|
Details, datasheet, quote on part number:PMB7850
| |
Datasheet text preview:
Product Brief
PMB 7850
E-GOLD+ V3 GSM/GPRS Single Chip Baseband IC
E - G O L D + V 3 i s a G S M / G P R S s i n g l e c h i p mixed signal
baseband IC. It combines the analog and digital functionality of a cellular radio together with 2 M b i t on-chip SRAM. It is designed in Infineon Technologies' proven 0.18 µ m 1.8 V technology. E-GOLD+ V3 perfectly meets the ever increasing demands of the GSM cellular subscriber market for low/mid-range devices with data-enabled terminals at low costs. D u e to its flexible interfaces E-GOLD+ V3 can be set up easily to control a wide variety of RF architectures. In combination with the Infineon Technologies' SMARTi RF solution a system approach is achieved, which results in an extremely compact implementation, very low power consumption and cost effective system performance.
Te ch n o l o g y
B a s e d on proven Infineon mixed signal 0.18 µ m technology 1 . 8 V - 3.3 V digital IOs 1 . 8 V internal operating voltage for digital parts 2.5 V internal operating voltage for analog parts P - L F B G A - 2 0 8 package, 1 2 x 1 2 mm, 0.65 mm ball pitch
Firmware
Applications
G S M / G P R S / H S C S D Mobile Phones and Data Modems
Key Features
C 1 6 6 S MCU core, 52 M H z O a k D S P Co r e ® , 78 M H z 2 Mbit on-chip SRAM G P R S cipher units GEA1, GEA2 I 2 C bus interface (eg. PMB 6810) I 2 S PCM digital audio Interface M u l t i m e d i a Card interface 2 n d SIM card interface R i n g e r support for PWM output to earpiece 2 IrDA compatible UARTs L o g i c port signal arranger G e n e r a l Purpose IOs A d v a n ce d dynamic power management E x t e r n a l memory interface to 1.8 V and 3 V devices P a g e Mode Flash interface J TA G IEEE 1149.1 Boundary scan and debug interface O C D S level 1 debug support
F R , HR, EFR, AMR G P R S class 12, CS 1-4 H S C S D class 10 E ch o cancellation N o i s e reduction Vo i c e memo support M P 3 decoding support P o l y p h o n i c Ringer support S p e e ch recognition support optional
Documentation/Development a n d S u p p o r t To o l s
P r o d u c t Overview Sp e ci f i ca t i o n A p p l i c a t i o n Note E v a l u a t i o n Board C D - R O M Support Package
Software
Complete software solution ranging from layer 1 up to MMI for GSM phase 2+ incl. HSCSD, GPRS and many additional features offered by Comneon Java
www.infineon.com/mobilesolutions
Mobile Solutions
Never
stop
thinking.
Product Brief
A p p l i c a t i o n E x a m p l e G S M / G P R S Te r m i n a l
Earpiece
A D
Speech and Channel Decoding Viterbi HW Accelerator
D
SMARTi DC+
A A
(PMB 6258) GSM850/900 I Automatic Offset Compensation GSM1800/1900
Equalizer
D
Ringer OakDSPCore®
D
GSM Cipher Unit Q
A A
Car Kit
A D
Speech and Channel Encoding
GMSK Modulator
D
E-GOLD+ V3
(PMB 7850) 1 4 7 * 2 5 8 0 3 6 9 # Realtime Clock GSM Timer Power Management
D A
CLK DAT ENA 26 MHz AFC
Control Logic
SAM Fast PLL
Interfaces I2C I2S
Rx/Tx GSM850/900 GSM1800/1900
2 Mbit SRAM
GPRS Cipher Unit
DAI MMC SSC
JTAG ASC IrDA RF Control
Power Amplifier
C166S
Infineon 16-Bit Core
Display
FLASH
E-POWER
(PMB 6810)
Heading to the Future
B a s e d on GPRS and HSCSD new exciti n g applications will create new opport u n i t i e s in mobile communications. Infineon Technologies' enables the customers to benefit from such a tremendous market opportunity. E - G O L D + V3 provides both, analog functions, like analog baseband filters, ADCs, DACs, and digital signal processing power. To provide the MCU/DSP capabilities, E-GOLD+ V3 makes use of a combinat i o n of Infineon's well proven and est a b l i s h e d C166 architecture and an OakDSPCore ® . It's E-GOLD+ V3 solution for the highly integrated baseband as a system-onch i p is a result of the corporation's successful initiative from a mere silicon vendor to a system solution provider. W i t h its system level know-how in the area of GSM, GPRS, EDGE, and UMTS Infineon Technologies leads the way in providing complete system solutions for wireless communication offering a complete semiconductor product range to cover all low- to high-end terminals. T h i s includes Baseband ICs, RF products, Power Management ICs, Power Amplifier, Bluetooth T M modules, GPS, and many more. I n f i n e o n Technologies system solutions are jointly developed with its system integration house, Danish Wireless Design A/S in Denmark and its wireless software development house Comneon, with its headquarter in Nuremberg, Germany.
N o t e : O a k DS P Co re ® is a registered trademark of ParthusCeva, Inc.
How to reach us: h t t p : / / w w w. i n f i n e o n .co m P u b l i s h e d by I n f i n e o n Technologies AG, S t . - M a r t i n -S t r a s s e 53, D - 8 1 6 6 9 München © Infineon Technologies AG 2004. All Rights Reserved.
A t t e n t i o n please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office.
Wa r n i n g s Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in lifesupport devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Template: pb_tmplt.fm/4/2004-01-01
Published by Infineon Technologies AG
Ordering No. B113-H7805-G3-X-7600 Printed in Germany PS 01042. NB
|
|
