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Part: FQU7N10
Category:
Discrete
-> Transistors
-> FETs (Field Effect Transistors)
-> DMOS (Double-diffused MOS)
-> Enhancement N-Channel
Description: 100V N-channel QFET
Company: Fairchild Semiconductor
Datasheet: Download FQU7N10 datasheet File size : 203 kB
Request For quote: Find where to buy FQU7N10
Datasheet text preview:
FQD7N10 / FQU7N10
December 2000
FQD7N10 / FQU7N10
100V N-Channel MOSFET
General Description
These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology. This advanced technology is especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation modes. These devices are well suited for low voltage applications such as audio amplifiers, high efficiency switching DC/DC converters, and DC motor control.
QFET
Features
· · · · · · 5.8A, 100V, RDS(on) = 0.35 @VGS = 10 V Low gate charge ( typical 5.8 nC) Low Crss ( typical 10 pF) Fast switching 100% avalanche tested Improved dv/dt capability
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FQD Series
I-PAK
GDS
FQU Series
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Absolute Maximum Ratings
Symbol VDSS ID IDM VGSS EAS IAR EAR dv/dt PD
TC = 25°C unless otherwise noted
Parameter Drain-Source Voltage - Continuous (TC = 25°C) Drain Current - Continuous (TC = 100°C) Drain Current - Pulsed
(Note 1)
FQD7N10 / FQU7N10 100 5. 8 3.67 23.2 ± 25
(Note 2) (Note 1) (Note 1) (Note 3)
Units V A A A V mJ A mJ V/ns W W W/°C °C °C
Gate-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Power Dissipation (TA = 25°C) * Power Dissipation (TC = 25°C)
50 5. 8 2. 5 6. 0 2. 5 25 0. 2 -55 to +150 300
TJ, TSTG TL
- Derate above 25°C Operating and Storage Temperature Range Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds
Thermal Characteristics
Symbol RJ C RJ A RJ A P arameter Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient * Thermal Resistance, Junction-to-Ambient Typ ---M ax 5.0 50 110 Units °C/W °C/W °C/W
* When mounted on the minimum pad size recommended (PCB Mount)
©2000 Fairchild Semiconductor International Rev. A2, December 2000
FQD7N10 / FQU7N10
Electrical Characteristics
Symbol P a r a m e te r
TC = 25°C unless otherwise noted
Test Conditions
Min
Typ
Ma x
Units
Off Characteristics
BVDSS BVDSS / TJ IDSS IGSSF IGSSR Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage Current, Forward Gate-Body Leakage Current, Reverse VGS = 0 V, ID = 250 µA ID = 250 µA, Referenced to 25°C VDS = 100 V, VGS = 0 V VDS = 80 V, TC = 125°C VGS = 25 V, VDS = 0 V VGS = -25 V, VDS = 0 V 100 ------0. 1 ------1 10 100 -100 V V/°C µA µA nA nA
On Characteristics
VGS(th) RDS(on) gFS Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transconductance VDS = VGS, ID = 250 µA VGS = 10 V, ID = 2.9 A VDS = 40 V, ID = 2.9 A
(Note 4)
2.0 ---
-0.28 3. 3
4. 0 0.35 --
V S
Dynamic Characteristics
Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = 25 V, VGS = 0 V, f = 1.0 MHz ---190 60 10 250 75 13 pF pF pF
Switching Characteristics
td(on) tr td(off) tf Qg Qgs Qgd Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge VDS = 80 V, ID = 7.3 A, VGS = 10 V
(Note 4, 5)
VDD = 50 V, ID = 7.3 A, RG = 25
(Note 4, 5)
--------
7 24 13 19 5. 8 1. 4 2. 5
25 60 35 50 7. 5 ---
ns ns ns ns nC nC nC
Drain-Source Diode Characteristics and Maximum Ratings
IS ISM VSD trr Qrr Maximum Continuous Drain-Source Diode Forward Current Maximum Pulsed Drain-Source Diode Forward Current VGS = 0 V, IS = 5.8 A Drain-Source Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS = 0 V, IS = 7.3 A, dIF / dt = 100 A/µs
(Note 4)
------
---70 150
5. 8 23.2 1. 5 ---
A A V ns nC
Notes: 1. Repetitive Rating : Pulse width limited by maximum junction temperature 2. L = 2.23mH, IAS = 5.8A, VDD = 25V, RG = 25 , Starting TJ = 25°C 3. ISD 7.3A, di/dt 300A/µs, VDD BVDSS, Starting TJ = 25°C 4. Pulse Test : Pulse width 300µs, Duty cycle 2% 5. Essentially independent of operating temperature
©2000 Fairchild Semiconductor International
Rev. A2, December 2000
FQD7N10 / FQU7N10
Typical Characteristics
10
1
ID, Drain Current [A]
ID , Drain Current [A]
VGS 15.0 V 10.0 V 8.0 V 7.0 V 6.0 V 5.5 V 5.0 V Bottom : 4.5 V Top :
10
1
150 10
0
10
0
25 -55
Notes : 1. VDS = 40V 2. 250 Pulse Test s
Notes : 1. 250 Pulse Test s 2. TC = 25
10
-1
10
0
10
1
10
-1
2
4
6
8
10
VDS, Drain-Source Voltage [V]
VGS , Gate-Source Voltage [V]
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
1.4 1.2 1.0 VGS = 10V 0.8 0.6 0.4 0.2 0.0 VGS = 20V
1
IDR , Reverse Drain Current [A]
10
RDS(on) [], Drain-Source On-Resistance
10
0
150
25
Notes : 1. VGS = 0V 2. 250 Pulse Test s
Note : TJ = 25
0
3
6
9
12
15
18
10
-1
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
ID , Drain Current [A]
VSD , Source-Drain Voltage [V]
Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperature
500
Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd
12
400
10
VDS = 50V VDS = 80V
VGS, Gate-Source Voltage [V]
8
Capacitance [pF]
300
Ciss
200
Coss
Notes : 1. VGS = 0 V 2. f = 1 MHz
6
4
100
Crss
2
Note : ID = 7.3 A
0 -1 10
10
0
10
1
0
0
1
2
3
4
5
6
7
VDS, Drain-Source Voltage [V]
QG, Total Gate Charge [nC]
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
©2000 Fairchild Semiconductor International
Rev. A2, December 2000
Others parts begin by fq
FQ-1 FQ-2 FQ-3 FQ-4 FQ-5 FQ-6
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