N7
Description:FDS7088N7 - 30V N-Channel. Powertrench MOSFET
Company:Fairchild Semiconductor
Datasheet:Download FDS7088N7 datasheet   File size : 170 kB
Request For quote:  Find where to buy FDS7088N7
 



Datasheet text preview:
FDS7088N7

May 2003

FDS7088N7
30V N-Channel PowerTrench MOSFET
General Description
This N-Channel MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. It has been optimized for "low side" synchronous rectifier operation, providing an extremely low RDS(ON) in a small package.

Features
· 23 A, 30 V RDS(ON) = 3 m @ VGS = 10 V RDS(ON) = 4 m @ VGS = 4.5 V · High performance trench technology for extremely low RDS(ON) · High power and current handling capability · Fast switching · FLMP SO-8 package: Enhanced thermal performance in industry-standard package size

Applications
· Synchronous rectifier · DC/DC converter

5 6 7 8

Bottom-sid e Dra in Contact

4 3 2 1

Absolute Maximum Ratings
Symbol
VDSS VGSS ID PD TJ, TSTG Drain-Source Voltage Gate-Source Voltage Drain Current ­ Continuous ­ Pulsed

TA=25oC unless otherwise noted

Parameter

Ratings
30 ±16
(Note 1a)

Units
V A W °C

23 60 3.0 1.5 ­55 to +150

Power Dissipation for Single Operation

(Note 1a) (Note 1b)

Operating and Storage Junction Temperature Range

Thermal Characteristics
RJA RJC Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case
(Note 1a) (Note 1)

40 0.5

°C/W

Package Marking and Ordering Information
Device Marking FDS7088N7 Device FDS7088N7 Reel Size 13'' Tape width 12mm Quantity 2500 units

2002 Fairchild Semiconductor Corporation

FDS7088N7 Rev C1 (W)

FDS7088N7

Electrical Characteristics
Symbol
BVDSS BVDSS TJ IDSS IGSS VGS(th) VGS(th) TJ RDS(on)

TA = 25°C unless otherwise noted

Parameter
Drain­Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate­Body Leakage
(Note 2)

Test Conditions
ID = 250 µA VGS = 0 V, ID = 250 µA, Referenced to 25°C VDS = 24 V, VGS = ±16 V, VG S = 0 V V DS = 0 V

Min
30

Typ

Max Units
V

Off Characteristics
25 10 ±100 1 1.9 ­6 2.4 3.3 3.5 30 112 3845 930 368 VGS = 15 mV,
(Note 2)

mV/°C µA nA V mV/°C 3 4 5.5 m

On Characteristics

Gate Threshold Voltage Gate Threshold Voltage Temperature Coefficient Static Drain­Source On­Resistance On­State Drain Current Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance Turn­On Delay Time Turn­On Rise Time Turn­Off Delay Time Turn­Off Fall Time Total Gate Charge Gate­Source Charge Gate­Drain Charge

ID = 250 µA VDS = VGS, ID = 250 µA, Referenced to 25°C VGS = 10 V, ID = 23 A ID = 21 A VGS = 4.5 V, VGS = 10 V, ID = 23 A, TJ = 125°C VGS = 10 V, V DS = 5 V VDS = 10 V, VDS = 15 V, f = 1.0 MHz ID = 23 A V GS = 0 V,

3

ID(on) gF S Ciss Coss Crss RG td(on) tr td(off) tf Qg Qgs Qgd IS VSD tr r Qrr

A S pF pF pF 27 23 99 58 48 ns ns ns ns nC nC nC 2.5 A V nS nC

Dynamic Characteristics

f = 1.0 MHz ID = 1 A, RGEN = 6

1.4 15 13 62 36

Switching Characteristics

VDD = 15 V, VGS = 10 V,

VDS = 15 V, VGS = 5.0 V

ID = 23 A,

37 10 14

Drain­Source Diode Characteristics and Maximum Ratings
Maximum Continuous Drain­Source Diode Forward Current Drain­Source Diode Forward VGS = 0 V, IS = 2.5 A Voltage Diode Reverse Recovery Time IF = 23 A, diF/dt = 100 A/µs Diode Reverse Recovery Charge
(Note 2)

0.7 39 33

1.2

Notes: 1. RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RJC is guaranteed by design while RCA is determined by the user's board design.

a)

40°C/W when 2 mounted on a 1in pad of 2 oz copper

b)

85°C/W when mounted on a minimum pad of 2 oz copper

Scale 1 : 1 on letter size paper 2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%

FDS7088N7 Rev C1 (W)

FDS7088N7

Typical Characteristics

80

VGS = 10V 4.5V

2.2

4.0V

RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE

3.5V

VGS = 3.5V
2 1.8 1.6 1.4 1.2 1 0.8 0 20 40 ID, DRAIN CURRENT (A) 60 80

ID, DRAIN CURRENT (A)

60

40

4.0V 4.5V 5.0V 6.0V 10V

20

3.0V

0 0 0.5 1 1 .5 VDS, DRAIN-SOURCE VOLTAGE (V)

Figure 1. On-Region Characteristics.

Figure 2. On-Resistance Variation with Drain Current and Gate Voltage.
0.01 RDS(ON), ON-RESISTANCE (OHM)

1.6 RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE ID = 23A VGS = 10V 1.4

ID = 11.5A 0.008

1.2

0.006

TA = 125oC

1

0.004 TA = 25oC 0.002

0.8

0.6 -50 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (oC)

0 2 4 6 8 10 VGS, GATE TO SOURCE VOLTAGE (V)

Figure 3. On-Resistance Variation with Temperature.
80 VDS = 5V ID, DRAIN CURRENT (A) 60

Figure 4. On-Resistance Variation with Gate-to-Source Voltage.
100
VGS = 0V

IS, REVERSE DRAIN CURRENT (A)

10
TA = 125oC

1 0.1 0.01 0.001 0.0001
25oC -55oC

40

TA =125oC 25oC

20 -55oC 0 2 2 .5 3 3 .5 4 VGS, GATE TO SOURCE VOLTAGE (V)

0

0.2

0.4

0.6

0.8

1

1.2

VSD, BODY DIODE FORWARD VOLTAGE (V)

Figure 5. Transfer Characteristics.

Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature.

FDS7088N7 Rev C1 (W)

FDS7088N7

Typical Characteristics

10 VGS, GATE-SOURCE VOLTAGE (V) ID = 23A 8 20V 6 VDS = 10V 15V

5000

f = 1MHz VG S = 0 V CISS

4000 CAPACITANCE (pF)

3000

4

2000 C O SS 1000 CRSS

2

0 0 20 40 Qg, GATE CHARGE (nC) 60 80

0 0 5 10 15 20 25 30 VDS, DRAIN TO SOURCE VOLTAGE (V)

Figure 7. Gate Charge Characteristics.
1000
P(pk), PEAK TRANSIENT POWER (W)

Figure 8. Capacitance Characteristics.
50

ID, DRAIN CURRENT (A)

100

RDS(ON) LIMIT 1ms 10ms 100ms 1s 10s DC

100µs

40

SINGLE PULSE RJA = 85°C/W TA = 25°C

10

30

1

0.1

VGS = 10V SINGLE PULSE RJA = 85oC/W TA = 25oC

20

10

0.01 0.01

0.1

1

10

100

0 0.01

0.1

1

10

100

1000

VDS, DRAIN-SOURCE VOLTAGE (V)

t1, TIME (sec)

Figure 9. Maximum Safe Operating Area.

Figure 10. Single Pulse Maximum Power Dissipation.

1.00
r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE D = 0.5 0.2

0.10

0.1 0.05 0.02

RJA(t) = r(t) * RJA RJA = 85 °C/W P(pk) t1 t2 TJ - TA = P * RJA(t) Duty Cycle, D = t1 / t2

0.01

0.01

SINGLE PULSE

0.00 0.0001

0.001

0.01

0.1
t1, TIME (sec)

1

10

100

1000

Figure 11. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 1b. Transient thermal response will change depending on the circuit board design.

FDS7088N7 Rev C1 (W)

FDS7088N7

Dimensional Outline and Pad Layout

FDS7088N7 Rev C1 (W)