Details, datasheet, quote on part number: TGF600M
PartTGF600M
CategoryThermal Management => Thermal Interface Products
TitleThermal Interface Products Thermal Gap Fill Pad
Description
CompanyFerriShield
DatasheetDownload TGF600M datasheet
Quote
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Specifications 
ManufacturerFerriShield
Product CategoryThermal Interface Products
RoHS Details
TypeThermal Gap Filler Pads
Length300 mm
Width200 mm
Thickness1 mm
ColorBrown

 

Features, Applications

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Thermal Gap Filler Pads are high heat transfer media which conform to surface irregularities and adhere to a wide range of shapes and sizes of components; in particular, recessed areas and protrusions. Where space between mating surfaces varies or is uneven, and where surface textures are normally a thermal transfer concern, the very pliable conformity of the pads is excellent for filling air gaps and minute variations. A widely recognized axiom of chemical engineering and stress analysis states that, for every 10C change in temperature, the reaction is a factor of 2; i.e., mean-time-to-failure of a device can be reduced by a factor of 2 for every 10C temperature rise. Four grades, each with a cost-effective formulation suitable for the thermal conductivity needed on a given application, accommodate most demanding situations. Convenient sheet configurations are suitable for die-cutting, or easy hand-slitting operations. As shown in the drawings to the right, even the most highly polished mating surfaces do not make reliable contact surfaces. Complete physical contact is necessary to minimize the resistance to heat flow for the best thermally conductive path. All such surface voids, when properly filled with a conformable, thermally conductive gap filler pad, will in most cases exhibit close to the continuous characteristics of a solid metal of the same dimensions.

Low Lessto Thermal impedance of semiconductor mounted substrate is appreciably increased at junction Thermal Impedance versus Surface Contact of porous surfaces due to a lack of surface-to-surface contact. High More

Thermal impedance of semiconductor mounted to substrate with gap filler pad is eliminated yielding higher temperature gradient.

Material Extractable Volatiles Continuous Use Temperature Flammability Thermal Conductivity
silicone compound content % cyclodimethyl siloxane UL94 V-0 (file to 6.00 W/m-K; 4 formulas

Part Number Description Color Thermal Conductivity Volume Resistivity Withstand Voltage Specific Gravity Hardness Elongation Compression

Unit visual W/m-K Mm KV/mmAC gr/cm2 Shore 00 % KgF sustain LxWxT

Mulberry Professional Plaza 426 Mulberry Street * Suite 300 Scranton, PA 18503 Tel: 570.961.5617 Fax: 570.969.6274 e-mail: info@ferrishield.com www.ferrishield.com


 

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