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Part: FQU7P06
Category:
Discrete
-> Transistors
-> FETs (Field Effect Transistors)
-> DMOS (Double-diffused MOS)
-> Enhancement P-Channel
Description: 60V P-channel QFET
Company: Fairchild Semiconductor
Datasheet: Download FQU7P06 datasheet File size : 203 kB
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Datasheet text preview:
FQD7P06 / FQU7P06
May 2001
QFET
FQD7P06 / FQU7P06
60V P-Channel MOSFET
General Description
These P-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand a high energy pulse in the avalanche and commutation modes. These devices are well suited for low voltage applications such as automotive, DC/DC converters, and high efficiency switching for power management in portable and battery operated products.
TM
Features
· · · · · · -5.4A, -60V, RDS(on) = 0.45 @VGS = -10 V Low gate charge ( typical 6.3 nC) Low Crss ( typical 25 pF) Fast switching 100% avalanche tested Improved dv/dt capability
S D G!
!
G
S
D-PAK
FQD Series
I-PAK
GDS
FQU Series
!
D
Absolute Maximum Ratings
Symbol VDSS ID IDM VGSS EAS IAR EAR dv/dt PD
TC = 25°C unless otherwise noted
Parameter Drain-Source Voltage - Continuous (TC = 25°C) Drain Current - Continuous (TC = 100°C) Drain Current - Pulsed
(Note 1)
FQD7P06 / FQU7P06 - 60 -5. 4 -3.42 -21. 6 ± 25
(Note 2) (Note 1) (Note 1) (Note 3)
Units V A A A V mJ A mJ V/ns W W W/°C °C °C
Gate-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Power Dissipation (TA = 25°C) * Power Dissipation (TC = 25°C)
90 -5. 4 2. 8 -7. 0 2. 5 28 0.22 -55 to +150 300
TJ, TSTG TL
- Derate above 25°C Operating and Storage Temperature Range Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds
Thermal Characteristics
Symbol RJ C RJ A RJ A P arameter Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient * Thermal Resistance, Junction-to-Ambient Typ ---M ax 4.5 50 110 Units °C/W °C/W °C/W
* When mounted on the minimum pad size recommended (PCB Mount)
©2001 Fairchild Semiconductor Corporation R ev. A2. May 2001
FQD7P06 / FQU7P06
Elerical Characteristics
Symbol P a r a m e te r
TC = 25°C unless otherwise noted
Test Conditions
Min
Typ
M ax
Units
Off Characteristics
BVDSS BVDSS / TJ IDSS IGSSF IGSSR Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage Current, Forward Gate-Body Leakage Current, Reverse VGS = 0 V, ID = -250 µA ID = -250 µA, Referenced to 25°C VDS = -60 V, VGS = 0 V VDS = -48 V, TC = 125°C VGS = -25 V, VDS = 0 V VGS = 25 V, VDS = 0 V - 60 -------0 . 0 7 -------1 -10 -100 100 V V/°C µA µA nA nA
On Characteristics
VGS(th) RDS(on) gFS Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transconductance VDS = VGS, ID = -250 µA VGS = -10 V, ID = -2.7 A VDS = -30 V, ID = -2.7 A
(Note 4)
-2. 0 ---
-0. 36 3.8
-4. 0 0.451 --
V S
Dynamic Characteristics
Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = -25 V, VGS = 0 V, f = 1.0 MHz ---225 110 25 295 145 32 pF pF pF
Switching Characteristics
td(on) tr td(off) tf Qg Qgs Qgd Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge VDS = -48 V, ID = -7.0 A, VGS = -10 V
(Note 4, 5)
VDD = -30 V, ID = -3.5 A, RG = 25
(Note 4, 5)
--------
7 50 7.5 25 6.3 1.6 3.1
25 110 25 60 8.2 ---
ns ns ns ns nC nC nC
Drain-Source Diode Characteristics and Maximum Ratings
IS ISM VSD trr Qrr Maximum Continuous Drain-Source Diode Forward Current Maximum Pulsed Drain-Source Diode Forward Current VGS = 0 V, IS = -5.4 A Drain-Source Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS = 0 V, IS = -7.0 A, dIF / dt = 100 A/µs
(Note 4)
------
---77 0. 23
-5 . 4 -21.6 -4. 0 ---
A A V ns µC
Notes: 1. Repetitive Rating : Pulse width limited by maximum junction temperature 2. L = 3.6mH, IAS = -5.4A, VDD = -25V, RG = 25 , Starting TJ = 25°C 3. ISD -7.0A, di/dt 300A/µs, VDD BVDSS, Starting TJ = 25°C 4. Pulse Test : Pulse width 300µs, Duty cycle 2% 5. Essentially independent of operating temperature
©2001 Fairchild Semiconductor Corporation
R ev. A2. May 2001
FQD7P06 / FQU7P06
Typical Characteristics
10
1
-I D , Drain Current [A]
-I D, Drain Current [A]
VGS - 15.0 V - 10.0 V - 8.0 V - 7.0 V - 6.0 V - 5.5 V - 5.0 V Bottom : - 4.5 V Top :
10
1
10
0
150
10
0
25 -55
Notes : 1. VDS = -30V 2. 250 s Pulse Test
10
-1
Notes : 1. 250 s Pulse Test 2. TC = 25
-1 0 1
10
-1
10
10
10
2
4
6
8
10
-VDS, Drain-Source Voltage [V]
-VGS , Gate-Source Voltage [V]
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
1.4 1.2
10
1
RDS(on) [], Drain-Source On-Resistance
1.0 0.8 0.6 0.4 0.2 0.0
VGS = - 10V
VGS = - 20V
-I DR , Reverse Drain Current [A]
10
0
150
25
Note : TJ = 25
Notes : 1. VGS = 0V 2. 250 s Pulse Test
0
4
8
12
16
20
10
-1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
2.8
-ID , Drain Current [A]
-VSD , Source-Drain Voltage [V]
Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperature
600
Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd
12
500
10
VDS = -30V
400
Coss Ciss
Notes : 1. VGS = 0 V 2. f = 1 MHz
-V GS , Gate-Source Voltage [V]
8
VDS = -48V
Capacitance [pF]
300
6
200
4
Crss
100
2
Note : ID = -7.0 A
0 -1 10
10
0
10
1
0
0
1
2
3
4
5
6
7
VDS, Drain-Source Voltage [V]
QG, Total Gate Charge [nC]
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
©2001 Fairchild Semiconductor Corporation
R ev. A2. May 2001
Others parts begin by fq
FQ-1 FQ-2 FQ-3 FQ-4 FQ-5 FQ-6
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