|
Details, datasheet, quote on part number:FQA22P10
| |
| Part: | FQA22P10 |
| Category: | Discrete => Transistors => FETs (Field Effect Transistors) => MOSFETs => P-Channel |
| Description: | 100V P-channel QFET |
| Company: | Fairchild Semiconductor |
| Datasheet: | Download FQA22P10 datasheet File size : 653 kB |
| Request For quote: | Find where to buy FQA22P10
|
| |
Datasheet text preview:
FQA22P10
QFET
FQA22P10
100V P-Channel MOSFET
General Description
These P-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for low voltage applications such as audio amplifier, high efficiency switching DC/DC converters, and DC motor cont rol.
TM
Features
· · · · · · · -24A, -100V, RDS(on) = 0.125 @VGS = -10 V Low gate charge ( typical 40 nC) Low Crss ( typical 160 pF) Fast switching 100% avalanche tested Improved dv/dt capability 175°C maximum junction temperature rating
D
G
TO-3P
G DS
FQA Series
TC = 25°C unless otherwise noted
S
Absolute Maximum Ratings
Symbol VDSS ID IDM VGSS EAS IAR EAR dv/dt PD TJ, TSTG TL
Parameter Drain-Source Voltage - Continuous (TC = 25°C) Drain Current - Continuous (TC = 100°C) Drain Current - Pulsed
(Note 1)
FQA22P10 -100 - 24 - 17 - 96 ± 30
(Note 2) (Note 1) (Note 1) (Note 3)
Units V A A A V mJ A mJ V/ns W W/°C °C °C
Gate-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Power Dissipation (TC = 25°C)
710 - 24 15 -6. 0 150 1. 0 -55 to +175 300
- Derate above 25°C Operating and Storage Temperature Range Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds
Thermal Characteristics
Symbol RJ C RC S RJ A P arameter Thermal Resistance, Junction-to-Case Thermal Resistance, Case-to-Sink Thermal Resistance, Junction-to-Ambient Typ -0. 24 -M ax 1.0 -40 Units °C/W °C/W °C/W
©2002 Fairchild Semiconductor Corporation
Rev. C2, August 2002
FQA22P10
Electrical Characteristics
Symbol P a r a m e te r
TC = 25°C unless otherwise noted
Test Conditions
Min
Typ
M ax
U n i ts
Off Characteristics
BVDSS BVDSS / TJ IDSS IGSSF IGSSR Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage Current, Forward Gate-Body Leakage Current, Reverse VGS = 0 V, ID = -250 µA ID = -250 µA, Referenced to 25°C VDS = -100 V, VGS = 0 V VDS = -80 V, TC = 125°C VGS = -30 V, VDS = 0 V VGS = 30 V, VDS = 0 V -100 -------0.1 -------1 -10 -100 100 V V/°C µA µA nA nA
On Characteristics
VGS(th) RDS(on) gFS Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transconductance VDS = VGS, ID = -250 µA VGS = -10 V, ID = -12 A VDS = -40 V, ID = -12 A
(Note 4)
-2. 0 ---
-0.096 14
-4. 0 0.125 --
V S
Dynamic Characteristics
Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = -25 V, VGS = 0 V, f = 1.0 MHz ---1170 460 160 1500 600 200 pF pF pF
Switching Characteristics
td(on) tr td(off) tf Qg Qgs Qgd Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge VDS = -80 V, ID = -22 A, VGS = -10 V
(Note 4, 5)
VDD = -50 V, ID = -22 A, RG = 25
(Note 4, 5)
--------
17 170 60 110 40 7.0 21
45 350 130 230 50 ---
ns ns ns ns nC nC nC
Drain-Source Diode Characteristics and Maximum Ratings
IS ISM VSD trr Qrr Maximum Continuous Drain-Source Diode Forward Current Maximum Pulsed Drain-Source Diode Forward Current VGS = 0 V, IS = -24 A Drain-Source Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS = 0 V, IS = -22 A, dIF / dt = 100 A/µs
(Note 4)
------
---110 0.6
-2 4 -96 -4. 0 ---
A A V ns µC
Notes: 1. Repetitive Rating : Pulse width limited by maximum junction temperature 2. L = 1.85mH, IAS = -24A, VDD = -25V, RG = 25 , Starting TJ = 25°C 3. ISD -22A, di/dt 300A/µs, VDD BVDSS, Starting TJ = 25°C 4. Pulse Test : Pulse width 300µs, Duty cycle 2% 5. Essentially independent of operating temperature
©2002 Fairchild Semiconductor Corporation
Rev. C2, August 2002
FQA22P10
Typical Characteristics
-ID , Drain Current [A]
-ID, Drain Current [A]
10
1
VGS -15.0 V -10.0 V -8.0 V -7.0 V -6.0 V -5.5 V -5.0 V Bottom : -4.5 V Top :
10
1
175
10
0
25 -55
Notes : 1. VDS = -40V 2. 250 s Pulse Test
10
0
Notes : 1. 250 s Pulse Test 2. TC = 25
10
-1
10
0
10
1
10
-1
2
4
6
8
10
-VDS, Drain-Source Voltage [V]
-VGS , Gate-Source Voltage [V]
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
0.5
VGS = - 10V 0.3 VGS = - 20V 0.2
-I DR , Reverse Drain Current [A]
RDS(on) [], Drain-Source On-Resistance
0.4
10
1
10
0
175 25
Notes : 1. VGS = 0V 2. 250 s Pulse Test
0.1
Note : TJ = 25
0.0
0
10
20
30
40
50
60
70
80
90
100
10
-1
-ID , Drain Current [A]
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
-VSD , Source-Drain Voltage [V]
Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperature
3500 3000
Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd
12
Ciss
2500
10
VDS = -20V VDS = -50V
-V GS , Gate-Source Voltage [V]
Coss
Notes : 1. VGS = 0 V 2. f = 1 MHz
8
VDS = -80V
Capacitance [pF]
2000 1500 1000 500 0 -1 10
6
Crss
4
2
Note : ID = -22 A
0
10
0
10
1
0
10
20
30
40
50
-VDS, Drain-Source Voltage [V]
QG, Total Gate Charge [nC]
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
©2002 Fairchild Semiconductor Corporation
Rev. C2, August 2002
FQA22P10
Typical Characteristics
(Continued)
1.2
2.5
-BV DSS , (Norm lized) a Drain-Source Breakdown Voltage
2.0
RDS(ON) , (Normalized) Drain-Source On-Resistance
1.1
1.5
1.0
1.0
0.9
Notes : 1. VGS = 0 V 2. ID = -250 A
0.5
Notes : 1. VGS = -10 V 2. ID = -11 A
0.8 -100
-50
0
50
100
o
150
200
0.0 -100
-50
0
50
100
o
150
200
TJ, Junction Temperature [ C]
TJ, Junction Temperature [ C]
Figure 7. Breakdown Voltage Variation vs. Temperature
Figure 8. On-Resistance Variation vs. Temperature
25
Operation in This Area is Limited by R DS(on)
10
2
20
100 µs
-I D, Drain Current [A]
-I D, Drain Current [A]
1 ms 10 ms
10
1
15
DC
10
10
0
Notes : 1. TC = 25 C 2. TJ = 175 C 3. Single Pulse
o o
5
10
-1
10
0
10
1
10
2
0 25
50
75
100
125
150
175
-VDS, Drain-Source Voltage [V]
TC, Case Temperature []
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current vs. Case Temperature
(t), T h e rm a l R e s p o n s e
10
0
D = 0 .5 0 .2
10
-1
0 .1 0 .0 5 0 .0 2 0 .0 1 s in g le p u ls e
N o te s : 1 . Z JC( t ) = 1 . 0 /W M a x . 2 . D u ty F a c t o r , D = t1 /t2 3 . T JM - T C = P D M * Z JC(t)
P DM t1 t2
Z
JC
10
-2
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
t 1 , S q u a r e W a v e P u ls e D u r a t io n [ s e c ]
Figure 11. Transient Thermal Response Curve
©2002 Fairchild Semiconductor Corporation
Rev. C2, August 2002
FQA22P10
Gate Charge Test Circuit & Waveform
50K 12V 200nF 300nF
Same Type as DUT VDS
VGS -10V Qgs Qg
VGS
Qgd
DUT
-3mA
Charge
Resistive Switching Test Circuit & Waveforms
VDS RG VGS
RL VDD
td(on)
t on tr td(of f)
t off tf
VGS
10%
-10V
DUT VDS
90%
Unclamped Inductive Switching Test Circuit & Waveforms
L VDS ID RG -10V
tp
BVDSS 1 EAS = ---- L IAS2 -------------------2 BVDSS - VDD
tp
Time VDS (t)
V DD DUT
VDD ID (t) IAS BVDSS
©2002 Fairchild Semiconductor Corporation
Rev. C2, August 2002
|
|
