|
|
Part: 88118AD
Category:
Description: Synchronous Burst SRAMs, 8Meg, 512K X 18,2.5 V And 3.3 V
Company: GSI Technology
Datasheet: Download 88118AD datasheet File size : 604 kB
Request For quote: Find where to buy 88118AD
Datasheet text preview:
Revision: 4/26/02
GS88118/32/36AD
Supplemental Datasheet Information
This supplemental information applies to the GS88118/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering (the 165-bump BGA--Package D), as well as an additional organization (x32, which is only offered in the 165-BGA for this part).
1/12 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Revision: 4/26/02
GS88118/32/36AD
Supplemental Datasheet Information
165 Bump BGA--x18 Commom I/O--Top View (Package D)
1 A B C D E F G H J K L M N P R NC NC NC NC NC NC NC FT DQB DQB DQB DQB DQPB NC LBO 2 A A NC DQB DQB DQB DQB MCL NC NC NC NC NC NC NC 3 E1 E2 VD D Q VD D Q VD D Q VD D Q VD D Q NC VD D Q VD D Q VD D Q VD D Q VD D Q A A 4 BB NC VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A A 5 NC BA VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC TDI TMS 6 E3 CK VS S VS S VS S VS S VS S VS S VS S VS S VS S VS S NC A1 A0 7 BW GW VS S VS S VS S VS S VS S VS S VS S VS S VS S VS S NC TDO TCK 8 ADSC G VS S VD D VD D VD D VD D VD D VD D VD D VD D VD D VS S A A 9 ADV ADSP VD D Q VD D Q VD D Q VD D Q VD D Q NC VD D Q VD D Q VD D Q VD D Q VD D Q A A 10 A A NC NC NC NC NC NC DQA DQA DQA DQA NC A A 11 A18 NC DQPA DQA DQA DQA DQA ZZ NC NC NC NC NC A17 A A B C D E F G H J K L M N P R
11 x 15 Bump BGA--13mm x 15 mm Body--1.0 mm Bump Pitch
2/12 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Revision: 4/26/02
GS88118/32/36AD
Supplemental Datasheet Information
165 Bump BGA--x32 Common I/O--Top View (Package D)
1 A B C D E F G H J K L M N P R NC NC NC DQC DQC DQC DQC FT DQD DQD DQD DQD NC NC LBO 2 A A NC DQC DQC DQC DQC MCL DQD DQD DQD DQD NC NC NC 3 E1 E2 VD D Q VD D Q VD D Q VD D Q VD D Q NC VD D Q VD D Q VD D Q VD D Q VD D Q A A 4 BC BD VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A A 5 BB BA VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC TDI TMS 6 E3 CK VS S VS S VS S VS S VS S VS S VS S VS S VS S VS S NC A1 A0 7 BW GW VS S VS S VS S VS S VS S VS S VS S VS S VS S VS S NC TDO TCK 8 ADSC G VS S VD D VD D VD D VD D VD D VD D VD D VD D VD D VS S A A 9 ADV ADSP VD D Q VD D Q VD D Q VD D Q VD D Q NC VD D Q VD D Q VD D Q VD D Q VD D Q A A 10 A A NC DQB DQB DQB DQB ZQ DQA DQA DQA DQA NC A A 11 NC NC NC DQB DQB DQB DQB ZZ DQA DQA DQA DQA NC A17 A A B C D E F G H J K L M N P R
11 x 15 Bump BGA--13mm x 15 mm Body--1.0 mm Bump Pitch
3/12 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Revision: 4/26/02
GS88118/32/36AD
Supplemental Datasheet Information
165 Bump BGA--x36 Common I/O--Top View (Package D)
1 A B C D E F G H J K L M N P R NC NC DQPC DQC DQC DQC DQC FT DQD DQD DQD DQD DQPD NC LBO 2 A A NC DQC DQC DQC DQC MCL DQD DQD DQD DQD NC NC NC 3 E1 E2 VD D Q VD D Q VD D Q VD D Q VD D Q NC VD D Q VD D Q VD D Q VD D Q VD D Q A A 4 BC BD VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A A 5 BB BA VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC TDI TMS 6 E3 CK VS S VS S VS S VS S VS S VS S VS S VS S VS S VS S NC A1 A0 7 BW GW VS S VS S VS S VS S VS S VS S VS S VS S VS S VS S NC TDO TCK 8 ADSC G VS S VD D VD D VD D VD D VD D VD D VD D VD D VD D VS S A A 9 ADV ADSP VD D Q VD D Q VD D Q VD D Q VD D Q NC VD D Q VD D Q VD D Q VD D Q VD D Q A A 10 A A NC DQB DQB DQB DQB NC DQA DQA DQA DQA NC A A 11 NC NC DQPB DQB DQB DQB DQB ZZ DQA DQA DQA DQA DQPA A17 A A B C D E F G H J K L M N P R
11 x 15 Bump BGA--13mm x 15 mm Body--1.0 mm Bump Pitch
4/12 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Revision: 4/26/02
GS88118/32/36AD
Supplemental Datasheet Information
GS88118/32/36AD 165-Bump BGA Pin Description
Pin Location
R6, P6 A2, A10, B2, B10, P3, P4, P8, P9, P10, R3, R4, R8, R9, R10, R11 P11 A11 N11, C11, C1, N1 J10, K10, L10, M10, J11, K11, L11, M11 G10, F10, E10, D10, G11, F11, E11, D11 G2, F2, E2, D2, G1, F1, E1, D1 J2, K2, L2, M2, J1, K1, L1, M1 B5, A5, A4, B4 M10, L10, K10, J10, G11, F11, E11, D11, C11 D2, E2, F2, G2, J1, K1, L1, M1, N1 B5, A4 N11, C11, C1, N1 A1, B1, B11, C2, C10, H3, H9, N5, N6, N7, N10, P1, P2, R2 A5, B4, C1, D1, D10, E1, E10, F1, F10, G1, G10, H10, J2, J11, K2, K11, L2, L11, M2, M11, N2, N11 A11 B6 A7 B7 A3 A6 B3 B8 A9 A8, B9 H11 H1
Symbol
A0, A1 An A 17 A 18 DQA9, DQB9, DQC9, DQD9 DQA1DQA8 DQB1DQB8
Type
I I
Description
Address field LSBs and Address Counter Preset Inputs Address Inputs Address Input
I I/O
Address Input (x18 Version) Data Input and Output pins (x36 Version)
I/O DQC1DQC8 DQD1DQD8 BA, BB, BC, BD DQA1DQA9 I/O DQC1DQC9 BA, BC NC NC NC NC CK BW GW E1 E3 E2 G ADV ADSC, ADSP ZZ FT I -- -- -- -- I I I I I I I I I I I I
Data Input and Output pins (x32/x36 Version)
Byte Write Enable for DQA, DQB, DQC, DQD I/Os; active low (x36 Version) Data Input and Output pins (x18 Version) Byte Write Enable for DQA, DQB I/Os; active low (x18 Version) No Connect (x32 Version) No Connect No Connect (x18 Version) No Connect (x36 Version) Clock Input Signal; active high Byte Write--Writes all enabled bytes; active low Global Write Enable--Writes all bytes; active low Chip Enable; active low Chip Enable; active low (x36 version) Chip Enable; active high (x36 version) Output Enable; active low Burst address counter advance enable; active l0w Address Strobe (Processor, Cache Controller); active low Sleep mode control; active high Flow Through or Pipeline mode; active low
5/12 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Others parts begin by 88
88-1
|
|
|
