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Part: MB84VA2102-10
Category: Memory -> Flash
Description: 16m ( X16 ) Flash Memory & 2m ( X 8 ) Static RAM
Company: Fujitsu Microelectronics, Inc.
Datasheet: Download MB84VA2102-10 datasheet File size : 413 kB
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Datasheet text preview:
FUJITSU SEMICONDUCTOR DATA SHEET
DS05-50104-2E
MCP (Multi-Chip Package) FLASH MEMORY & SRAM
CMOS
16M (×16) FLASH MEMORY & 2M (× 8) STATIC RAM
MB84VA2102-10/MB84VA2103-10
s FEATURES
· Power supply voltage of 2.7 to 3.6 V · High performance 100 ns maximum access time · Operating Temperature 20 to +85°C -- FLASH MEMORY · Minimum 100,000 write/erase cycles · Sector erase architecture One 8 K word, two 4 K words, one 16 K word, and thirty one 32 K words. Any combination of sectors can be concurrently erased. Also supports full chip erase. · Boot Code Sector Architecture MB84VA2102: Top sector MB84VA2103: Bottom sector · Embedded EraseTM Algorithms Automatically pre-programs and erases the chip or any sector · Embedded ProgramTM Algorithms Automatically writes and verifies data at specified address · Data Polling and Toggle Bit feature for detection of program or erase cycle completion · Ready-Busy output (RY/BY) Hardware method for detection of program or erase cycle completion · Automatic sleep mode When addresses remain stable, automatically switch themselves to low power mode. · Low VCC write inhibit 2.5 V · Erase Suspend/Resume Suspends the erase operation to allow a read in another sector within the same device Please refer to "MBM29LV160T/B" data sheet in detailed function -- SRAM · Power dissipation Operating : 35 mA max. Standby : 50 µA max. · Power down features using CE1s and CE2s · Data retention supply voltage: 2.0 V to 3.6 V
Embedded EraseTM and Embedded ProgramTM are trademarks of Advanced Micro Devices, Inc.
MB84VA2102-10/MB84VA2103-10
s BLOCK DIAGRAM
VCCf A0 to A19 A0 to A19 16 M bit Flash Memory VSS
RY/BY DQ8 to DQ15
RESET CEf
DQ0 to DQ7 VCCs A0 to A16 VSS
SA WE OE CE1s CE2s
2 M bit Static RAM
s EXAMPLE OF CONNECTION WITH CHIPSET
VCC
A[0:20]
A[1:20] A0
A[0:19] SA
VCCf RESET RY/BY
ROM_CS/ RAM_CS/ Battery Backup Control BATTERY BACKUP HWR/ LWR/ RD/ D[0:15] D[0:15] CHIPSET
C Ef C E 1s
VCCs CE2s
WE OE
DQ[0:15] MB84VA2102/3
2
MB84VA2102-10/MB84VA2103-10
s PIN ASSIGNMENTS
(Top View) A
6 5 4 3 2 1 CE1s A10 OE A11 A13 WE
B
VSS DQ5 DQ7 A8 A17 VCCs
C
DQ1 DQ2 DQ4 A5 SA* A16
D
A1 A0 DQ0 DQ8 CEf VSS
E
A2 A3 A6 DQ3 DQ10 DQ9
F
A4 A7 A18 DQ12 VCCf DQ11
G
CE2s RY/BY RESET A12 DQ6 DQ13
H
A9 A14 A15 A19 DQ15/A-1 DQ14
*: A17 for SRAM Table 1 Pin Configuration
Pin A0 to A16 A17 to A19 SA DQ0 to DQ7 DQ8 to DQ15 CEf CE1s CE2s OE WE RY/BY RESET N.C. VSS VCCf VCCs
F unction Address Inputs (Common) Address Input (Flash) Address Input (SRAM) Data Inputs/Outputs (Common) Data Inputs/Outputs (Flash) Chip Enable (Flash) Chip Enable (SRAM) Chip Enable (SRAM) Output Enable (Common) Write Enable (Common) Ready/Busy Outputs (Flash) Hardware Reset Pin/Sector Protection Unlock (Flash) No Internal Connection Device Ground (Common) Device Power Supply (Flash) Device Power Supply (SRAM)
Input/ Output I I I I/O I/O I I I I I O I -- Power Power Power
3
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