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Details, datasheet, quote on part number:PMB9500
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Datasheet text preview:
Product Brief
3G Basestation Processor
3GPP/UMTS Physical Channel Processing
T h e 3 G b a s e s t a t i o n p r o c e s s o r is a single-chip, physical
channel processing solution for 3GPP/UMTS Macro, Micro and Pico cell Node B applications. It provides up to 64 customer programmable RAKE receivers and 364 downlink channel resources which may be individually controlled through a Virtual Machine interface. S u p e r i o r radio link performance can easily be attained with available firmware libraries or can be enhanced with customized implementations. T h e 3G basestation processor enables design of flexible, data-rate scalable Node B solutions embedding customer proprietary radio link, power control and measurement algorithms.
Software
Features
S u p p o r t s 3GPP release 99 and release 4 physical channel processing requirements D a t a - r a t e scalable channel elements across all spreading factors U p to 64 uplink channel elements supporting a variety of receiver structures P o o l of 384 fingers, configurable as 6-16 finger RAKE receivers 9 6 0 0 MOPS 16-bit embedded dataflow DSP array 9 6 multipath searchers 4 0 9 6 - t a p access channel preamble detection engine 3 8 4 downlink channel resources S u p p o r t s up to 12 uplink and downlink antenna ports
Obje c t- o r i e n te d ANSI-C application programming interface for runtime configuration, management and control V i r t u a l machine interface (VMI) E m b e d d e d firmware development tools for customer proprietary radio link, power control and measurement algorithms E m b e d d e d firmware library of 3GPP reference algorithms C h a n n e l estimation D e l a y e d - l o ck e d loop F r e q u e n c y - l o cke d loop R S C P estimation I S C P estimation U L and DL power control P i l o t BER measurement Tx code-power measurement P o w e r - d e l a y profile measurement
Ty p e 3 G Basestation Processor
S a l e s Code C B M E V1.1 PMB 9500
P a ck a g e P-EBGA-600
www.infineon.com/mobilesolutions
Wireless Communication
morphICs
I n f i n e o n Technologies Morphics Inc.
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Product Brief
Block Diagram of CBME V1.1 with Associated VMI
Layer 1 Control Processor
L1 Application Software
Virtual Machine Interface Library
CBME
CGU
PDE
Uplink
CGU
Downlink
Downlink Antenna
CGU
DSM
Searcher
Combiner
Tx
Tx
Finger 1
Finger 2
Finger 3
Finger N
Memory Mapped Peripheral 3G Basestation Processor 64
microDSP Array
Preamble Processing
Searcher Processing Finger Processing
Transmit Processing
Interleaved Symbols
From Antennas To Antennas
Soft Symbols
Features
D e v e l o p m e n t To o l s
C h a n n e l capacity maintained across: S p r e a d i n g factors Co m p r e s s e d - m o d e operation Ve r y low latency power control loop P o o l e d resources across antennas and sectors S u p p o r t s N-antenna Rx and Tx diversity H S D PA ready
V M I functional simulator m i c r o D S P development toolkit H a r d w a r e development platform
Ordering Information
P l e a s e contact Infineon Technologies Morphics, or your local Infineon sales office for additional information about our 3G basestation products
How to reach us: h t t p : / / w w w. i n f i n e o n .co m P u b l i s h e d by I n f i n e o n Technologies AG, S t . - M a r t i n -S t r a s s e 53, D - 8 1 6 6 9 München © Infineon Technologies AG 2004. All Rights Reserved.
A t t e n t i o n please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office.
Wa r n i n g s Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in lifesupport devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Template: pb_tmplt.fm/4/2004-01-01
Published by Infineon Technologies AG
Ordering No. B134-H8387-X-0-7600 Printed in Germany PS 0204.5 NB
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