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Details, datasheet, quote on part number:GO1525
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Datasheet text preview:
+'/,1; TM,, GO1525
Vol t age Controlled Oscillator
DATA SHEET KE Y FEATURES · generates 1.485GHz or 1.485/1.001GHz signal for HD-LINXTMII ICs · low current consumption · 50 output impedance · operates from a single 2.5V supply · 8 pin tape on reel A P P LI C A T I O N S · VCO for the GS1560 and GS9060 Deserializers, and the GS1532 and GS9062 Serializers D E S C R I P TI O N The GO1525 is a self contained, miniature Voltage Controlled Oscillator (VCO). It produces a clean 1.485GHz reference clock signal for the GS1560 and GS9060 deserializers, and for the GS1532 and GS9062 serializers. The control voltage range is from 1.0 volts to 1.5 volts and is derived from the on-chip PLLs. The GO1525 frequency can be pulled approximately 32MHz for every one volt of control. The output level is typically -9.0dBm with low spurious and noise content. It is designed to drive 50 strip lines. The VCO requires a single 2.5V supply and draws a maximum of 15mA of current. It is packaged in a miniature 8-pin proprietary surface mount package and operates over the normal commercial temperature range of 0°C to +70°C.
GO1525
VCTR
VCC
STRIPLINE
STRIPLINE
OUT
OSCILLATOR CIRCUIT
GND
GO1525 GO 1525 FUNCTIONAL BLOCK DIAGRAM
Revision Date: February 2003 GENNUM CORPORATION P.O. Box 489, Stn. A, Burlington, Ontario, Canada L7R 3Y3 Tel. +1 (905) 632-2996 Fax. +1 (905) 632-5946 E-mail: info@gennum.com www.gennum.com
Document No. 21969 - 2
1. 1. PIN OUT
1.1 PIN ASSIGNMENT
NC
GND
O/P
3
2
1
GO1525
GND
4
GO1525 TOP VIEW
8
GND
5
6
7
VCTR
GND
VCC
NOTE: Pin numbers are arbitrary There are no pin markings on the device itself
1.2 PIN DESCRIPTIONS PIN NUMBER NAME TYPE DESCRIPTION
2, 4, 6, 8 5 7 1 3
GND VCTR VCC O/P NC
Power Input Power Output
Most negative power supply connections. Control voltage for the VCO. Most positive power supply connection. VCO signal output. No connection.
Note: Pin numbering different from GO1515
2. ELECTRICAL CHARACTERISTICS
VCC = 2.5V ±0.25V, Temperature = 0°C to 70°C, unless otherwise shown
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MA X
UNITS
NOTES
Supply Voltage Supply Current Control Voltage Range Control Voltage Sensitivity Operating Frequency Range
VCC
S
2.25 1.0 25 VCTR = 1.0V VCTR = 1.5V 1483. 5 -12 VCC = 2.5V ± 0.25V, ref: VCC = 2.5V VSWR = 2.0 for all phase, ref: 50 -
2.5 32 -9 1.5 1.0 50
2.75 15 1.5 39 1485. 0 -6 ±3 -10 -
V mA V MHz/V MHz MHz dBm MHz MHz MHz dBc
Supply Voltage Supply Current Control Voltage Range Control Voltage Sensitivity Operating Frequency Range
VCTR df/dV VCO
Output Signal Level Pushing Figure Pulling Figure Temperature Stability Spurious Response Output Impedance
VOUT
Output Signal Level Pushing Figure Pulling Figure Temperature Stability Spurious Response Output Impedance
TCOEF
0°C to 70°C, ref. = 25°C
ZO
-
2
GENNUM CORPORATION 21969 - 2
230 ± 5 200
TEMPERATURE (°C)
160
GO1525
140
30 sec
60 to 120 sec
60 sec
TIME (sec.)
Fig. 1 Reflow Solder Profile
3. SOLDERING RECOMMENDATIONS
VCO
3.1 Reflow Conditions
The device will meet the data sheet specifications after completing the reflow process according to the profile shown in Figure 1. Recommended soldering conditions are as follows: Preheating Soldering 150±10°C, 60 to 120 sec. Peak 230±5°C Over 200°C within 30 sec.
PCB
MAX 2mm
Fig. 2 PCB Warp
4. HANDLING RECOMMENDATIONS
4.1 Cleaning
Do not wash the devices.
4.2 Storage
3.2 Soldering Flux
Do not use cleaning type flux. Washing the devices after using cleaning type flux may damage inner parts and affect performance.
3.3 Solder Type
Store the devices out of direct sunlight, at a stable temperature and humidity. Avoid extreme temperatures, high humidity and wide temperature fluctuations. Condensation on the devices may result in reduced quality and lowered solderability. Avoid dust, sea breezes and corrosive gases (Cl2, NH3, SO2, NOX, etc.). Use within 6 months after delivery. If the devices are stored for more than one year, solderability may be degraded.
4.3 Transport
Use solder H60, H63 (in JIS Z 3282) or an equivalent type. This also applies to solder paste.
3.4 Rework or Repair
Rework or repair must only be done once. Do not reflow the device more than twice; once for initial soldering and once for remounting after rework. Do not vibrate the VCO during reflow soldering.
3.5 Endurance To Warp
Package the devices for transportation to avoid mechanical vibration or shock.
4.4 ESD Warning
When the device is soldered on a printed circuit board (dimension: 100mm x 100mm; thickness: 1.6mm) and the PCB is warped as shown in Figure 2, the device will not be cracked or damaged.
Avoid poor ground connections and electrostatic discharge or induction in production.
3
GENNUM CORPORATION 21969 - 2
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