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Details, datasheet, quote on part number:C7103
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Datasheet text preview:
IC Backside Polishing System
C7103
The C7103 is an IC backside polishing system for use when preparing a sample for backside emission analysis with the PHEMOS Series (emission microscope) or THEMOS Series (thermal emission monitoring system). It is compact, easy to operate with Windows 95, and applicable to several types of packaged ICs and wafers.
v Applicable to several types of packaged ICs v C7103 v Windows 95 Pentium Machine (optional)
Preparation Process of Backside Observation Sample and Emission Analysis
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Grind-off emission
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Mirror polish
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Lead frame Plastic mold Bias supply
Si substrate Observed pattern
Emission analysis from the backside of an IC with PHEMOS-200/C-CCD
Main Configuration
q Main unit q Spindle controller q Grinding utility
Diamond-end mill, ESM-end mill, super-hard-end mill, Electrodeposition diamond bar, grinding rubber
Main Specifications
Operating Range X-axis: 250 mm (9-13/16 inch) Y-axis: 150 mm (5-7/8 inch) Z-axis: 150 mm (5-7/8 inch) Software Resolution Interface Operating Temperature Operating Humidity Power Supply 0.01 mm/step (X Y Z) Parallel (Centronics) Serial (RS-232C) 5 to 40°C 20 % to 75 % 100 V/2.4 A*
q Polishing utility
Felt polishing disk, diamond compound, dilute solvent
q Control software q Computer (optional)
Windows 95 with Pentium processor
q 8-inch wafer chuck (optional) q Transformer (optional) q Vaccum clearner (optional)
* Optional transformer is necessary for use at 110/117/230AC votage
v 8-inch wafer chuck (optional)
Dimensional Outline/Weight
· Main unit (appox. 70 kg) · Spindle controller (appox. 9 kg)
660
220
860
600
125
393
ISO 9001/ISO 13485 EN 46001 Certificate: 09 105 79045
5 Windows is a trademark of Microsoft Corporation in the U.S.A. · Subject to local technical requirements and regulations, availability of products included in this promotional material may vary. Please consult with our sales office. · Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions. Specifications and external appearance are subject to change without notice. © 1999 Hamamatsu Photonics K.K.
Homepage Address http://www.hamamatsu.com
H A M A M A T S U PHOTONICS K.K., Systems Division 8 1 2 Joko-cho, Hamamatsu City, 431-3196, Japan, Telephone: (81)53-431-0124, Fax: (81)53-435-1574, E-mail:export@sys.hpk.co.jp
U.S.A. and Canada: Hamamatsu Photonic Systems: 360 Foothill Road, Bridgewater, N.J. 08807-0910, U.S.A., Telephone: (1)908-231-1116, Fax: (1)908-231-0852 Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49)8152-375-0, Fax: (49)8152-2658 France: Hamamatsu Photonics France S.A.R.L.: 8, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: (33)1 69 53 71 00, Fax: (33)1 69 53 71 10 United Kingdom: Hamamatsu Photonics UK Limited: Lough Point, 2 Gladbeck Way, Windmill Hill, Enfield, Middlesex EN2 7JA, United Kingdom, Telephone: (44)208-367-3560, Fax: (44)208-367-6384 North Europe: Hamamatsu Photonics Norden AB: Smidesvägen 12, SE-171-41 Solna, Sweden, Telephone: (46)8-509-031-00, Fax: (46)8-509-031-01 Italy: Hamamatsu Photonics Italia S.R.L.: Strada della Moia, 1/E 20020 Arese (Milano), Italy, Telephone: (39)02-935 81 733, Fax: (39)02-935 81 741
Cat. No. SSIS1022E02 JUL/99 CR Created in Japan (PDF)
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