|Category||Logic => Bus Interface => Bus Oriented Circuits|
|Title||Bus Oriented Circuits|
|Description||Fast CMOS 16-bit Bus Transceiver/ Register (3-state)|
|Company||Integrated Device Technology, Inc.|
|Datasheet||Download IDT54FCT16646ATPAB datasheet
0.5 MICRON CMOS Technology High-speed, low-power CMOS replacement for ABT functions Typical tSK(o) (Output Skew) < 250ps Low input and output leakage 1µA (max.) VCC ± 10% High drive outputs (-32mA IOH, 64mA IOL) Power off disable outputs permit "live insertion" Typical VOLP (Output Ground Bounce) 1.0V at VCC = 25°C Available in SSOP and TSSOP packages
The FCT16646T 16-bit registered transceiver is built using advanced dual metal CMOS technology. These high-speed, low-power devices are organized as two independent 8-bit bus transceivers with 3-state D-type registers. The control circuitry is organized for multiplexed transmission of data between A bus and B bus either directly or from the internal storage registers. Each 8-bit transceiver/register features direction control (xDIR), over-riding Output Enable control (xOE) and Select lines (xSAB and xSBA) to select either real-time data or stored data. Separate clock inputs are provided for A and B port registers. Data on the or B data bus, or both, can be stored in the internal registers by the low-to-high transitions at the appropriate clock pins. Flow-through organization of signal pins simplifies layout. All inputs are designed with hysteresis for improved noise margin. The FCT16646T is ideally suited for driving high-capacitance loads and low-impedance backplanes. The output buffers are designed with power off disable capability to allow "live insertion" of boards when used as backplane drivers.The IDT logo is a registered trademark of Integrated Device Technology, Inc.
Description Terminal Voltage with Respect to GND Storage Temperature DC Output Current
NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. All device terminals except FCT162XXX Output and I/O terminals. 3. Output and I/O terminals for FCT162XXX.
Symbol CIN COUT Parameter(1) Input Capacitance Output Capacitance Conditions VIN = 0V VOUT = 0V Typ. 3.5 Max. 6 8 Unit pFNOTE: 1. This parameter is measured at characterization but not tested.
Pin Names xAx xBx xCLKAB, xCLKBA xSAB, xSBA xDIR, xOE Description Data Register A Inputs Data Register B Outputs Data Register B Inputs Data Register A Outputs Clock Pulse Inputs Output Data Source Select Inputs Output Enable Inputs
Inputs xOE xDIR xCLKAB or L xCLKBA L X xSAB xSBA Input Output Input xAx Input Data I/O(2) xBx Input Isolation Store A and B Data Real Time B Data to A Bus Stored B Data to A Bus Real Time A Data to B Bus Stored A Data to B Bus Operation or Function
NOTES: H = HIGH Voltage Level L = LOW Voltage Level X = Don't Care Z = High-Impedance 2. The data output functions may be enabled or disabled by various signals at the xOE or xDIR inputs. Data input functions are always enabled, i.e. data at the bus pins will be stored on every LOW-to-HIGH transition on the clock inputs.
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