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Details, datasheet, quote on part number:FOA21002A2
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| Part: | FOA21002A2 |
| Category: | Communication => Fiber Optics |
| Description: | Semiconductor Solutions For High Speed Communi Cation And Fiber Optic Applications |
| Company: | Infineon Technologies Corporation |
| Datasheet: | Download FOA21002A2 datasheet File size : 183 kB |
| Request For quote: | Find where to buy FOA21002A2
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Datasheet text preview:
PRODUCT
Semiconductor Solutions for High Speed Communication and Fiber Optic Applications
T h e FOA21002A2 is the industry's first STM64/OC-192 Laser Diode Driver for SDH/SONET systems in Silicon Germ a n i u m technology. This new device is a key component for leading-edge high speed optical communication syst e m s for regional, metropolitan and backbone transport data networks at the highest speeds of up to 10.7 G b i t / s over one single fiber. It is a member of the complete 10 G b i t / s chipset in the Silicon Germanium technology with the industry's lowest power consumption.
BRIEF
Features
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Ty p i c a l Applications
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N o m i n a l data rate up to 10.7 G b i t / s S u i t a b l e for driving electroa b s o r p t i o n modulators (EAM) S u i t a b l e for direct modulat i o n of 50 or 25 matched laser diodes A d j u s t a b l e output current swing up to 60 mA (3 V across 50 ) P u l s e shape adjustment: duty cycle, output voltage undershoot F u l l y differential design L o w power consumption
FOA21002A2
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F i b e r optics telecom and datacom applications S O N E T / S D H OC-192/STM-64 w i t h and without FEC D r i v e r for EAM, laser diode modules, transmission lines T e s t and Measurement equipment: Clock driver, buffer
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M a i n Advantages
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D a t a rate up to 10.7 Gbit/s I n d u s t r y ' s lowest power consumption of typical 1.5 W (for full voltage swing of 3 V)
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S u i t a b l e for driving both 50 matched ElectroA b s o r p t i o n Modulators (EAM) as well as direct modul a t i o n of 50 or 25 matched laser diodes. (for single or diff e r e n t i a l transmission lines) A d j u s t a b l e output current swing up to 60 mA (3 V across 50 ) P u l s e shape adjustment: E y e symmetry, duty cycle, output voltage undershoot F u l l y differential design S u p p l y voltage of -5.2 V and +1.8 V S m a l l chip size of 1.415 x 1.045 mm (bare die)
Packing Type LDD Sales Code FOA21002A Package B a r e die
FOA21002A2
FOA21002A1 Laser Diode Driver L D D 9 .9 5 - 1 0 .7 G b i t / s , - 5 . 2 V
Never stop thinking.
PRODUCT
BRIEF
V CC
50 50
FOA21002A2
60 60
V CCQH V CCQL
QH QL
FOA21002A2 B l o c k Diagram
IH IL IOS1H IOS1L IMOD
V EE
ISS1 EF23 EF12 EF22 IOS2H IOS2L
+1.8 V 40 L* L*
A p p l i c a t i o n Example
50 QH QL
V CC
DataIN+ DataINOpen Open -5.2 V IH IL IOS1H IOS1L
IMOD
V CCQH
V CCQL
FOA21002A2
45 50 Laser Module
V EE
600
ISS1 160
EF23
EF12 Open
EF22 Open
Data Processing
MUX+CMU
FOA41001B1
L a s e r Driver
FOA21002A1
Laser1)
1 0 Gbit/s Chipset Overview
Framer/ Mapper FOAxxxx
O n e Chip Transceiver
FOA6100xB1
DEMUX+CDR
FOA51001B1
CDR
FOA31002B1 O p t i o n a l Serial CDR
TIA
FOA11002A2
PIN1)
How to reach us: http://www.infineon.com P u b l i s h e d by I n f i n e o n Technologies AG, S t . - M a r t i n - S t r a s s e 53, 8 1 5 4 1 München © Infineon Technologies AG 2002. All Rights Reserved.
A t t e n t i o n please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide.
Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Ordering No. B168-H7713-G1-X-7600 Printed in Germany PS 1201.5 NB
P u b l i s h e d by Infineon Technologies AG
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